公开(公告)号：US08783899B2

公开(公告)日：2014-07-22

申请号：US13688983

申请日：2012-11-29

Applicant: Lextar Electronics Corporation

Inventor： Ming-Hua Tsai ,  Chen-I Lu

IPC: F21S4/00 ,  F21V21/00 ,  F21V31/00

CPC classification number: F21V21/00 ,  F21K9/00 ,  F21V23/06 ,  F21V31/00 ,  F21Y2103/10 ,  F21Y2113/00 ,  F21Y2115/10 ,  H05K1/117 ,  H05K1/142 ,  H05K3/3405 ,  H05K2201/09709 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10363 ,  Y10S362/80

Abstract: A first substrate of a light bar assembly includes a first edge and a second edge parallel to each other along a first direction. A first connecting end includes a first connecting portion protruding further outward than a second connecting portion. A first bonding pad and a second bonding pad are disposed on the first substrate. First solid-state semiconductor light sources are disposed along the first edge and the second edge. A second substrate, disposed corresponding to the first substrate, includes a third edge, a fourth edge, a second connecting portion, a third bonding pad, a fourth bonding pad, and second solid-state semiconductor light sources. A first connecting device is electrically connected to the first bonding pad and the fourth bonding pad; a second connecting device is electrically connected to the second bonding pad and the third bonding pad to fix the first substrate and the second substrate.

Abstract translation: 光棒组件的第一基板包括沿着第一方向彼此平行的第一边缘和第二边缘。 第一连接端包括比第二连接部更向外突出的第一连接部。 第一接合焊盘和第二接合焊盘设置在第一基板上。 第一固态半导体光源沿着第一边缘和第二边缘设置。 对应于第一基板设置的第二基板包括第三边缘，第四边缘，第二连接部分，第三焊盘，第四焊盘和第二固态半导体光源。 第一连接装置电连接到第一焊盘和第四接合焊盘; 第二连接装置电连接到第二接合焊盘和第三接合焊盘以固定第一基板和第二基板。

公开(公告)号：US20150055355A1

公开(公告)日：2015-02-26

申请号：US14305087

申请日：2014-06-16

Applicant: Lextar Electronics Corporation

Inventor： Zi-Xuan Huang ,  Chen-I Lu

IPC: F21V19/00 ,  F21V23/00 ,  F21K99/00

CPC classification number: H05K1/148 ,  F21K9/232 ,  F21K9/27 ,  F21V23/00 ,  H05K3/4691 ,  H05K2201/10106

Abstract: A light emitting module including a complex circuit board, a light emitting element and an electronic element is provided. The complex circuit board has a light emitting element predetermined area, an electronic element predetermined area and an interval area formed between the light emitting element predetermined area and the electronic element predetermined area. The complex circuit board located at the light emitting element predetermined area and the electronic element predetermined area includes a flexible circuit board, a first rigid substrate and a second rigid substrate. The flexible circuit board has an upper surface and a lower surface. The first rigid substrate is disposed on the upper surface. The second rigid substrate is disposed on the lower surface. The flexible circuit board of the complex circuit board located at the interval area is exposed and not covered by the first rigid substrate or the second rigid substrate.

Abstract translation: 提供了包括复合电路板，发光元件和电子元件的发光模块。 复合电路板具有发光元件预定区域，电子元件预定区域和形成在发光元件预定区域和电子元件预定区域之间的间隔区域。 位于发光元件预定区域和电子元件预定区域的复合电路板包括柔性电路板，第一刚性基板和第二刚性基板。 柔性电路板具有上表面和下表面。 第一刚性基板设置在上表面上。 第二刚性基板设置在下表面上。 位于间隔区域的复合电路板的柔性电路板被暴露，不被第一刚性基板或第二刚性基板覆盖。