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    Thermal interface pad material with perforated liner
    3.
    发明授权
    Thermal interface pad material with perforated liner 有权

    公开(公告)号：US10049959B2

    公开(公告)日：2018-08-14

    申请号：US14006438

    申请日：2012-03-15

    申请人： Bas Fleskens ,  Lambertus Adrianus Marinus De Jong

    发明人： Bas Fleskens ,  Lambertus Adrianus Marinus De Jong

    IPC分类号： H01L23/42 ,  H01L23/373 ,  H01L23/433 ,  F28F3/00 ,  F21V17/00

    摘要： This invention relates to a thermal interface device (206) arranged to provide a thermal coupling interface between a heat-generating unit (202) and a heat-removing unit (204), comprising a liner layer (210), which has opposite first and second surfaces (218,220), at least the first surface being a slide surface, and which is provided with multiple perforations (212); and a thermal connection layer (208), which is engaged with the liner layer at the second surface (220) thereof, and which is one of elastically and inelastically deformable. The thermal interface device has an idle state where the perforations are open, and an active state where the perforations are filled with a part of the thermal connection layer. The thermal connection layer is arranged to be deformed by the thermal interface device being subjected to a compression force exceeding a deformation threshold, and thereby to fill the perforations.

    Thermal interface pad material with perforated liner
    4.
    发明申请
    Thermal interface pad material with perforated liner 审中-公开
    带有穿孔衬垫的热界面垫材料

    公开(公告)号：US20140008050A1

    公开(公告)日：2014-01-09

    申请号：US14006438

    申请日：2012-03-15

    申请人： Bas Fleskens ,  Lambertus Adrianus Marinus De Jong

    发明人： Bas Fleskens ,  Lambertus Adrianus Marinus De Jong

    IPC分类号： F28F3/00

    CPC分类号： H01L23/373 ,  F21V17/002 ,  F28F3/00 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/00

    摘要： This invention relates to a thermal interface device (206) arranged to provide a thermal coupling interface between a heat-generating unit (202) and a heat-removing unit (204), comprising a liner layer (210), which has opposite first and second surfaces (218,220), at least the first surface being a slide surface, and which is provided with multiple perforations (212); and a thermal connection layer (208), which is engaged with the liner layer at the second surface (220) thereof, and which is one of elastically and inelastically deformable. The thermal interface device has an idle state where the perforations are open, and an active state where the perforations are filled with a part of the thermal connection layer. The thermal connection layer is arranged to be deformed by the thermal interface device being subjected to a compression force exceeding a deformation threshold, and thereby to fill the perforations.

    摘要翻译： 本发明涉及一种布置成在发热单元（202）和散热单元（204）之间提供热耦合接口的热接口设备（206），其包括衬垫层（210），其具有相对的第一和第 第二表面（218,220），至少第一表面是滑动表面，并且设置有多个穿孔（212）; 以及热连接层（208），其在其第二表面（220）处与衬垫层接合，并且是弹性和非弹性变形的热连接层。 热接口装置具有穿孔打开的空闲状态，其中穿孔被热连接层的一部分填充的活动状态。 热连接层被热接口装置变形，受压力超过变形阈值，从而填充穿孔。