公开(公告)号：US12003074B2

公开(公告)日：2024-06-04

申请号：US17124282

申请日：2020-12-16

Applicant: Linktel Technologies Co., Ltd.

Inventor： Baiquan Hu ,  Linke Li ,  Xuefeng Lin ,  Dingkun Hu ,  Tianshu Wu ,  Xianwen Yang ,  Jian Zhang

IPC: H01S5/40 ,  H01S5/00 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0236 ,  H01S5/024

CPC classification number: H01S5/02415 ,  H01S5/0064 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0236 ,  H01S5/02469 ,  H01S5/4012 ,  H01S5/4087

Abstract: The present invention provides a multichannel parallel light emitting device comprising a semiconductor cooler, a cold surface of the semiconductor cooler completely covers the area of a hot surface, and when the hot surface and the cold surface are horizontally disposed, a horizontal distance is reserved between the edge of the cold surface and the edge of the hot surface, and a positive electrode and a negative electrode are fixed on a second surface of the cold surface. The semiconductor cooler with the above structure is disposed in a sealed BOX of a BOX package, the bottom surface of the inner wall of the BOX package is provided with a groove for mounting a semiconductor cooler, a hot surface of the semiconductor cooler is fixed at the bottom of the groove, an insulating low thermal conductivity sealing ring is disposed between a lower end of a cold surface of the semiconductor cooler and the BOX package, so that the BOX package, the insulating low thermal conductivity sealing ring and the cold surface of the semiconductor cooler form a closed space, so as to achieve the TEC local hermetic effect, a water-proof film is not required for the TEC, and to ensure the TEC can work in a non-hermetic environment.

公开(公告)号：US10048456B2

公开(公告)日：2018-08-14

申请号：US15625991

申请日：2017-06-16

Applicant: Linktel Technologies Co., Ltd.

Inventor： Dingkun Hu ,  Jian Zhang ,  Xianwen Yang ,  Tianshu Wu ,  Linke Li

IPC: G02B6/42

CPC classification number: G02B6/4256 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/4215 ,  G02B6/425 ,  G02B6/4255 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/4292

Abstract: The present invention provides a packaging device of single optical multiplexed parallel optical receiver coupling system component, comprising a housing having a transmission function, an adapter component and collimating lens. The upper surface of the housing is provided with a first groove and a second groove, the lower surface of the housing is provided with a third groove. One end of the housing is provided with a through hole which communicates with the first groove. One end of the collimating lens is connected with the adapter component, and the other end of the collimating lens passes through the through hole to the first groove. A first slope and a second slope are respectively provided on the adjacent side wall between the first groove and the second groove. The second slope is provided with a reflective film. The third groove is provided with a lens array having multiple channels. The packaging device by mechanical structure alignment and active coupling method so as to greatly reduce the number of optical elements required to be accurately positioned on the optical path in the parallel transceiver optical module, greatly simplify the optical alignment process, more easily realize mass production of the optical packaging of corresponding products, which reduces the cost of the optical packaging of corresponding products.

公开(公告)号：US20180172929A1

公开(公告)日：2018-06-21

申请号：US15625991

申请日：2017-06-16

Applicant: Linktel Technologies Co., Ltd.

Inventor： Dingkun Hu ,  Jian ZHANG ,  Xianwen YANG ,  Tianshu WU ,  Linke LI

IPC: G02B6/42

CPC classification number: G02B6/4256 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/4215 ,  G02B6/425 ,  G02B6/4255 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/4292

Abstract: The present invention provides a packaging device of single optical multiplexed parallel optical receiver coupling system component, comprising a housing having a transmission function, an adapter component and collimating lens. The upper surface of the housing is provided with a first groove and a second groove, the lower surface of the housing is provided with a third groove. One end of the housing is provided with a through hole which communicates with the first groove. One end of the collimating lens is connected with the adapter component, and the other end of the collimating lens passes through the through hole to the first groove. A first slope and a second slope are respectively provided on the adjacent side wall between the first groove and the second groove. The second slope is provided with a reflective film. The third groove is provided with a lens array having multiple channels. The packaging device by mechanical structure alignment and active coupling method so as to greatly reduce the number of optical elements required to be accurately positioned on the optical path in the parallel transceiver optical module, greatly simplify the optical alignment process, more easily realize mass production of the optical packaging of corresponding products, which reduces the cost of the optical packaging of corresponding products.