公开(公告)号：US12003074B2

公开(公告)日：2024-06-04

申请号：US17124282

申请日：2020-12-16

Applicant: Linktel Technologies Co., Ltd.

Inventor： Baiquan Hu ,  Linke Li ,  Xuefeng Lin ,  Dingkun Hu ,  Tianshu Wu ,  Xianwen Yang ,  Jian Zhang

IPC: H01S5/40 ,  H01S5/00 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0236 ,  H01S5/024

CPC classification number: H01S5/02415 ,  H01S5/0064 ,  H01S5/02253 ,  H01S5/02255 ,  H01S5/0236 ,  H01S5/02469 ,  H01S5/4012 ,  H01S5/4087

Abstract: The present invention provides a multichannel parallel light emitting device comprising a semiconductor cooler, a cold surface of the semiconductor cooler completely covers the area of a hot surface, and when the hot surface and the cold surface are horizontally disposed, a horizontal distance is reserved between the edge of the cold surface and the edge of the hot surface, and a positive electrode and a negative electrode are fixed on a second surface of the cold surface. The semiconductor cooler with the above structure is disposed in a sealed BOX of a BOX package, the bottom surface of the inner wall of the BOX package is provided with a groove for mounting a semiconductor cooler, a hot surface of the semiconductor cooler is fixed at the bottom of the groove, an insulating low thermal conductivity sealing ring is disposed between a lower end of a cold surface of the semiconductor cooler and the BOX package, so that the BOX package, the insulating low thermal conductivity sealing ring and the cold surface of the semiconductor cooler form a closed space, so as to achieve the TEC local hermetic effect, a water-proof film is not required for the TEC, and to ensure the TEC can work in a non-hermetic environment.

公开(公告)号：US11740417B2

公开(公告)日：2023-08-29

申请号：US17927755

申请日：2021-06-17

Applicant: LINKTEL TECHNOLOGIES CO., LTD.

Inventor： Baiquan Hu ,  Xuefeng Lin ,  Linke Li ,  Tianshu Wu ,  Xianwen Yang ,  Jian Zhang

IPC: G02B6/42

CPC classification number: G02B6/4246 ,  G02B6/42 ,  G02B6/4207 ,  G02B6/428 ,  G02B6/4269

Abstract: A silicon photonics integrated chip includes the transmit-input waveguide unit, the splitter unit, the modulator unit, the transmit-output waveguide unit, the receive-input waveguide unit and the receiving detector unit integrated inside the chip. A silicon photonics multi-channel parallel optical component and a coupling method of the silicon photonics multi-channel parallel optical component are also provided. The integrated silicon photonics chip is adopted, the transmitting part still uses two-way DC laser group, the receiving chip is integrated inside the silicon photonics chip, and the optical interface adopts the mature FA-MPO in the industry. It has the advantages of mature technology, high degree of integration, relatively low cost, fewer coupling processes, etc., it is one of the advantageous choices for rates above 400 G.

公开(公告)号：US11320609B2

公开(公告)日：2022-05-03

申请号：US17163056

申请日：2021-01-29

Applicant: Linktel Technologies Co., LTD

Inventor： Linke Li ,  Xuefeng Lin ,  Tianshu Wu ,  Xianwen Yang ,  Jian Zhang

IPC: H04B10/00 ,  G02B6/42 ,  G02B6/293

Abstract: The present invention relates to the technical field of optical communication, and provides a light emitting assembly comprising: an LD chip component, an optical wavelength division multiplexer, a first package housing and a second package housing; the first package housing is fixedly connected with the second package housing to form a first chamber for packaging the LD chip component and a second chamber for packaging the optical wavelength division multiplexer, the first chamber is located inside the first package housing, and the second chamber is located inside the second package housing. The present invention also provides an optical module comprising: a housing, a light receiving assembly and the light emitting assembly mentioned above, wherein the light receiving assembly and the light emitting assembly are both disposed on the housing. The present invention adopts a two-section structure, so that the LD chip component and the optical wavelength division multiplexer are independently separated, and the optical signal processing is carried out in two steps, which not only improves the yield, but also facilitates the implementation of the mounting process. By adopting the optical fiber adapter set, the assembly tolerance can be effectively compensated by utilizing the flexibility of the optical fiber, the stress is eliminated, and the problem of light loss of the assembly stress is avoided.