COMPOSITE SHEET FOR FORMING PROTECTIVE FILM
    1.
    发明申请
    COMPOSITE SHEET FOR FORMING PROTECTIVE FILM 审中-公开
    形成保护膜的复合片

    公开(公告)号:US20160046840A1

    公开(公告)日:2016-02-18

    申请号:US14778802

    申请日:2014-03-26

    Abstract: A protective film-forming composite sheet 10 comprises a pressure sensitive adhesive sheet 16 in which a pressure sensitive adhesive layer 12 is provided on a base material 11, a protective film-forming film 13, and a release film 14. When α (mN/25 mm) represents the maximum peel force between the protective film-forming film 13 and the release film 14; β (mN/25 mm) represents the minimum peel force between the pressure sensitive adhesive sheet 16 and the protective film-forming film 13; and γ (mN/25 mm) represents the maximum peel force between the pressure sensitive adhesive sheet 16 and the protective film-forming film 13, the following relationships (1) to (3) hold for α, β, and γ; β≧70  (1) α/β≦0.50  (2) γ≦2000  (3).

    Abstract translation: 保护膜形成复合片10包括在基材11上形成有压敏粘合剂层12的压敏粘合片16,保护膜形成膜13和剥离膜14.当α(mN / 25mm)表示保护膜形成膜13和剥离膜14之间的最大剥离力; &bgr (mN / 25mm)表示压敏粘合片16和保护膜形成膜13之间的最小剥离力; γ(mN / 25mm)表示压敏粘合片16与保护膜形成膜13之间的最大剥离力,关于(1)〜(3),α,&bgr,γ的关系成立。 &bgr;≥70(1)α/&bgr;≦̸ 0.50(2)γ≦̸ 2000(3)。

    PROTECTIVE FILM FORMING COMPOSITION, PROTECTIVE FILM FORMING SHEET, AND CHIP PROVIDED WITH PROTECTIVE FILM
    2.
    发明申请
    PROTECTIVE FILM FORMING COMPOSITION, PROTECTIVE FILM FORMING SHEET, AND CHIP PROVIDED WITH PROTECTIVE FILM 有权
    保护膜成型组合物,保护膜成型片和带保护膜的芯片

    公开(公告)号:US20160272839A1

    公开(公告)日:2016-09-22

    申请号:US15032515

    申请日:2014-11-10

    Abstract: A composition for protective film formation capable of forming a protective film excellent in attachability by a tape mounter or the like, with good visibility at a laser-printed portion and heat dissipation properties, allowing a protective film-equipped chip having high reliability to be manufactured, and a sheet for protective film formation and a protective film-equipped chip are provided. The composition for protective film formation contains a polymer component (A), a curable component (B), and a heat conductive filler (C) having an average particle size of 2.0 to 10.0 μm. The content of components that are liquid at 25° C. contained in the composition for protective film formation is 20 to 70 parts by mass relative to 100 parts by mass of the total of the (A) component and the (B) component. The content of the (C) component is 40 to 65 volume % relative to the total amount of the composition for protective film formation.

    Abstract translation: 一种用于保护膜形成的组合物,其能够通过带式安装机等形成具有优异的附着性的保护膜,在激光打印部分具有良好的可见性和散热性能,允许制造具有高可靠性的保护膜芯片 ,并且提供了用于保护膜形成的片材和装有保护膜的芯片。 保护膜形成用组合物含有平均粒径为2.0〜10.0μm的聚合物成分(A),固化性成分(B)和导热性填充剂(C)。 在保护膜形成用组合物中含有的25℃下液体成分的含量相对于(A)成分和(B)成分的总计100质量份为20〜70质量份。 相对于保护膜形成用组合物的总量,(C)成分的含量为40〜65体积%。

Patent Agency Ranking