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公开(公告)号：US20220293554A1
公开(公告)日：2022-09-15
申请号：US17636211
申请日：2020-08-20
Applicant: LINTEC CORPORATION
Inventor： Isao ICHIKAWA , Hidekazu NAKAYAMA , Yosuke SATO
Abstract: A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying a back surface side of the semiconductor chip to the film-form firing material on the support sheet to face each other; peeling off the film-form firing material and the semiconductor chip from the support sheet; applying, to a substrate, a film-form firing material side of the semiconductor chip to which the film-form firing material has been applied; and heating the film-form firing material to 200° C. or higher to sinter-bond the semiconductor chip and the substrate.
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公开(公告)号：US20220293555A1
公开(公告)日：2022-09-15
申请号：US17636309
申请日：2020-08-20
Applicant: LINTEC CORPORATION
Inventor： Isao ICHIKAWA , Hidekazu NAKAYAMA , Yosuke SATO
Abstract: A method of manufacturing a laminate, the method including: providing a film-form firing material on a support sheet, the film-form firing material containing a sinterable metal particle and a binder component and having an identical or substantially identical shape and an identical size to a shape and size of a semiconductor chip; applying, to a substrate, the film-form firing material on the support sheet; peeling off the support sheet from the substrate and the film-form firing material; applying a back surface side of the semiconductor chip to the film-form firing material on the substrate to face each other; and sinter-bonding the semiconductor chip and the substrate by heating the film-form firing material to 200° C. or higher.
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公开(公告)号：US20130133938A1
公开(公告)日：2013-05-30
申请号：US13665972
申请日：2012-11-01
Applicant: LINTEC Corporation
Inventor： Yosuke SATO , Michio KANAI , Hayato NAKANISHI
IPC: H01L21/683 , H05K1/02 , H05K1/11 , H01L21/78
CPC classification number: H01L21/6836 , H01L21/78 , H01L2221/68327 , H01L2221/68336 , H01L2221/68381 , H05K1/02 , H05K1/115 , Y10T428/24942
Abstract: A dicing sheet includes a base, an intermediate layer on one face of the base, and an pressure sensitive adhesive layer provided on the intermediate layer and having the thickness of 8 to 30 μm. The pressure sensitive adhesive layer includes a compound having an energy ray curable double bond in a molecule, and a storage elasticity G′ at 23° C. of the pressure sensitive adhesive layer before curing is larger than 4 times of a storage elasticity at 23° C. of the intermediate layer. When the dicing sheet is laminated via the adhesive sheet on a wafer formed with a cylinder shape electrodes having a height of 15 μm and a diameter of 15 μm at a pitch of 40 μm having 3 rows 3 columns in equal spacing, at a center of the electrode of the cylinder shape electrodes formed in 3 rows 3 columns, the pressure sensitive adhesive layer does not contact at a part of a height of 7.5 μm or less of the electrode.
Abstract translation: 切割片包括基部，基部的一个面上的中间层和设置在中间层上并具有8至30μm厚度的压敏粘合剂层。 压敏粘合剂层包括分子中具有能量射线固化性双键的化合物，固化前的压敏粘合剂层的23℃下的储存弹性G'大于23℃时的储存弹性的4倍 C.中间层C. 当切割片通过粘合片层叠在形成有具有15μm的高度的圆柱形电极和15μm的直径为15μm的圆柱形电极的晶片上，其间隔为3行3列时，间隔为3行3列，在 圆柱形电极的电极形成为3列3列，该压敏粘合剂层在电极的高度为7.5μm或更小的部分处不接触。
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公开(公告)号：US20230018086A1
公开(公告)日：2023-01-19
申请号：US17777926
申请日：2020-11-20
Applicant: LINTEC Corporation
Inventor： Hidekazu NAKAYAMA , Isao ICHIKAWA , Yosuke SATO
Abstract: The present invention relates to a film-shaped firing material (1) which contains: sinterable metal particles (10); a binder component (20) that is a solid at room temperature; and a liquid component (30) that is a liquid at room temperature, the liquid component having a boiling point from 300 to 450° C.
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