-
公开(公告)号:US09657924B2
公开(公告)日:2017-05-23
申请号:US14943201
申请日:2015-11-17
发明人: Huan-Jan Chien , Tsung-Hong Tsai
IPC分类号: F21V21/00 , F21V15/01 , H05K3/20 , F21V29/77 , F21V23/00 , F21K9/232 , H05K1/18 , F21Y101/00 , F21Y115/10 , F21Y107/20 , F21Y113/13 , F21Y113/17
CPC分类号: F21V21/00 , F21K9/232 , F21V15/01 , F21V23/001 , F21V29/773 , F21Y2101/00 , F21Y2107/20 , F21Y2113/13 , F21Y2113/17 , F21Y2115/10 , H05K1/181 , H05K1/189 , H05K3/202 , H05K2201/0397 , H05K2201/09263 , H05K2201/10106
摘要: A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.
-
公开(公告)号:US09557041B2
公开(公告)日:2017-01-31
申请号:US13734603
申请日:2013-01-04
发明人: Huan-Jan Chien , Tsung-Hong Tsai
CPC分类号: F21V21/00 , F21K9/232 , F21V15/01 , F21V23/001 , F21V29/773 , F21Y2101/00 , F21Y2107/20 , F21Y2113/13 , F21Y2113/17 , F21Y2115/10 , H05K1/181 , H05K1/189 , H05K3/202 , H05K2201/0397 , H05K2201/09263 , H05K2201/10106
摘要: This invention relates to separately produce the complicated 3D curved structure and LED 3D curved lead frame to meet the demand of the complicated curved surface illumination of illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination complicated curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them together with transparent material, for example, curved decorative lighting, spherical display advertising board, etc.; this method offers more flexibility for structure and aesthetic design, and fully utilizes the high heat dissipation capacity of main body of metal part.
摘要翻译: 本发明涉及分别生产复杂的3D弯曲结构和LED 3D弯曲引线框架,以满足照明装置复杂曲面照明的需求。 首先,在3D照明复杂曲面上绘制具有多层引线框架带状结构的照明电路,然后将这些弯曲电路铺设成平面电路,将电路多层引线框架的带状结构拆除为单层电路图案,使用过程 通过导电金属充电胶带的每层电路图案原型,通过反复堆积多盘充电胶带生产多层导电框架带状结构的原型,并将LED芯片安装在安装座上,获得LED扁平引线框架, 然后将导电金属弯曲成3D 3D弯曲引线框架,并将其贴合在发光曲面上,并用透明材料包装,如弯曲装饰照明,球形展示广告板等; 这种方法为结构和美学设计提供了更多的灵活性,并充分利用了金属部件主体的高散热能力。
-
公开(公告)号:US09400096B2
公开(公告)日:2016-07-26
申请号:US14700412
申请日:2015-04-30
发明人: Huan-Jan Chien , Tsung-Hong Tsai
CPC分类号: F21V23/002 , A45B3/04 , A45B23/00 , A45B25/00 , A45B25/02 , A45B2023/0006 , A45B2200/1018 , F21L4/02 , F21L2001/00 , F21V19/00 , F21V19/0025 , F21V23/06 , F21V33/0004 , F21Y2115/10
摘要: An integrated illumination part is produced by installing annular lead frame with luminous LED chip on main part body of the umbrella, then packaged into one unity with transparent material such as plastic or silica gel, slip ring, installation seat, handle and other parts can be used to produce the part. The structure of annular lead frame made of sheet metal whereby to increase the mass production of integrated illumination part and diversity of light source. It thus fully utilizes high heat dissipation capacity of umbrella parts. It includes single-layer and multilayer structure according to the functional demand of LED chip; the manufacturing method of annular lead frame firstly produces LED chip and lead frame into LED lead frame, then bend it into annular with jig according to the appearance of main part body and fix power pin into annular structure with fastener.
摘要翻译: 通过在伞的主体上安装发光LED芯片的环形引线框架,通过塑料或硅胶等透明材料,滑环,安装座,手柄等部件组装成一体,制成集成照明部件 用来生产零件。 由金属板制成的环形引线框架的结构,从而增加了集成照明部件的大量生产和光源的多样性。 因此它完全利用伞部件的高散热能力。 根据LED芯片的功能需求,包括单层和多层结构; 环形引线框架的制造方法首先将LED芯片和引线框架制成LED引线框架,然后根据主体外观将其弯曲成夹具环形,并将电源针固定到带有紧固件的环形结构中。
-
公开(公告)号:US09631799B2
公开(公告)日:2017-04-25
申请号:US14943358
申请日:2015-11-17
发明人: Huan-Jan Chien , Tsung-Hong Tsai
IPC分类号: F21V21/00 , F21V15/01 , H05K3/20 , F21V29/77 , F21V23/00 , F21K9/232 , H05K1/18 , F21Y101/00 , F21Y115/10 , F21Y107/20 , F21Y113/13 , F21Y113/17
CPC分类号: F21V21/00 , F21K9/232 , F21V15/01 , F21V23/001 , F21V29/773 , F21Y2101/00 , F21Y2107/20 , F21Y2113/13 , F21Y2113/17 , F21Y2115/10 , H05K1/181 , H05K1/189 , H05K3/202 , H05K2201/0397 , H05K2201/09263 , H05K2201/10106
摘要: A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.
-
公开(公告)号:US09060575B2
公开(公告)日:2015-06-23
申请号:US13682374
申请日:2012-11-20
发明人: Huan-Jan Chien , Tsung-Hong Tsai
CPC分类号: F21V23/002 , A45B3/04 , A45B23/00 , A45B25/00 , A45B25/02 , A45B2023/0006 , A45B2200/1018 , F21L4/02 , F21L2001/00 , F21V19/00 , F21V19/0025 , F21V23/06 , F21V33/0004 , F21Y2115/10
摘要: The manufacturing method of the integrated illumination part used in the present invention is to install annular lead frame with luminous LED chip on main part body of the umbrella, then package into one unity with transparent material such as plastic or silica gel, for example, slip ring, installation seat, handle and other parts can be used to produce the part. The purpose of the present aims at innovating the structure of annular lead frame made of sheet metal whereby to increase the mass production of integrated illumination part and diversity of light source, and fully to utilize high heat dissipation capacity of umbrella parts. It includes single-layer and multilayer structure according to the functional demand of LED chip; the manufacturing method of annular lead frame is first to produce LED chip and lead frame into LED lead frame, then bend it into annular with jig according to the appearance of main part body and fix power pin into annular structure with fastener.
摘要翻译: 本发明中使用的集成照明部件的制造方法是在伞的主体上安装发光LED芯片的环形引线框架,然后用塑料或硅胶等透明材料包装成一体,例如滑动 环,安装座,手柄等零件可用于生产零件。 本发明的目的是创新金属板环形引线框架的结构,从而增加了集成照明部件的大量生产和光源的多样性,并充分利用伞部件的高散热能力。 根据LED芯片的功能需求,包括单层和多层结构; 环形引线框架的制造方法首先是将LED芯片和引线框架制造成LED引线框架,然后根据主体外观将其弯曲成夹具环形,并将电源针固定到带有紧固件的环形结构中。
-
-
-
-