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公开(公告)号:US20240397618A1
公开(公告)日:2024-11-28
申请号:US18668345
申请日:2024-05-20
Applicant: Littelfuse, Inc.
Inventor: Martin G. Pineda , Marco Doms , Sergio Fuentes Godinez , Arjuna Shenoy , Oluwaseun K. Oyewole
Abstract: A device assembly for surface mount devices includes a matrix of SMD skeletons and a polymeric positive temperature coefficient (PPTC) material disposed over the matrix. The matrix consists of multiple rows, with each SMD skeleton having a pair of terminals and multiple whiskers perpendicular to and between the terminals. The PPTC material connects the terminals to the whiskers.
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公开(公告)号:US12278075B2
公开(公告)日:2025-04-15
申请号:US18512741
申请日:2023-11-17
Applicant: Littelfuse, Inc.
Inventor: Martin G. Pineda , Marco Doms , Sergio Fuentes Godinez , Toshikazu Yamaoka , Satoshi Sakamoto , Hajime Takahashi , Keiichiro Nomura , Werner Johler
Abstract: A fuse comprising including a housing, a fusible element disposed within the housing, first and second terminals extending from opposite ends of the fusible element and out of the housing, and a quantity of arc suppressing material disposed on the fusible element, wherein the arc suppressing material is formed of a polyamide hotmelt adhesive mixed with a flame retardant.
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公开(公告)号:US12087479B2
公开(公告)日:2024-09-10
申请号:US17861704
申请日:2022-07-11
Applicant: Littelfuse, Inc.
Inventor: Martin G. Pineda , Sergio Fuentes Godinez , Minh V. Ngo , Yuriy Borisovich Matus
Abstract: A metal oxide varistor (MOV) device including a MOV chip, electrically conductive first and second electrodes disposed on opposite sides of the MOV chip, and electrically conductive first and second leads connected to the first and second electrodes, respectively, wherein the first and second electrodes are formed of a material having a melting point greater than 1100 degrees Celsius.
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公开(公告)号:US20240170244A1
公开(公告)日:2024-05-23
申请号:US18512741
申请日:2023-11-17
Applicant: Littelfuse, Inc.
Inventor: Martin G. Pineda , Marco Doms , Sergio Fuentes Godinez , Toshikazu Yamaoka , Satoshi Sakamoto , Hajime Takahashi , Keiichiro Nomura , Werner Johler
CPC classification number: H01H85/38 , H01H85/06 , H01H85/08 , H01H2085/388
Abstract: A fuse comprising including a housing, a fusible element disposed within the housing, first and second terminals extending from opposite ends of the fusible element and out of the housing, and a quantity of arc suppressing material disposed on the fusible element, wherein the arc suppressing material is formed of a polyamide hotmelt adhesive mixed with a flame retardant.
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公开(公告)号:US20230187152A1
公开(公告)日:2023-06-15
申请号:US17551344
申请日:2021-12-15
Applicant: Littelfuse, Inc.
Inventor: Martin G. Pineda , Sergio Fuentes Godinez , Yuriy Borisovich Matus
CPC classification number: H01H37/64 , H01H37/002 , H02H7/18 , H01H37/04
Abstract: A temperature-sensing tape including a flexible, electrically insulating substrate, a plurality of temperature-sensing elements disposed on the substrate, wherein a temperature-sensing element includes a bimetallic switch.
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公开(公告)号:US20240154402A1
公开(公告)日:2024-05-09
申请号:US18504964
申请日:2023-11-08
Applicant: Littelfuse, Inc.
Inventor: Sergio Fuentes Godinez , Marco Doms , Oluwaseun K. Oyewole , Aalok Bhatt , Francois Perraud , Martin Pineda
CPC classification number: H02H1/0007 , G01K1/024 , G01K3/005 , G01K7/16 , H02H6/00
Abstract: A temperature sensing tape is provided and can include an insulating support structure and at least one temperature sensing element disposed on the insulating support structure wherein the at least one temperature sensing element can be formed from a single polymer mixture that includes two or more polymers, and wherein each of the two or more polymers can have a respective, different crystallinity point.
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公开(公告)号:US20220344078A1
公开(公告)日:2022-10-27
申请号:US17861704
申请日:2022-07-11
Applicant: Littelfuse, Inc.
Inventor: Martin G. Pineda , Sergio Fuentes Godinez , Mihn V. Ngo , Yuriy Borisovich Matus
Abstract: A metal oxide varistor (MOV) device including a MOV chip, electrically conductive first and second electrodes disposed on opposite sides of the MOV chip, and electrically conductive first and second leads connected to the first and second electrodes, respectively, wherein the first and second electrodes are formed of a material having a melting point greater than 1100 degrees Celsius.
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