公开(公告)号：US07011145B2

公开(公告)日：2006-03-14

申请号：US10887879

申请日：2004-07-12

申请人： Lan-Kai Yeh ,  Che-Wei Lin ,  Shao-Wen Chen ,  Jin-Cherng Shyu ,  Ming-Jye Tsai

发明人： Lan-Kai Yeh ,  Che-Wei Lin ,  Shao-Wen Chen ,  Jin-Cherng Shyu ,  Ming-Jye Tsai

IPC分类号： F28D15/00

CPC分类号： F28F13/18 ,  F28D15/046 ,  F28F2245/02 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： A method for enhancing the mobility of a working fluid in a liquid/gas phase heat dissipating device improves the mobility of the working fluid therein, and further enhancing the heat dissipation capability of the heat dissipating device. The present invention coats a layer on the surface of a capillary structure inside the heat dissipating device to increase the material property on the surface and the coupling force between the working fluid and the capillary structure and decrease the contact angle between the working fluid and the capillary structure, and thus the working fluid has a higher mobility to solve the problem of the high heat flux density of the liquid/gas heat dissipating device and improve the heat dissipation effect. The present invention not only applies to the heat generating electronic components within a limited space, but also applies to other electronic components that require a constant temperature.

摘要翻译： 在液/气相散热装置中提高工作流体的流动性的方法提高了工作流体的流动性，进一步提高了散热装置的散热能力。 本发明在散热装置内的毛细管结构的表面上涂覆一层，以增加表面上的材料性能和工作流体与毛细结构之间的耦合力，并降低工作流体和毛细管之间的接触角 结构，因此工作流体具有更高的流动性，以解决液/气散热装置的高热通量密度的问题，并提高散热效果。 本发明不仅适用于有限空间内的发热电子部件，而且也适用于需要恒定温度的其他电子部件。

公开(公告)号：US20060005951A1

公开(公告)日：2006-01-12

申请号：US10887879

申请日：2004-07-12

申请人： Lan-Kai Yeh ,  Che-Wei Lin ,  Shao-Wen Chen ,  Jin-Cherng Shyu ,  Ming-Jye Tsai

发明人： Lan-Kai Yeh ,  Che-Wei Lin ,  Shao-Wen Chen ,  Jin-Cherng Shyu ,  Ming-Jye Tsai

IPC分类号： F28D15/00

CPC分类号： F28F13/18 ,  F28D15/046 ,  F28F2245/02 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： A method for enhancing the mobility of a working fluid in a liquid/gas phase heat dissipating device improves the mobility of the working fluid therein, and further enhancing the heat dissipation capability of the heat dissipating device. The present invention coats a layer on the surface of a capillary structure inside the heat dissipating device to increase the material property on the surface and the coupling force between the working fluid and the capillary structure and decrease the contact angle between the working fluid and the capillary structure, and thus the working fluid has a higher mobility to solve the problem of the high heat flux density of the liquid/gas heat dissipating device and improve the heat dissipation effect. The present invention not only applies to the heat generating electronic components within a limited space, but also applies to other electronic components that require a constant temperature.

摘要翻译： 在液/气相散热装置中提高工作流体的流动性的方法提高了工作流体的流动性，进一步提高了散热装置的散热能力。 本发明在散热装置内的毛细管结构的表面上涂覆一层，以增加表面上的材料性能和工作流体与毛细结构之间的耦合力，并降低工作流体和毛细管之间的接触角 结构，因此工作流体具有更高的流动性，以解决液/气散热装置的高热通量密度的问题，并提高散热效果。 本发明不仅适用于有限空间内的发热电子部件，而且也适用于需要恒定温度的其他电子部件。

公开(公告)号：US07578338B2

公开(公告)日：2009-08-25

申请号：US11785325

申请日：2007-04-17

申请人： Lan-Kai Yeh ,  Che-Wei Lin ,  Ming-Jye Tsai ,  Shao-Wen Chen ,  Jin-Cherng Shyu

发明人： Lan-Kai Yeh ,  Che-Wei Lin ,  Ming-Jye Tsai ,  Shao-Wen Chen ,  Jin-Cherng Shyu

IPC分类号： F28D15/00

CPC分类号： B23P15/26 ,  B23P2700/10 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49087 ,  Y10T29/4935 ,  Y10T29/49353 ,  H01L2924/00

摘要： A heat dissipating apparatus has a micro-structure layer. Two highly heat conductive members are provided, each having structured patterns. A highly heat conductive material is coated on the structured patterns by injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having a micro-structure layer. The heat dissipating apparatus includes a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

摘要翻译： 散热装置具有微结构层。 提供两个高度导热的构件，每个具有结构化图案。 通过注射成型用于形成微结构层，将高度导热的材料涂覆在结构化图案上。 两个高导热构件被组装以形成具有微结构层的散热装置。 散热装置包括由高导热构件构成的主体。 主体形成容纳腔，并且容纳腔的内表面形成微结构层。 将工作流体填充到容纳腔中，以将热量从吸热表面传递到散热表面。

公开(公告)号：US07730605B2

公开(公告)日：2010-06-08

申请号：US11785326

申请日：2007-04-17

申请人： Lan-Kai Yeh ,  Che-Wei Lin ,  Ming-Jye Tsai ,  Shao-Wen Chen ,  Jin-Cherng Shyu

发明人： Lan-Kai Yeh ,  Che-Wei Lin ,  Ming-Jye Tsai ,  Shao-Wen Chen ,  Jin-Cherng Shyu

IPC分类号： H05B3/00

CPC分类号： B23P15/26 ,  B23P2700/10 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49087 ,  Y10T29/4935 ,  Y10T29/49353 ,  H01L2924/00

摘要： The present invention relates to a method for fabricating a heat dissipating apparatus. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

摘要翻译： 散热装置的制造方法技术领域本发明涉及一种散热装置的制造方法。 该方法提供两个具有结构图案的高导热构件。 在结构化图案上涂覆高导热材料以形成微结构层。 两个高导热构件被组装以形成具有微结构层的散热装置。 散热装置包括由高导热构件构成的主体。 主体形成容纳腔，并且容纳腔的内表面形成微结构层。 将工作流体填充到容纳腔中，以将热量从吸热表面传递到散热表面。

公开(公告)号：US20070187074A1

公开(公告)日：2007-08-16

申请号：US11785325

申请日：2007-04-17

申请人： Lan-Kai Yeh ,  Che-Wei Lin ,  Ming-Jye Tsai ,  Shao-Wen Chen ,  Jin-Cherng Shyu

发明人： Lan-Kai Yeh ,  Che-Wei Lin ,  Ming-Jye Tsai ,  Shao-Wen Chen ,  Jin-Cherng Shyu

IPC分类号： F28F13/18

CPC分类号： B23P15/26 ,  B23P2700/10 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49087 ,  Y10T29/4935 ,  Y10T29/49353 ,  H01L2924/00

摘要： The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

摘要翻译： 本发明涉及具有微结构层的散热装置及其制造方法。 该方法提供两个具有结构图案的高导热构件。 通过用于形成微结构层的注射成型将高度导热的材料涂覆在结构化图案上。 两个高导热构件被组装以形成具有微结构层的散热装置。 散热装置包括由高导热构件构成的主体。 主体形成容纳腔，并且容纳腔的内表面形成微结构层。 将工作流体填充到容纳腔中，以将热量从吸热表面传递到散热表面。

公开(公告)号：US20070193029A1

公开(公告)日：2007-08-23

申请号：US11785326

申请日：2007-04-17

申请人： Lan-Kai Yeh ,  Che-Wei Lin ,  Ming-Jye Tsai ,  Shao-Wen Chen ,  Jin-Cherng Shyu

发明人： Lan-Kai Yeh ,  Che-Wei Lin ,  Ming-Jye Tsai ,  Shao-Wen Chen ,  Jin-Cherng Shyu

IPC分类号： B21D53/02

CPC分类号： B23P15/26 ,  B23P2700/10 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49087 ,  Y10T29/4935 ,  Y10T29/49353 ,  H01L2924/00

摘要： The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

公开(公告)号：US06932150B1

公开(公告)日：2005-08-23

申请号：US10937611

申请日：2004-09-10

申请人： Lan-Kai Yeh ,  Ming-Jye Tsai ,  Che-Wei Lin ,  Shao-Wen Chen ,  Jin-Cherng Shyu

发明人： Lan-Kai Yeh ,  Ming-Jye Tsai ,  Che-Wei Lin ,  Shao-Wen Chen ,  Jin-Cherng Shyu

IPC分类号： A42B3/28

CPC分类号： A42B3/285

摘要： A heat-dissipation device adopted for a safety helmet which includes a heat-transfer unit that functions as a heat pipe, a heat-dissipation unit connecting to the heat-transfer unit, a vent formed in a front of the heat-dissipation unit that can be closed and opened alternatively by a shutter unit in order to adjust the capacity of heat-dissipation thereof, and a covering unit made of insulative materials and spreading over the heat-dissipation unit. Whereby the heat-transfer unit provides a kind of two-phase flow that is capable of conducting heat rapidly, so as to remove heat gathered in the helmet and improve the comfort level for the wearer.

摘要翻译： 一种用于安全头盔的散热装置，其包括用作热管的传热单元，连接到传热单元的散热单元，形成在散热单元的前面的通风口， 可以通过快门单元交替地闭合和打开，以便调节其散热能力，以及由绝缘材料制成并覆盖在散热单元上的覆盖单元。 其中传热单元提供能够快速传导热量的一种两相流，以便去除聚集在头盔中的热量并提高穿着者的舒适度。

公开(公告)号：US07237337B2

公开(公告)日：2007-07-03

申请号：US10995480

申请日：2004-11-24

申请人： Lan-Kai Yeh ,  Che-Wei Lin ,  Ming-Jye Tsai ,  Shao-Wen Chen ,  Jin-Cherng Shyu

发明人： Lan-Kai Yeh ,  Che-Wei Lin ,  Ming-Jye Tsai ,  Shao-Wen Chen ,  Jin-Cherng Shyu

IPC分类号： B23P6/00 ,  F28F7/00

CPC分类号： B23P15/26 ,  B23P2700/10 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49087 ,  Y10T29/4935 ,  Y10T29/49353 ,  H01L2924/00

摘要： The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

公开(公告)号：US20060005952A1

公开(公告)日：2006-01-12

申请号：US10995480

申请日：2004-11-24

申请人： Lan-Kai Yeh ,  Che-Wei Lin ,  Ming-Jye Tsai ,  Shao-Wen Chen ,  Jin-Cherng Shyu

发明人： Lan-Kai Yeh ,  Che-Wei Lin ,  Ming-Jye Tsai ,  Shao-Wen Chen ,  Jin-Cherng Shyu

IPC分类号： F28D15/00

CPC分类号： B23P15/26 ,  B23P2700/10 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/046 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49087 ,  Y10T29/4935 ,  Y10T29/49353 ,  H01L2924/00

摘要： The present invention relates to a heat dissipating apparatus having micro-structure layer and method for fabricating the same. The method provides two highly heat conductive members having structure patterns. A highly heat conductive material is coated on the structured patterns by means of injection molding for forming a micro-structure layer. The two highly heat conductive members are assembled to form a heat dissipating apparatus having micro-structure layer. The heat dissipating apparatus comprises a main body composed of the highly heat conductive members. The main body forms an accommodating cavity, and inner surfaces of the accommodating cavity form the micro-structure layer. A working fluid is filled into the accommodating cavity for transferring heat from a heat absorbing surface to a heat dissipating surface.

摘要翻译： 本发明涉及具有微结构层的散热装置及其制造方法。 该方法提供两个具有结构图案的高导热构件。 通过用于形成微结构层的注射成型将高度导热的材料涂覆在结构化图案上。 两个高导热构件被组装以形成具有微结构层的散热装置。 散热装置包括由高导热构件构成的主体。 主体形成容纳腔，并且容纳腔的内表面形成微结构层。 将工作流体填充到容纳腔中，以将热量从吸热表面传递到散热表面。

公开(公告)号：US20100229394A1

公开(公告)日：2010-09-16

申请号：US12785910

申请日：2010-05-24

申请人： Ming-Jye Tsai ,  Jin-Cherng Shyu ,  Cheng-Tai Chou ,  Chia-Sheng Chiang ,  Lan-Kai Yeh ,  Shao-Wen Chen

发明人： Ming-Jye Tsai ,  Jin-Cherng Shyu ,  Cheng-Tai Chou ,  Chia-Sheng Chiang ,  Lan-Kai Yeh ,  Shao-Wen Chen

IPC分类号： B21D53/02

CPC分类号： F28D15/0233 ,  B23P2700/09 ,  F28D15/046 ,  F28F2255/18 ,  Y10T29/49353

摘要： The invention provides a method for fabricating wick microstructures in heat pipes, comprising the following steps: providing a flat plate and a mold with several molding holes; filling a dry powder material in the several molding holes and putting the mold to cover the flat plate so as to form an object to be sintered; sintering the object; and removing the mold to form a flat plate with wick microstructures. The wick microstructures are arranged on the flat plate in a form of microgrooves, microcylinders or any combination of them. The flat plate with wick microstructures is further processed to form a heat pipe with a characteristic shape and having two kinds of wick microstructures such that the heat transferred by the heat pipe is increased and the occurrence of dry out of the heat pipe is delayed.

摘要翻译： 本发明提供了一种用于在热管中制造灯芯微结构的方法，包括以下步骤：提供具有多个成型孔的平板和模具; 在几个模制孔中填充干粉材料并将模具盖住平板以形成待烧结的物体; 烧结物体; 并移除模具以形成具有芯组织的平板。 油芯微结构以微槽，微气缸或它们的任何组合的形式布置在平板上。 进一步加工具有芯组织的平板，形成具有特征形状的热管，并具有两种芯组织，使得热管传递的热量增加，并且热管的干燥出现延迟。