-
公开(公告)号：US11859300B2
公开(公告)日：2024-01-02
申请号：US17809124
申请日：2022-06-27
发明人： Zhian He , Shantinath Ghongadi , Quan Ma , Hyungjun Hur , Cian Sweeney , Quang Nguyen , Rezaul Karim , Jingbin Feng
CPC分类号： C25D17/001 , C25D3/38 , C25D17/002 , C25D17/10 , C25D21/14 , C25D21/18 , H01L21/2885
摘要： Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.
-
公开(公告)号：US20210130976A1
公开(公告)日：2021-05-06
申请号：US17248151
申请日：2021-01-11
发明人： Zhian He , Shantinath Ghongadi , Quan Ma , Hyungjun Hur , Cian Sweeney , Quang Nguyen , Rezaul Karim , Jingbin Feng
IPC分类号： C25D17/00 , H01L21/288 , C25D17/10 , C25D3/38 , C25D21/14
摘要： Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.
-
公开(公告)号：US10927475B2
公开(公告)日：2021-02-23
申请号：US16178402
申请日：2018-11-01
发明人： Zhian He , Shantinath Ghongadi , Quan Ma , Hyungjun Hur , Cian Sweeney , Quang Nguyen , Rezaul Karim , Jingbin Feng
IPC分类号： C25D17/00 , H01L21/288 , C25D17/10 , C25D3/38 , C25D21/14
摘要： Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.
-
公开(公告)号：US20240141540A1
公开(公告)日：2024-05-02
申请号：US18502409
申请日：2023-11-06
发明人： Zhian He , Shantinath Ghongadi , Quan Ma , Hyungjun Hur , Cian Sweeney , Quang Nguyen , Rezaul Karim , Jingbin Feng
CPC分类号： C25D17/001 , C25D3/38 , C25D17/002 , C25D17/10 , C25D21/14 , C25D21/18 , H01L21/2885
摘要： Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.
-
公开(公告)号：US20220333267A1
公开(公告)日：2022-10-20
申请号：US17809124
申请日：2022-06-27
发明人： Zhian He , Shantinath Ghongadi , Quan Ma , Hyungjun Hur , Cian Sweeney , Quang Nguyen , Rezaul Karim , Jingbin Feng
摘要： Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.
-
公开(公告)号：US20190127872A1
公开(公告)日：2019-05-02
申请号：US16178402
申请日：2018-11-01
发明人： Zhian He , Shantinath Ghongadi , Quan Ma , Hyungjun Hur , Cian Sweeney , Quang Nguyen , Rezaul Karim , Jingbin Feng
IPC分类号： C25D17/00 , H01L21/288 , C25D21/14 , C25D3/38 , C25D17/10
摘要： Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.017 秒)
