Light emitting device package and lighting system
    3.
    发明授权
    Light emitting device package and lighting system 有权
    发光装置封装和照明系统

    公开(公告)号:US08835969B2

    公开(公告)日:2014-09-16

    申请号:US14013882

    申请日:2013-08-29

    Inventor: Ji Won Jang

    Abstract: Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a body including a cavity and formed in a transmittive material; a plurality of lead electrodes in the cavity; an isolation member disposed between the lead electrodes; a light emitting device electrically connected to the lead electrodes in the cavity; and a molding member on the light emitting device.

    Abstract translation: 公开了一种发光器件封装和照明系统。 发光器件封装包括:主体,其包括空腔并形成在透光材料中; 空腔中的多个引线电极; 设置在所述引线电极之间的隔离构件; 电连接到空腔中的引线电极的发光器件; 以及在发光器件上的模制构件。

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