公开(公告)号：US20210078080A1

公开(公告)日：2021-03-18

申请号：US16970484

申请日：2019-02-08

Applicant: LINTEC CORPORATION

Inventor： Takeshi MORI ,  Isao ICHIKAWA ,  Hidekazu NAKAYAMA

IPC: B22F7/04 ,  B22F5/00 ,  B22F1/00

Abstract: A film-shaped firing material (1) is provided, including first metal particles (10), second metal particles (20), and a binder component (30), in which the average particle diameter of the first metal particles (10) is 100 nm or less, and the maximum particle diameter thereof is 250 nm or less, the average particle diameter of the second metal particles (20) is in a range of 1000 to 7000 nm, the minimum particle diameter thereof is greater than 250 nm, and the maximum particle diameter thereof is 10000 nm or less, and the mass ratio of the first metal particles to the second metal particles is 0.1 or greater.

公开(公告)号：US20230076863A1

公开(公告)日：2023-03-09

申请号：US17794700

申请日：2020-12-21

Applicant: LINTEC CORPORATION

Inventor： Shuhei KUBO ,  Takeshi MORI ,  Takeshi ANSAI

IPC: C09J7/38 ,  C09J11/04 ,  C09J11/06 ,  C09J133/08 ,  C09J133/10 ,  C08F220/06 ,  C08F220/18 ,  C08K3/30 ,  C08K3/22 ,  C08K3/36

Abstract: A pressure sensitive adhesive composition containing: a (meth)acrylic ester polymer including butyl methacrylate and a reactive functional group-containing monomer as monomer units that constitute the polymer; and an inorganic filler, a pressure sensitive adhesive obtained by crosslinking the pressure sensitive adhesive composition, and a pressure sensitive adhesive sheet comprising at least a pressure sensitive adhesive layer that is formed from the above pressure sensitive adhesive composition. The above pressure sensitive adhesive composition allows the inorganic filler to be uniformly dispersed in a short time even when a dispersant is not contained. Moreover, in the above pressure sensitive adhesive and the pressure sensitive adhesive layer of the pressure sensitive adhesive sheet, the inorganic filler is uniformly dispersed.

公开(公告)号：US20200273596A1

公开(公告)日：2020-08-27

申请号：US16650225

申请日：2018-09-28

Applicant: LINTEC Corporation

Inventor： Takeshi MORI ,  Hidekazu NAKAYAMA ,  Isao ICHIKAWA ,  Yukiharu NOSE

IPC: H01B1/22 ,  H01L21/52

Abstract: The present invention provides a film-shaped firing composition with excellent printability, a method of producing a film-shaped firing material obtained by using the firing material composition, and a method of producing a film-shaped firing material with a support sheet. A paste-like firing material composition is provided, including sinterable metal particles (10), a binder component (20), and a solvent having a relative evaporation rate of 4.0 or less with respect to butyl acetate, in which a content of the solvent is in a range of 12% to 50% by mass with respect to a total mass of the firing material composition.