BASE FILM FOR DICING SHEET, DICING SHEET COMPRESING BASE FILM, AND METHOD OF MANUFACTURING BASE FILM
    1.
    发明申请
    BASE FILM FOR DICING SHEET, DICING SHEET COMPRESING BASE FILM, AND METHOD OF MANUFACTURING BASE FILM 审中-公开
    印刷电路板基片,压片基片及其制造方法

    公开(公告)号:US20170036431A1

    公开(公告)日:2017-02-09

    申请号:US15125624

    申请日:2015-03-11

    Abstract: Base film for a dicing sheet comprises a cutting-fragment suppression layer and an expandable layer laminated on one main surface of the cutting-fragment suppression layer. The expandable layer comprises at least one resin-based unit layer. The at least one resin-based unit layer includes a resin-based unit layer that is disposed nearest to the cutting-fragment suppression layer. The resin-based unit layer comprises a linear polyethylene, polypropylene, and thermoplastic elastomer. The cutting-fragment suppression layer comprises a ring-containing resin that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin that is an olefin-based thermoplastic resin other than the ring-containing resin. The base film for such a dicing sheet is excellent in the expandability and recoverability.

    Abstract translation: 用于切割片的基底膜包括层压在切割片段抑制层的一个主表面上的切割片段抑制层和可扩展层。 可膨胀层包括至少一个基于树脂的单元层。 至少一个基于树脂的单元层包括最靠近切割片断抑制层设置的基于树脂的单元层。 树脂基单元层包含线性聚乙烯,聚丙烯和热塑性弹性体。 切割片抑制层包括含有环氧树脂,其为具有至少一种芳族系列基环和脂族系列基环的热塑性树脂和作为烯烃类热塑性塑料的非环状烯烃类树脂 除含环树脂以外的树脂。 用于这种切割片的基膜具有优异的可扩展性和可恢复性。

Patent Agency Ranking