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    Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters
    2.
    发明授权
    Low temperature Bi-CMOS compatible process for MEMS RF resonators and filters 失效
    用于MEMS RF谐振器和滤波器的低温Bi-CMOS兼容工艺

    公开(公告)号：US07943412B2

    公开(公告)日：2011-05-17

    申请号：US10316254

    申请日：2002-12-10

    申请人： Leena Paivikki Buchwalter ,  Kevin Kok Chan ,  Timothy Joseph Dalton ,  Christopher Vincent Jahnes ,  Jennifer Louise Lund ,  Kevin Shawn Petrarca ,  James Louis Speidell ,  James Francis Ziegler

    发明人： Leena Paivikki Buchwalter ,  Kevin Kok Chan ,  Timothy Joseph Dalton ,  Christopher Vincent Jahnes ,  Jennifer Louise Lund ,  Kevin Shawn Petrarca ,  James Louis Speidell ,  James Francis Ziegler

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00246 ,  B81B2201/0271 ,  B81C1/0023 ,  B81C2203/0735 ,  H03H3/0072 ,  H03H9/2405

    摘要： A method of formation of a microelectromechanical system (MEMS) resonator or filter which is compatible with integration with any analog, digital, or mixed-signal integrated circuit (IC) process, after or concurrently with the formation of the metal interconnect layers in those processes, by virtue of its materials of composition, processing steps, and temperature of fabrication is presented. The MEMS resonator or filter incorporates a lower metal level, which forms the electrodes of the MEMS resonator or filter, that may be shared with any or none of the existing metal interconnect levels on the IC. It further incorporates a resonating member that is comprised of at least one metal layer for electrical connection and electrostatic actuation, and at least one dielectric layer for structural purposes. The gap between the electrodes and the resonating member is created by the deposition and subsequent removal of a sacrificial layer comprised of a carbon-based material. The method of removal of the sacrificial material is by an oxygen plasma or an anneal in an oxygen containing ambient. A method of vacuum encapsulation of the MEMS resonator or filter is provided through means of a cavity containing the MEMS device, filled with additional sacrificial material, and sealed. Access vias are created through the membrane sealing the cavity; the sacrificial material is removed as stated previously, and the vias are re-sealed in a vacuum coating process.

    摘要翻译： 一种形成微机电系统（MEMS）谐振器或滤波器的方法，其与在任何模拟，数字或混合信号集成电路（IC）工艺中的集成兼容，或者与这些工艺中的金属互连层的形成同时 ，由于其组成材料，加工步骤和制造温度。 MEMS谐振器或滤波器包含形成MEMS谐振器或滤波器的电极的较低金属电平，其可与IC上的现有金属互连电平中的任何一个或任何一个共享。 它还包括谐振元件，该谐振元件由用于电连接和静电驱动的至少一个金属层和至少一个用于结构目的的电介质层组成。 通过沉积并随后去除由碳基材料构成的牺牲层来产生电极和谐振构件之间的间隙。 去除牺牲材料的方法是通过氧等离子体或在含氧环境中的退火。 MEMS谐振器或滤波器的真空封装方法是通过一个包含MEMS器件的空腔的装置提供的，其中填充有额外的牺牲材料并被密封。 通过隔膜密封腔形成通孔; 如先前所述去除牺牲材料，并且在真空涂覆工艺中重新密封通孔。

    Low temperature bi-CMOS compatible process for MEMS RF resonators and filters
    4.
    发明申请
    Low temperature bi-CMOS compatible process for MEMS RF resonators and filters 失效
    用于MEMS RF谐振器和滤波器的低温双CMOS兼容工艺

    公开(公告)号：US20090108381A1

    公开(公告)日：2009-04-30

    申请号：US10316254

    申请日：2002-12-10

    申请人： Leena Paivikki Buchwalter ,  Kevin Kok Chan ,  Timothy Joseph Dalton ,  Christopher Vincent Jahnes ,  Jennifer Louise Lund ,  Kevin Shawn Petrarca ,  James Louis Speidell ,  James Francis Ziegler

    发明人： Leena Paivikki Buchwalter ,  Kevin Kok Chan ,  Timothy Joseph Dalton ,  Christopher Vincent Jahnes ,  Jennifer Louise Lund ,  Kevin Shawn Petrarca ,  James Louis Speidell ,  James Francis Ziegler

    IPC分类号： H03H9/24 ,  H01L23/28 ,  H01L21/56

    CPC分类号： B81C1/00246 ,  B81B2201/0271 ,  B81C1/0023 ,  B81C2203/0735 ,  H03H3/0072 ,  H03H9/2405

    摘要： A method of formation of a microelectromechanical system (MEMS) resonator or filter which is compatible with integration with any analog, digital, or mixed-signal integrated circuit (IC) process, after or concurrently with the formation of the metal interconnect layers in those processes, by virtue of its materials of composition, processing steps, and temperature of fabrication is presented. The MEMS resonator or filter incorporates a lower metal level, which forms the electrodes of the MEMS resonator or filter, that may be shared with any or none of the existing metal interconnect levels on the IC. It further incorporates a resonating member that is comprised of at least one metal layer for electrical connection and electrostatic actuation, and at least one dielectric layer for structural purposes. The gap between the electrodes and the resonating member is created by the deposition and subsequent removal of a sacrificial layer comprised of a carbon-based material. The method of removal of the sacrificial material is by an oxygen plasma or an anneal in an oxygen containing ambient. A method of vacuum encapsulation of the MEMS resonator or filter is provided through means of a cavity containing the MEMS device, filled with additional sacrificial material, and sealed. Access vias are created through the membrane sealing the cavity; the sacrificial material is removed as stated previously, and the vias are re-sealed in a vacuum coating process.

    摘要翻译： 一种形成微机电系统（MEMS）谐振器或滤波器的方法，其与在任何模拟，数字或混合信号集成电路（IC）工艺中的集成兼容，或者与这些工艺中的金属互连层的形成同时 ，由于其组成材料，加工步骤和制造温度。 MEMS谐振器或滤波器包含形成MEMS谐振器或滤波器的电极的较低金属电平，其可与IC上的现有金属互连电平中的任何一个或任何一个共享。 它还包括谐振元件，该谐振元件由用于电连接和静电驱动的至少一个金属层和至少一个用于结构目的的电介质层组成。 通过沉积并随后去除由碳基材料构成的牺牲层来产生电极和谐振构件之间的间隙。 去除牺牲材料的方法是通过氧等离子体或在含氧环境中的退火。 MEMS谐振器或滤波器的真空封装方法是通过一个包含MEMS器件的空腔的装置提供的，其中填充有额外的牺牲材料并被密封。 通过隔膜密封腔形成通孔; 如先前所述去除牺牲材料，并且在真空涂覆工艺中重新密封通孔。

    Microswitch with a micro-electromechanical system
    5.
    发明授权
    Microswitch with a micro-electromechanical system 有权
    具有微机电系统的微动开关

    公开(公告)号：US06818843B2

    公开(公告)日：2004-11-16

    申请号：US10361418

    申请日：2003-02-10

    申请人： Michael Meixner ,  Leena Paivikki Buchwalter ,  Jennifer Louise Lund ,  Hariklia Deligianni

    发明人： Michael Meixner ,  Leena Paivikki Buchwalter ,  Jennifer Louise Lund ,  Hariklia Deligianni

    IPC分类号： H01H5700

    CPC分类号： H01H59/0009 ,  Y10T307/826

    摘要： Microswitch, comprising a base element (G) with a contact surface (KG) and an electrode (EG), and a switching element (S) with a contact surface (KS) and an electrode (ES) disposed opposite the electrode (EG) of the base element (G) at a distance (g). The switching element (S) is provided with a spring constant and is connected at least with a part of its edge portion with the base element (G) in a fixed manner. The contact surfaces (KG, KS) form a switching contact which is closable against a reaction force caused by the spring constant by means of a voltage applied to the electrodes (EG, ES). The base element (G) and the switching element (S) each comprise an auxiliary electrode (HG, HS) at a distance (a) from the electrode (EG, ES), to which a voltage can be applied. For opening the switching contact the electrodes (EG, ES) have a first voltage potential (U1) and the auxiliary electrodes have a second voltage potential (U2) of the voltage. The voltage potentials (U1, U2) effect an accumulation of positive and negative charge carriers on the surface portions of the electrodes (EG, ES) and the auxiliary electrodes (HG, HS) such that surface portions with positive and negative charge carriers are opposite each other in a lateral direction and surface portions with the same charge carriers are opposite each other in an orthogonal direction.

    摘要翻译： 包括具有接触表面（KG）和电极（EG）的基体元件（G）和与电极（EG）相对设置的具有接触表面（KS）和电极（ES）的开关元件（S）的微动开关， （G）的距离（g）。 开关元件（S）设置有弹簧常数，并且至少与其边缘部分的一部分与基座元件（G）固定连接。 接触表面（KG，KS）形成开关触点，该开关触点通过施加到电极（EG，ES）的电压抵抗由弹簧常数引起的反作用力。 基座元件（G）和开关元件（S）各自包括与电极（EG，ES）距离（a）的辅助电极（HG，HS），可施加电压。 为了打开开关触点，电极（EG，ES）具有第一电压电位（U1），并且辅助电极具有电压的第二电压电位（U2）。 电压电位（U1，U2）在电极（EG，ES）和辅助电极（HG，HS）的表面部分上影响正和负电荷载流子的积累，使得具有正和负电荷载体的表面部分相反 在横向上彼此相对并且具有相同电荷载流子的表面部分在正交方向上彼此相对。