公开(公告)号：US20190218430A1

公开(公告)日：2019-07-18

申请号：US16331117

申请日：2017-09-07

Applicant: LINTEC CORPORATION

Inventor： Kenta NISHIJIMA ,  Tatsuki HASEGAWA

IPC: C09J123/26 ,  C09J163/00 ,  C09J7/30

CPC classification number: C09J123/26 ,  B32B27/00 ,  B32B27/32 ,  B32B27/38 ,  C09J7/00 ,  C09J7/30 ,  C09J11/06 ,  C09J11/08 ,  C09J163/00 ,  C09J2203/318 ,  C09J2203/322 ,  C09J2423/00 ,  C09J2463/00 ,  G02F1/1339 ,  H01L31/048 ,  H01L51/50 ,  H01L51/5253 ,  H05B33/04 ,  Y02E10/50

Abstract: Provided is an adhesive composition containing the following components (A) and (B), wherein as a result of measuring a storage elastic modulus of a solid content, a storage elastic modulus at 23° C. is 0.1 to 600 MPa, and a storage elastic modulus at 80° C. is 0.1 MPa or lower: Component (A): modified polyolefin-based resin Component (B): polyfunctional epoxy compound. Also provided are: a sealing sheet having an adhesive layer formed using the adhesive composition, and a sealed body comprising a seal object that is sealed with the sealing sheet. An aspect of the present invention provides an adhesive composition which is easy to form into a sheet and excellent in unevenness followability, a sealing sheet having an adhesive layer which is formed of this adhesive composition and excellent in unevenness followability, and a sealed body having a seal object sealed with the sealing sheet.

公开(公告)号：US20240163977A1

公开(公告)日：2024-05-16

申请号：US18283692

申请日：2022-03-04

Applicant: LINTEC Corporation

Inventor： Tatsuki HASEGAWA ,  Masaharu ITO ,  Takashi MORIOKA

IPC: H05B3/28

CPC classification number: H05B3/286 ,  H05B2203/003

Abstract: A wiring sheet for three-dimensional molding includes a pseudo-sheet structure including a plurality of conductive linear bodies arranged at an interval; a first embedding layer; and a second embedding layer, the pseudo-sheet structure being sandwiched between the first embedding layer and the second embedding layer. The conductive linear bodies have a wave shape when viewed from above. A storage shear modulus at 23° C. of each of the first embedding layer and the second embedding layer is from 1×104 to 3×106 Pa. When a thickness of the first embedding layer is T1, a thickness of the second embedding layer is T2, and a thickness of the pseudo-sheet structure is T3, a specific relational equation is satisfied.

公开(公告)号：US20230337331A1

公开(公告)日：2023-10-19

申请号：US18028976

申请日：2021-09-29

Applicant: LINTEC Corporation

Inventor： Tatsuki HASEGAWA ,  Kenta NISHIJIMA ,  Takashi MORIOKA

IPC: H05B3/14 ,  H05B3/26

CPC classification number: H05B3/146 ,  H05B3/267

Abstract: Provided are a conductive structure having low contact resistance, the conductive structure including a cured layer formed by curing a curable composition, a conductive linear body fixed by the cured layer, and a pair of electrodes placed so as to directly contact the conductive linear body, wherein the curable composition contains a cationic polymerizable compound and a photocationic polymerization initiator, and the cured layer fixes the electrodes; a manufacturing method for the conductive structure; and article including the conductive structure; and a manufacturing method for the article.

公开(公告)号：US20180346763A1

公开(公告)日：2018-12-06

申请号：US15778925

申请日：2016-11-24

Applicant: LINTEC Corporation

Inventor： Kenta NISHIJIMA ,  Tatsuki HASEGAWA

IPC: C09J7/38 ,  C09J7/40 ,  C09J7/20 ,  H01L51/52 ,  H01L51/00 ,  C09J123/26

CPC classification number: C09J7/00 ,  C09J123/26 ,  H01L51/50 ,  H05B33/04 ,  Y02E10/549

Abstract: The invention is an adhesive composition comprising a modified polyolefin-based resin in an amount of 45 mass % or more based on a total solid content of the adhesive composition and satisfying the specific following equation (I): α1/β1≥0.20  (I) [α1 represents a 180° peel adhesion strength (N/25 mm) as measured using the following measurement sample (A) under an environment at 85° C. in accordance with JIS Z0237: 2009, and β1 represents a water vapor permeability (g·m−2·day−1) as measured using the following measurement sample (B) under a condition at 40° C. and a relative humidity of 90%].One aspect of the invention provides an adhesive composition capable of obtaining a sealant excellent in sealing performance, a sealing sheet having an adhesive layer made by using the adhesive composition, and a sealed body obtained by sealing a seal subject with the sealing sheet.

公开(公告)号：US20180334594A1

公开(公告)日：2018-11-22

申请号：US15778746

申请日：2016-11-24

Applicant: LINTEC CORPORATION

Inventor： Kenta NISHIJIMA ,  Tatsuki HASEGAWA

IPC: C09J7/35 ,  C09J7/40 ,  H01L31/048 ,  H01L51/52

CPC classification number: C09J7/35 ,  C09J7/00 ,  C09J7/20 ,  C09J7/40 ,  C09J11/06 ,  C09J123/26 ,  C09J163/00 ,  C09J2203/326 ,  C09J2423/00 ,  H01L31/0481 ,  H01L51/50 ,  H01L51/5253 ,  H05B33/04

Abstract: The invention is an adhesive composition comprising the following components (A), (B) and (C): Component (A): modified polyolefin-based resin, Component (B): polyfunctional epoxy compound, and Component (C): imidazole-based curing catalyst, and a sealing sheet composed of two release films and an adhesive layer sandwiched between the release films, wherein the adhesive layer is made by using the adhesive composition according to claim 1 and has thermosetting property, and a sealed body obtained by sealing a seal subject with the sealing sheet. One aspect of the invention provides an adhesive composition excellent in adhesion strength, a sealing sheet made by using the adhesive composition and having an adhesive layer excellent in sealing performance, and a sealed body obtained by sealing a seal subject with the sealing sheet.