公开(公告)号：US20240324102A1

公开(公告)日：2024-09-26

申请号：US18577077

申请日：2022-07-08

Applicant: LG INNOTEK CO., LTD.

Inventor： Byeong Kyun CHOI ,  Moo Seong KIM ,  Woo Seop SIM

IPC: H05K1/11 ,  H01L23/498 ,  H05K1/09 ,  H05K1/18

CPC classification number: H05K1/115 ,  H01L23/49822 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/09827

Abstract: A circuit board according to an embodiment includes an insulating layer, a first circuit pattern layer disposed on the insulating layer; a second circuit pattern layer disposed below the insulating layer; and a via passing through the insulating layer and connecting the first circuit pattern layer and the second circuit pattern layer, wherein the via has a first width at an upper surface and a second width less than the first width at a first region between the upper surface and a lower surface, wherein the first region is a region with a minimum width among all regions of the via, and wherein the second width satisfies a range of 70% to 99% of the first width.