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    METHOD AND APPARATUS FOR POSITIONING LAYERS WITHIN A LAYERED HEATER SYSTEM
    1.
    发明申请
    METHOD AND APPARATUS FOR POSITIONING LAYERS WITHIN A LAYERED HEATER SYSTEM 有权
    在层状加热器系统中定位层的方法和装置

    公开(公告)号：US20100319186A1

    公开(公告)日：2010-12-23

    申请号：US12868456

    申请日：2010-08-25

    申请人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

    发明人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

    IPC分类号： H05B3/00

    CPC分类号： H01C17/065 ,  H05B2203/01 ,  Y10T29/49083 ,  Y10T156/10 ,  Y10T156/17

    摘要： A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform.

    摘要翻译： 提供了在制造分层电阻性装置期间将带预制件定位为电阻器件基板上的方法。 该方法包括将带预制件定位在预定位置，并相对于彼此平移一个或多个下一个直到定位装置的一部分接合带预制件：定位装置，电阻装置基板和带预制件。 该方法还包括继续平移，直到带预成型件接合电阻器件衬底并且继续平移，使得定位装置的部件逐渐地在电阻器件衬底周围平移并随后将带预制件定位到电阻器件衬底上。 在一些形式中，该方法包括使用控制器和/或将温度，压力和时间的预定循环应用于基底和带预制件。

    Method and apparatus for positioning layers within a layered heater system
    3.
    发明授权
    Method and apparatus for positioning layers within a layered heater system 有权
    在层状加热器系统内定位层的方法和装置

    公开(公告)号：US08070899B2

    公开(公告)日：2011-12-06

    申请号：US12868456

    申请日：2010-08-25

    申请人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

    发明人： Larry Forbis ,  Jason Miller ,  Ken Gaulke ,  Angie Privett ,  Roger Brummell ,  Tom Lamantia ,  Julie Tischer

    IPC分类号： B29C65/00 ,  B32B37/00 ,  B65H81/00

    CPC分类号： H01C17/065 ,  H05B2203/01 ,  Y10T29/49083 ,  Y10T156/10 ,  Y10T156/17

    摘要： A method of positioning a tape preform as a layer onto a resistive device substrate during the manufacture of a layered resistive device is provided. The method includes locating the tape preform in a predetermined position and translating one or more of the following relative to each other until a portion of the positioning device engages the tape preform: a positioning device, the resistive device substrate, and the tape preform. The method also includes continuing the translation until the tape preform engages the resistive device substrate and continuing the translation such that components of the positioning device progressively translate around the resistive device substrate and subsequently position the tape preform onto the resistive device substrate. In some forms, the method includes using a controller and/or applying a predetermined cycle of temperature, pressure, and time to the substrate and tape preform.

    摘要翻译： 提供了在制造分层电阻性装置期间将带预制件定位为电阻器件基板上的方法。 该方法包括将带预制件定位在预定位置，并相对于彼此平移一个或多个下一个直到定位装置的一部分接合带预制件：定位装置，电阻装置基板和带预制件。 该方法还包括继续平移，直到带预成型件接合电阻器件衬底并且继续平移，使得定位装置的部件逐渐地在电阻器件衬底周围平移并随后将带预制件定位到电阻器件衬底上。 在一些形式中，该方法包括使用控制器和/或将温度，压力和时间的预定循环应用于基底和带预制件。

    Reduced Cycle Time Manufacturing Processes for Thick Film Resistive Devices
    5.
    发明申请
    Reduced Cycle Time Manufacturing Processes for Thick Film Resistive Devices 有权
    缩短薄膜电阻器件的循环时间制造工艺

    公开(公告)号：US20090020905A1

    公开(公告)日：2009-01-22

    申请号：US11779745

    申请日：2007-07-18

    申请人： Angie Privett ,  Roger Brummell ,  Larry Forbis

    发明人： Angie Privett ,  Roger Brummell ,  Larry Forbis

    IPC分类号： B29C63/02

    CPC分类号： B32B37/10 ,  H01C17/06 ,  H05B3/262 ,  H05B3/265 ,  H05B3/46 ,  H05B2203/003 ,  H05B2203/013 ,  H05B2203/017

    摘要： A process of forming a resistive device such as s load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time, and then a resistive layer is farmed on the dielectric layer, and a protective layer is formed over the resistive layer.

    摘要翻译： 提供形成诸如s负载电阻器或加热器的电阻器件的工艺，其包括在基片，靶或相邻的功能层上形成电介质层，其中一种形式的电介质层限定单层电介质带 。 电介质带通过压力，温度和时间的单一预定周期层叠到基板，靶或相邻的功能层上，然后在电介质层上形成电阻层，并且在电阻层上形成保护层 层。

    Reduced cycle time manufacturing processes for thick film resistive devices
    6.
    发明授权
    Reduced cycle time manufacturing processes for thick film resistive devices 有权
    减薄厚膜电阻器件的周期时间制造工艺

    公开(公告)号：US08557082B2

    公开(公告)日：2013-10-15

    申请号：US11779745

    申请日：2007-07-18

    申请人： Angie Privett ,  Roger Brummell ,  Larry Forbis

    发明人： Angie Privett ,  Roger Brummell ,  Larry Forbis

    IPC分类号： B32B37/10

    CPC分类号： B32B37/10 ,  H01C17/06 ,  H05B3/262 ,  H05B3/265 ,  H05B3/46 ,  H05B2203/003 ,  H05B2203/013 ,  H05B2203/017

    摘要： A process of forming a resistive device such as a load resistor or a heater is provided that includes forming a dielectric layer onto a substrate, a target, or an adjacent functional layer, wherein the dielectric layer in one form defines a single layer of dielectric tape. The dielectric tape is laminated to the substrate, the target, or the adjacent functional layer through a single predetermined cycle of pressure, temperature and time, and then a resistive layer is farmed on the dielectric layer, and a protective layer is formed over the resistive layer.

    摘要翻译： 提供了一种形成诸如负载电阻器或加热器之类的电阻器件的工艺，其包括在基片，靶或相邻的功能层上形成电介质层，其中一种形式的电介质层限定单层绝缘带 。 电介质带通过压力，温度和时间的单一预定周期层叠到基板，靶或相邻的功能层上，然后在电介质层上形成电阻层，并且在电阻层上形成保护层 层。

    Thick film layered resistive device employing a dielectric tape
    7.
    发明授权
    Thick film layered resistive device employing a dielectric tape 有权
    使用介质带的厚膜分层电阻器件

    公开(公告)号：US08089337B2

    公开(公告)日：2012-01-03

    申请号：US11779703

    申请日：2007-07-18

    申请人： Roger Brummell ,  Angie Privett

    发明人： Roger Brummell ,  Angie Privett

    IPC分类号： H01C7/18

    CPC分类号： H01C7/003 ,  H01C1/01 ,  H01C17/065 ,  H05B3/48 ,  Y10T29/49082 ,  Y10T29/49099

    摘要： A resistive device for use in providing a resistive load to a target under the application of power from a power source is provided, the resistive device being adapted for electrical connection to the power source through a pair of terminal wires. The resistive device includes a thick film material, and the thick film material defines at least one layer of tape. The resistive device can be, by way of example, a heater or a load resistor, and can also include a substrate onto which a layer of dielectric tape is disposed, a resistive layer disposed on the layer of dielectric tape, and a protective layer disposed on the resistive layer.

    摘要翻译： 提供了一种用于在从电源施加电力的情况下向目标提供电阻性负载的电阻性装置，所述电阻装置适于通过一对端子线与电源电连接。 电阻器件包括厚膜材料，厚膜材料限定至少一层胶带。 电阻器件可以是例如加热器或负载电阻器，并且还可以包括其上布置介质带层的衬底，设置在介质带层上的电阻层和设置在电介质带层上的保护层 在电阻层上。

    Thick Film Layered Resistive Device Employing a Dielectric Tape
    8.
    发明申请
    Thick Film Layered Resistive Device Employing a Dielectric Tape 有权
    使用介质胶带的厚膜层电阻器件

    公开(公告)号：US20090021342A1

    公开(公告)日：2009-01-22

    申请号：US11779703

    申请日：2007-07-18

    申请人： Roger Brummell ,  Angie Privett

    发明人： Roger Brummell ,  Angie Privett

    IPC分类号： H01C7/18

    CPC分类号： H01C7/003 ,  H01C1/01 ,  H01C17/065 ,  H05B3/48 ,  Y10T29/49082 ,  Y10T29/49099

    摘要： A resistive device for use in providing a resistive load to a target under the application of power from a power source is provided, the resistive device being adapted for electrical connection to the power source through a pair of terminal wires. The resistive device includes a thick film material, and the thick film material defines at least one layer of tape. The resistive device can be, by way of example, a heater or a load resistor, and can also include a substrate onto which a layer of dielectric tape is disposed, a resistive layer disposed on the layer of dielectric tape, and a protective layer disposed on the resistive layer.

    摘要翻译： 提供了一种用于在从电源施加电力的情况下向目标提供电阻性负载的电阻性装置，所述电阻装置适于通过一对端子线与电源电连接。 电阻器件包括厚膜材料，厚膜材料限定至少一层胶带。 电阻器件可以是例如加热器或负载电阻器，并且还可以包括其上布置介质带层的衬底，设置在介质带层上的电阻层和设置在电介质带层上的保护层 在电阻层上。