公开(公告)号：US11807770B2

公开(公告)日：2023-11-07

申请号：US17331808

申请日：2021-05-27

申请人： Littelfuse, Inc.

发明人： Yuriy Borisovich Matus ,  Martin G. Pineda ,  Boris Golubovic ,  Deepak Nayar

IPC分类号： B05D5/12 ,  C09D175/04 ,  C09D177/00 ,  H01H85/143 ,  B05D1/00 ,  B05D1/18 ,  B05D1/30

CPC分类号： C09D175/04 ,  B05D5/12 ,  C09D177/00 ,  H01H85/143 ,  B05D1/005 ,  B05D1/18 ,  B05D1/30

摘要： A method for creating a dielectric thin-film coating for devices having a fusible element is disclosed. The method comprises mixing insoluble and soluble polymers in solid form and exposing the mixture to heat to create a melt mixture. The melt mixture is then dissolved in a solvent to create a slurry which can then be deposited on the device as a thin-film coating to create an interior insulation layer or an external surface.

公开(公告)号：US11437212B1

公开(公告)日：2022-09-06

申请号：US17395749

申请日：2021-08-06

申请人： Littelfuse, Inc.

发明人： Marko Arciaga ,  Gordon Todd Dietsch ,  Roel Santos Retardo ,  Deepak Nayar

IPC分类号： H01H85/041 ,  H01H69/02

摘要： A surface mount device chip fuse including a dielectric substrate, electrically conductive first and second upper terminals disposed on a top surface of the dielectric substrate and defining a gap therebetween, a fusible element formed of solder disposed on the top surface of the dielectric substrate, within the gap, bridging the first and second upper terminals, and electrically conductive first and second lower terminals disposed on a bottom surface of the dielectric substrate and electrically connected to the first and second upper terminals, respectively, wherein a material of the dielectric substrate exhibits a de-wetting characteristic relative to the solder from which the fusible element is formed.