公开(公告)号：US20240258247A1

公开(公告)日：2024-08-01

申请号：US18428322

申请日：2024-01-31

Applicant: LX SEMICON CO., LTD.

Inventor： Seung Hoon JIN ,  Min Ho JEON

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/18 ,  H10K59/95

CPC classification number: H01L23/562 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/18 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H10K59/95

Abstract: Disclosed is a chip-on-film package capable of preventing damage to a surface thereof. The chip-on-film package includes a flexible base film, a first metal wiring layer formed on a first surface of the base film, a first surface insulating layer formed on the first metal wiring layer, a semiconductor chip connected to the first metal wiring layer through an opening formed in the first surface insulating layer, and a spacer formed on the first surface insulating layer within a target area, which is an area within which the first surface insulating layer and a structure of a display panel contact each other. At least one groove is formed in the first surface insulating layer within the target area, and the spacer includes a first spacer filled in the groove.

公开(公告)号：US20240079418A1

公开(公告)日：2024-03-07

申请号：US18461188

申请日：2023-09-05

Applicant: LX SEMICON CO., LTD.

Inventor： Min Ho JEON ,  Dam HA

IPC: H01L27/12

CPC classification number: H01L27/1244

Abstract: Disclosed herein is a chip on film package including a base film, output wiring disposed on the base film and extending along a first direction, an insulation layer overlapping at least a portion of the output wiring, an output pad portion defined as a region in which the output wiring is exposed without the insulation layer, a semiconductor chip mounted on the base film and electrically connected to the output wiring, and a protective layer disposed between the semiconductor chip and the output pad portion with respect to the first direction.