公开(公告)号：US20220376322A1

公开(公告)日：2022-11-24

申请号：US17882328

申请日：2022-08-05

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  John SONG

IPC: H01M10/653 ,  C04B14/06 ,  H05K9/00 ,  H01M50/116 ,  H01M50/124

Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.

公开(公告)号：US20180295713A1

公开(公告)日：2018-10-11

申请号：US16003626

申请日：2018-06-08

Applicant: Laird Technologies, Inc.

Inventor： John SONG ,  George William RHYNE

IPC: H05K1/02 ,  H05K9/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/0216 ,  H05K1/0296 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0024 ,  H05K2201/0183 ,  H05K2201/0715 ,  H05K2201/0999 ,  H05K2201/10371

Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive material is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

公开(公告)号：US20200287253A1

公开(公告)日：2020-09-10

申请号：US16811684

申请日：2020-03-06

Applicant: Laird Technologies, Inc.

Inventor： Jason L. STRADER ,  John SONG

IPC: H01M10/653 ,  H01M2/02 ,  H05K9/00 ,  C04B14/06

Abstract: Disclosed are exemplary embodiments of thermal management and/or electromagnetic interference (EMI) mitigation materials including coated fillers (e.g., coated thermally-conductive, electrically-conductive, dielectric absorbing, and/or electromagnetic wave absorbing particles, sand particles coated with a binder, other coated functional fillers, combinations thereof, etc.). For example, a thermal management and/or EMI mitigation material may comprise a thermal interface material (TIM) including one or more coated fillers (e.g., coated thermally-conductive particles, sand particles coated with a binder, etc.), whereby the TIM is suitable for providing a thermal management solution for one or more batteries and/or battery packs (e.g., a battery pack for electric vehicle, etc.), or other device(s), etc.