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    Light emitting device package and light emitting apparatus having the same
    2.
    发明授权
    Light emitting device package and light emitting apparatus having the same 有权

    公开(公告)号：US10608153B2

    公开(公告)日：2020-03-31

    申请号：US15413549

    申请日：2017-01-24

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Sung Ho Kim

    IPC: H01L33/62 ,  H01L33/48 ,  H01L25/13 ,  H01L33/64

    Abstract: A light emitting device package is provided. The light emitting device package may include a body having first to sixth side surfaces and a cavity on the first side surface, first and second lead frames on a bottom of the cavity, and a light emitting chip on at least one of the first and second lead frames. The first and second lead frames may have first and second bonding portions on first and second outer side areas of the body and a first heat and second radiating portions bent from the first and second bonding portions. The first and second recesses may include an upper area inclined at a first angle and a lower areas inclined at a second angle from the upper area. The second angle may be smaller than the first angle, and the first and second heat radiating portions of the first and second lead frames may be provided on the lower areas.

    Lighting device
    5.
    发明授权
    Lighting device 有权
    照明设备

    公开(公告)号：US09039242B2

    公开(公告)日：2015-05-26

    申请号：US14285417

    申请日：2014-05-22

    Applicant: LG Innotek Co., Ltd.

    Inventor： Tae Young Choi ,  Won Jin Son ,  Dong Nyung Lim ,  Jung Ha Hwang ,  Seung Yeon Lee ,  Cheon Joo Kim ,  Sung Ho Kim

    IPC: F21V21/00 ,  F21S9/00 ,  F21V29/00 ,  F21K99/00 ,  F21V3/00 ,  F21V19/00 ,  F21V23/00 ,  F21Y101/02 ,  F21Y105/00 ,  F21Y113/00

    CPC classification number: F21V29/74 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V3/00 ,  F21V19/0055 ,  F21V23/005 ,  F21V23/006 ,  F21V29/773 ,  F21V29/89 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2113/00 ,  F21Y2113/13 ,  F21Y2115/10

    Abstract: A lighting device comprises: a heat sink which comprises one surface and a receiving recess; a light emitting module which is disposed on the one surface of the heat sink and comprises a substrate and a plurality of light sources disposed on the substrate, wherein the substrate has a first hole disposed at the center thereof and a second hole; a power controller which is electrically connected to the light emitting module through the second hole of the substrate and is disposed in the receiving recess of the heat sink, wherein the light emitting module comprises a first light emitting module comprising a first substrate and a first light source, and a second light emitting module comprising a second substrate and a second light source, wherein the first substrate and the second substrate are disposed adjacent to each other.

    Abstract translation: 照明装置包括：散热器，其包括一个表面和接收凹部; 发光模块，其设置在所述散热器的一个表面上，并且包括基板和设置在所述基板上的多个光源，其中，所述基板具有设置在所述散热板中心的第一孔和第二孔; 电源控制器，其通过所述基板的所述第二孔与所述发光模块电连接并且设置在所述散热器的所述接收凹部中，其中所述发光模块包括第一发光模块，所述第一发光模块包括第一基板和第一光 源和包括第二基板和第二光源的第二发光模块，其中所述第一基板和所述第二基板彼此相邻设置。

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