公开(公告)号：US20240057259A1

公开(公告)日：2024-02-15

申请号：US18384415

申请日：2023-10-27

Applicant: LG INNOTEK CO., LTD.

Inventor： Dae Sung YOO ,  Jun Young LIM

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/189 ,  H05K1/111 ,  H05K1/118 ,  H05K2201/10128 ,  H05K1/181 ,  H05K1/0393

Abstract: A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.

公开(公告)号：US20230282590A1

公开(公告)日：2023-09-07

申请号：US18197245

申请日：2023-05-15

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Hyung Kyu YOON ,  Sung Min CHAE

IPC: H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01L23/5387 ,  H01L23/49866 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/16227

Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.

公开(公告)号：US20220304146A1

公开(公告)日：2022-09-22

申请号：US17836405

申请日：2022-06-09

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON ,  Min Hwan KIM

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/14 ,  H05K3/28 ,  H05K3/18

Abstract: A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

公开(公告)号：US20180310404A1

公开(公告)日：2018-10-25

申请号：US15765308

申请日：2016-09-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON

IPC: H05K1/09 ,  H05K3/28 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/09 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/18 ,  H05K1/189 ,  H05K3/244 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0338 ,  H05K2201/10136

Abstract: An embodiment of the present invention relates to a flexible printed circuit board (FPCB), which is applied to various electronic display devices, and may provide the FPCB, including a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US20250044560A1

公开(公告)日：2025-02-06

申请号：US18719682

申请日：2022-12-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Chang Gyun SON ,  Jun Young LIM

IPC: G02B13/18 ,  B60R1/22 ,  B60R1/29 ,  G02B1/04 ,  G02B9/12 ,  G02B13/14 ,  G03B9/02

Abstract: The optical system disclosed in the embodiment includes first to third lenses disposed along an optical axis from an object side toward a sensor side, the optical system satisfies 40°≤FOV≤50°, an object-side surface and a sensor-side surface of the first lens are spherical, the first lens has a meniscus shape convex toward the object side, the first lens satisfies: 1.7≤nt_1≤2.3 and 0.15≤D_1/TTL≤0.3, TTL satisfies: ≤9 mm (nt_1 is the refractive index of the first lens, TTL is a distance in the optical axis from an object-side surface of the first lens to an image surface of the image sensor, D_1 is the thickness of the first lens at the optical axis, and FOV is the field of view of the optical system.).

公开(公告)号：US20250021784A1

公开(公告)日：2025-01-16

申请号：US18901921

申请日：2024-09-30

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Joon KIM ,  Jun Young LIM ,  Yong Hyun CHO

IPC: G06K19/077

Abstract: A smart IC substrate according to an embodiment includes: a substrate including one surface and the other surface; a circuit pattern and a connection circuit pattern disposed on the one surface; and a coil pattern disposed on the other surface, wherein a chip mounting region is formed on the other surface, the coil pattern is electrically connected to a first terminal and a second terminal, the substrate includes a first region disposed inside the coil pattern and a second region disposed outside the coil pattern, the first terminal is disposed in the first region, the second terminal is disposed in the second region, a first via is formed in the first region corresponding to the circuit pattern of the substrate, a second via is formed in the second region of the substrate, a third via is formed in the first region corresponding to the connection circuit pattern of the substrate, and a connection member is disposed inside the second via.

公开(公告)号：US20220076092A1

公开(公告)日：2022-03-10

申请号：US17447020

申请日：2021-09-07

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Joon KIM ,  Jun Young LIM ,  Yong Hyun CHO

IPC: G06K19/077

Abstract: A smart IC substrate according to an embodiment includes: a substrate including one surface and the other surface; a circuit pattern and a connection circuit pattern disposed on the one surface; and a coil pattern disposed on the other surface, wherein a chip mounting region is formed on the other surface, the coil pattern is electrically connected to a first terminal and a second terminal, the substrate includes a first region disposed inside the coil pattern and a second region disposed outside the coil pattern, the first terminal is disposed in the first region, the second terminal is disposed in the second region, a first via is formed in the first region corresponding to the circuit pattern of the substrate, a second via is formed in the second region of the substrate, a third via is formed in the first region corresponding to the connection circuit pattern of the substrate, and a connection member is disposed inside the second via.

公开(公告)号：US20220071005A1

公开(公告)日：2022-03-03

申请号：US17523421

申请日：2021-11-10

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON

IPC: H05K1/09 ,  H05K3/34 ,  H05K3/28 ,  H05K1/02 ,  H05K1/03

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US20230345632A1

公开(公告)日：2023-10-26

申请号：US18217958

申请日：2023-07-03

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Woong Sik Kim ,  Kyung Kyu Yoon

IPC: H05K1/09 ,  H05K3/34 ,  H05K1/18 ,  H05K3/28 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/09 ,  H05K3/3452 ,  H05K1/181 ,  H05K3/28 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/18 ,  H05K1/189 ,  H05K3/244

Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

公开(公告)号：US20230314911A1

公开(公告)日：2023-10-05

申请号：US18023463

申请日：2021-08-24

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Young LIM ,  Kyung Won KIM ,  Deok Ki HWANG

IPC: G03B17/12 ,  G02B7/02

CPC classification number: G03B17/12 ,  G02B7/028 ,  G02B7/021 ,  G03B30/00

Abstract: A camera module disclosed in an embodiment of the invention includes a plurality of lenses stacked from an object side toward an image side; and spacers respectively disposed on an outer circumference between adjacent lenses, wherein at least a first lens of the plurality of lenses includes a first region having an effective diameter having an object-side first surface and an upper-side second surface; and a flange portion disposed around the first region and having a third surface extending outwardly from the first surface and a fourth surface extending outwardly from the second surface, wherein the flange portion includes a plurality of first grooves concave from the third surface of the flange portion toward the fourth surface, and a plurality of second grooves concave from the fourth surface toward the third surface, and wherein each of the third and fourth surfaces of the flange portion may face the spacers.