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1.
公开(公告)号:US5965273A
公开(公告)日:1999-10-12
申请号:US792333
申请日:1997-01-31
IPC分类号: B32B15/08 , C08K3/00 , C08L45/00 , C08L81/02 , H01B3/00 , H01B3/30 , H01B3/44 , H05K1/02 , H05K1/03 , H05K1/16 , B32B3/00
CPC分类号: H05K1/0373 , B32B15/08 , H01B3/301 , H05K1/0228 , H05K1/024 , H05K1/162 , H05K2201/0129 , H05K2201/015 , H05K2201/0209 , Y10S428/901 , Y10T428/25 , Y10T428/252 , Y10T428/256 , Y10T428/31678 , Y10T428/31692 , Y10T428/31855
摘要: A polymeric composition which has a dielectric constant K' greater than 4 at 20.degree. C. which varies little with temperature is made from a polymer or mixture of polymers and a ceramic or a mixture of ceramics, where the polymer or mixture of polymers has a dielectric constant K' in the range of about 1.5 to about 3.5 and a temperature coefficient of dielectric constant TCK' that is negative and is between 0 and about -300 ppm/degree C.; and the ceramic includes a first ceramic, which may be one ceramic or a mixture of ceramics, each having a dielectric constant in the range of about 15 to about 200 and a TCK' that is positive and is between zero and about 3000 ppm/degree C.; and an optional second ceramic, which may be one ceramic or a mixture of ceramics, each having a dielectric constant in the range from about 3 up to about 15 and a TCK' that is positive and is between zero and about 300 ppm/degree C.
摘要翻译: 在20℃下介电常数K'大于4的聚合物组合物与温度变化很小的聚合物组合物由聚合物或陶瓷或陶瓷混合物的聚合物或混合物制成,其中聚合物或聚合物混合物具有 介电常数K'在约1.5至约3.5的范围内,介电常数TCK'的温度系数为负,介于0和约-300ppm /℃之间; 并且陶瓷包括第一陶瓷,其可以是一种陶瓷或陶瓷的混合物,每种陶瓷或陶瓷的混合物的介电常数在约15至约200的范围内,TCK'为正,为零至约3000ppm /度之间 C。; 和可选的第二陶瓷,其可以是一种陶瓷或陶瓷的混合物,每种陶瓷或陶瓷的混合物的介电常数在约3至约15的范围内,TCK'为正,为零至约300ppm /℃之间 。
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公开(公告)号:US5348990A
公开(公告)日:1994-09-20
申请号:US25205
申请日:1993-03-02
CPC分类号: C09K19/00 , Y10T428/3154
摘要: A low dielectric material made of a liquid crystal polymer, polytetrafluoroethylene, and hollow glass spheres. This material is a relatively low cost, low dielectric blend having good physical strength and chemical and temperature resistance.
摘要翻译: 由液晶聚合物,聚四氟乙烯和中空玻璃球制成的低介电材料。 该材料是具有良好的物理强度和耐化学性和耐温性的相对低成本的低介电共混物。
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