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    METHOD AND APPARATUS FOR POSITIONING LAYERS WITHIN A LAYERED HEATER SYSTEM
    2.
    发明申请
    METHOD AND APPARATUS FOR POSITIONING LAYERS WITHIN A LAYERED HEATER SYSTEM 有权
    在层状加热器系统中定位层的方法和装置

    公开(公告)号：US20100319186A1

    公开(公告)日：2010-12-23

    申请号：US12868456

    申请日：2010-08-25

    申请人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

    发明人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

    IPC分类号： H05B3/00

    CPC分类号： H01C17/065 ,  H05B2203/01 ,  Y10T29/49083 ,  Y10T156/10 ,  Y10T156/17

    摘要： A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform.

    摘要翻译： 提供了在制造分层电阻性装置期间将带预制件定位为电阻器件基板上的方法。 该方法包括将带预制件定位在预定位置，并相对于彼此平移一个或多个下一个直到定位装置的一部分接合带预制件：定位装置，电阻装置基板和带预制件。 该方法还包括继续平移，直到带预成型件接合电阻器件衬底并且继续平移，使得定位装置的部件逐渐地在电阻器件衬底周围平移并随后将带预制件定位到电阻器件衬底上。 在一些形式中，该方法包括使用控制器和/或将温度，压力和时间的预定循环应用于基底和带预制件。

    Method and apparatus for positioning layers within a layered heater system
    3.
    发明授权
    Method and apparatus for positioning layers within a layered heater system 有权
    在层状加热器系统内定位层的方法和装置

    公开(公告)号：US08070899B2

    公开(公告)日：2011-12-06

    申请号：US12868456

    申请日：2010-08-25

    申请人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

    发明人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

    IPC分类号： B29C65/00 ,  B32B37/00 ,  B65H81/00

    CPC分类号： H01C17/065 ,  H05B2203/01 ,  Y10T29/49083 ,  Y10T156/10 ,  Y10T156/17

    摘要： A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform.

    摘要翻译： 提供了在制造分层电阻性装置期间将带预制件定位为电阻器件基板上的方法。 该方法包括将带预制件定位在预定位置，并相对于彼此平移一个或多个下一个直到定位装置的一部分接合带预制件：定位装置，电阻装置基板和带预制件。 该方法还包括继续平移，直到带预成型件接合电阻器件衬底并且继续平移，使得定位装置的部件逐渐地在电阻器件衬底周围平移并随后将带预制件定位到电阻器件衬底上。 在一些形式中，该方法包括使用控制器和/或将温度，压力和时间的预定循环应用于基底和带预制件。