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公开(公告)号:US20230265977A1
公开(公告)日:2023-08-24
申请号:US18126000
申请日:2023-03-24
发明人: Tao Jiang , MingBin Wang , Yuexing Li , Zhichao Zhang , Chihshan Yu , Aiming Xiong , Lin Zhou , JunFeng Xu
CPC分类号: F21K9/232 , H05B45/00 , F21Y2107/20
摘要: An LED light bulb is provided. The LED light bulb includes a lamp housing, a bulb base, a stem, first and second conductive supports, a driving circuit, and a flexible LED filament. The flexible filament includes two conductive electrodes, a first LED section, a second LED section, and a conductive section. The first LED section is bent in a first space curved shape. The second LED section is bent in a second space curved shape. The conductive section includes a center point of the flexible LED filament. The flexible LED filament is bent in a third space curved shape comprising the first space curved shape and the second space curved shape.
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公开(公告)号:US10018345B2
公开(公告)日:2018-07-10
申请号:US15470302
申请日:2017-03-27
发明人: Xiaofeng Zou , Qiang Li , Zhijin Lin
IPC分类号: F21V21/30 , F21V29/02 , F21V29/67 , F21V29/74 , F21V29/83 , F21V17/12 , F21V23/00 , H05B33/08 , H05B37/02 , F21Y115/10 , F21Y105/10 , F21Y107/20
CPC分类号: F21V29/673 , F21V17/12 , F21V21/30 , F21V23/001 , F21V23/003 , F21V23/005 , F21V29/74 , F21V29/83 , F21Y2105/10 , F21Y2107/20 , F21Y2115/10 , H05B33/0842 , H05B33/0884 , H05B37/0227
摘要: Various implementations of an LED kit include a housing and at least one LED unit. The LED unit is coupled to an outer surface of at least one wall of the housing. Inner surfaces of the housing walls define a channel that includes a first opening at one end of the housing and a second opening at the other end of the housing. A central axis of the channel is orthogonal to a light output direction of the LED unit. A heat sink structure extends from the inner surface of at least one of the walls, and at least one electrically powered cooling device (e.g., a fan) is disposed adjacent the first opening. The cooling device causes air to flow through the channel from the first opening to the second opening, or vice versa, along the central axis and across the heat sink structure orthogonally to the light output direction.
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公开(公告)号:US20180128432A1
公开(公告)日:2018-05-10
申请号:US15650507
申请日:2017-07-14
申请人: Photon Holding LLC
发明人: Daniel Stewart Lang
IPC分类号: F21L4/08 , F21V7/00 , H01L25/16 , H01L33/64 , H01L35/30 , F21Y105/00 , H01L25/075
CPC分类号: F21L4/08 , F21K9/232 , F21K9/65 , F21V7/0083 , F21Y2105/00 , F21Y2107/20 , F21Y2115/10 , F21Y2115/15 , H01L25/0753 , H01L25/167 , H01L33/645 , H01L35/30 , H01L2924/0002 , Y02A40/966 , H01L2924/00
摘要: Certain embodiments are directed to a lighting device comprising one or more of the following: a plurality of LEDs; a plurality of optic devices corresponding to the plurality of LEDs; at least one optical separator for substantially preventing the light emitted from one LED from effecting the other LEDs; a thermoelectric device configured to harvest heat generated by the LEDs and convert the harvested heat into electrical energy; and a low temperature material for creating a temperature difference across the thermoelectric device.
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公开(公告)号:US20180100642A1
公开(公告)日:2018-04-12
申请号:US15290531
申请日:2016-10-11
申请人: David R. Hall , Hyrum Malone , Justin Robinson
发明人: David R. Hall , Hyrum Malone , Justin Robinson
CPC分类号: F21V21/30 , F21K9/23 , F21K9/65 , F21S9/02 , F21V7/06 , F21V11/00 , F21V11/08 , F21V17/12 , F21V19/006 , F21V19/007 , F21V23/003 , F21Y2107/20 , F21Y2111/00 , F21Y2115/10
摘要: A light bulb is disclosed herein, which in general, includes a light transmitting bulb portion and a base portion. The light transmitting bulb portion includes a first gear and an aperture. The base portion includes a second gear. The first gear is rotated independently of the second gear to direct light produced by the light bulb in a direction defined by a rotational position of the light transmitting bulb portion.
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公开(公告)号:US20170241611A1
公开(公告)日:2017-08-24
申请号:US15314192
申请日:2015-05-18
IPC分类号: F21S8/10 , B60Q1/34 , H01L33/62 , B60Q1/30 , H01L25/075
CPC分类号: F21S43/195 , B60Q1/30 , B60Q1/34 , B60Q2400/00 , F21K9/00 , F21K9/90 , F21S43/14 , F21S43/15 , F21S43/26 , F21S45/47 , F21W2103/00 , F21Y2107/20 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要: An LED lamp includes a metal lead frame strip (14) on which is directly mounted bare LED dies (12), such as in series. Therefore, there is excellent thermal conductivity to the lead frame (14). Lenses (24) are then molded over the LED dies (12) to encapsulate them. The lead frame (14) is then inserted into a mold for a thermally conductive plastic body (38) and is bent in an arc while in the mold so that the top surfaces of the LED dies (12) are not parallel to each other. The plastic body is molded, and the structure is removed from the mold. The curved lead frame causes the overall light emission to be very wide, such a greater than 270 degrees. In another embodiment, the lead frame strip is supported over a curved outer surface of a pre-molded plastic support. Ends of the lead frame strip are inserted into electrical connectors of the plastic support.
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公开(公告)号:US09709222B2
公开(公告)日:2017-07-18
申请号:US14807921
申请日:2015-07-24
IPC分类号: F21V29/00 , F21K99/00 , F21V3/02 , F21V7/00 , F21V19/00 , F21V3/04 , F21V23/06 , F21K9/23 , F21K9/232 , F21V23/00 , F21Y101/00 , F21Y105/12 , F21Y105/10 , F21Y115/10 , F21Y107/20 , F21Y107/90
CPC分类号: F21K9/232 , F21K9/23 , F21K9/238 , F21V3/02 , F21V3/04 , F21V7/0016 , F21V19/003 , F21V23/006 , F21V23/06 , F21Y2101/00 , F21Y2105/10 , F21Y2105/12 , F21Y2107/20 , F21Y2107/90 , F21Y2115/10
摘要: The present invention relates lamp (10), comprising: a carrier (12); a series (28a) of solid state light sources (30) mounted on the carrier; and a cover member (32a) covering the series of solid state light sources, wherein openings (40) are provided in the carrier between the solid state light sources of said series of solid state light sources, such that light emitted from the series of solid state light sources and reflected back towards the carrier by the cover member is allowed to pass the carrier through the openings. The present invention also relates to a lighting fixture comprising at least one such lamp.
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公开(公告)号:US09638397B2
公开(公告)日:2017-05-02
申请号:US14405554
申请日:2013-05-21
发明人: Xiaoyan Zhu , Wenyi Li , Shitao Deng , Miao Zhang
IPC分类号: F21V13/02 , F21V3/00 , F21S8/08 , F21V5/04 , F21V9/16 , F21V9/08 , F21W131/103 , G02B19/00 , F21Y101/00 , F21Y105/10 , F21Y115/10 , F21Y107/20
CPC分类号: F21V13/02 , F21S8/086 , F21V3/00 , F21V5/04 , F21V9/08 , F21V9/30 , F21W2131/103 , F21Y2101/00 , F21Y2105/10 , F21Y2107/20 , F21Y2115/10 , G02B19/0061
摘要: There is provided a lighting apparatus and a method for reducing discomfort glare. The method comprises a step of providing a first portion of light radiation in a first incident angle range; and another step of providing a second portion of light radiation in a second incident angle range consecutive to the first incident angle range. The first incident angle range is greater than the second incident angle range viewed from a vertically downward direction of a light source emitting the light radiation, and the correlated color temperature of the first portion of light radiation is lower than that of the second portion of light radiation.
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公开(公告)号:US09557041B2
公开(公告)日:2017-01-31
申请号:US13734603
申请日:2013-01-04
发明人: Huan-Jan Chien , Tsung-Hong Tsai
CPC分类号: F21V21/00 , F21K9/232 , F21V15/01 , F21V23/001 , F21V29/773 , F21Y2101/00 , F21Y2107/20 , F21Y2113/13 , F21Y2113/17 , F21Y2115/10 , H05K1/181 , H05K1/189 , H05K3/202 , H05K2201/0397 , H05K2201/09263 , H05K2201/10106
摘要: This invention relates to separately produce the complicated 3D curved structure and LED 3D curved lead frame to meet the demand of the complicated curved surface illumination of illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination complicated curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them together with transparent material, for example, curved decorative lighting, spherical display advertising board, etc.; this method offers more flexibility for structure and aesthetic design, and fully utilizes the high heat dissipation capacity of main body of metal part.
摘要翻译: 本发明涉及分别生产复杂的3D弯曲结构和LED 3D弯曲引线框架,以满足照明装置复杂曲面照明的需求。 首先,在3D照明复杂曲面上绘制具有多层引线框架带状结构的照明电路,然后将这些弯曲电路铺设成平面电路,将电路多层引线框架的带状结构拆除为单层电路图案,使用过程 通过导电金属充电胶带的每层电路图案原型,通过反复堆积多盘充电胶带生产多层导电框架带状结构的原型,并将LED芯片安装在安装座上,获得LED扁平引线框架, 然后将导电金属弯曲成3D 3D弯曲引线框架,并将其贴合在发光曲面上,并用透明材料包装,如弯曲装饰照明,球形展示广告板等; 这种方法为结构和美学设计提供了更多的灵活性,并充分利用了金属部件主体的高散热能力。
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9.
公开(公告)号:US09528667B1
公开(公告)日:2016-12-27
申请号:US14844796
申请日:2015-09-03
申请人: Rodrigo M. Pereyra
发明人: Rodrigo M. Pereyra
CPC分类号: F21K9/90 , F21K9/232 , F21V23/005 , F21Y2107/20 , F21Y2115/10 , H05K3/0014 , H05K2201/0129 , H05K2201/09018 , H05K2201/09027 , H05K2201/09118 , H05K2201/10106 , H05K2203/085 , H05K2203/1453
摘要: A method of manufacturing a lamp comprising forming a first sheet segment (48) into a first shell portion (110) after forming a first electrically conductive trace (70) on the first sheet segment (48) and after placing a first plurality of LEDs (90) on the first sheet segment (48); forming a second sheet segment (50) into a second shell portion (120) after forming a second electrically conductive trace (80) on the second plastic segment (50) and after placing a second plurality of LEDs (90) on the second sheet segment (50); and joining the first shell portion (110) and the second shell portion (120) into a bulb enclosure (40) defining an interior region (42) therein. The first and second sheet segments (48, 50) are preferably thermoformed and may be connected by a web (60).
摘要翻译: 一种制造灯的方法,包括在第一片段(48)上形成第一导电迹线(70)之后并且在放置第一多个LED(第一片段)之后,将第一片段(48)形成第一壳部分(110) 90)在第一片段(48)上; 在第二塑料段(50)上形成第二导电迹线(80)之后,在将第二多个LED(90)放置在第二片段上之后,将第二片段(50)形成第二壳部分(120) (50); 以及将所述第一外壳部分(110)和所述第二外壳部分(120)接合到其中限定内部区域(42)的灯泡外壳(40)中。 第一和第二片段(48,50)优选地被热成型,并且可以通过网(60)连接。
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公开(公告)号:US09400086B2
公开(公告)日:2016-07-26
申请号:US14725752
申请日:2015-05-29
发明人: Mark David Lowenthal , William Johnstone Ray , Neil O. Shotton , Richard A. Blanchard , Brad Oraw , Mark Allan Lewandowski , Jeffrey Baldridge , Eric Anthony Perozziello
IPC分类号: F21K99/00 , F21V7/00 , F21V5/04 , F21V23/06 , H01L25/04 , H01L51/52 , H01L51/56 , H01L23/00 , H01L33/50 , H01L25/075 , H01L33/38 , H01L33/48 , F21V3/04 , F21V9/16 , F21V19/00 , F21V23/00 , F21V23/04 , H01L33/06 , H01L33/24 , H01L33/32 , H01L33/62 , F21Y101/02 , F21Y113/00 , F21Y103/00 , F21Y111/00 , H01L33/20
CPC分类号: F21V23/06 , F21K9/232 , F21K9/27 , F21V3/049 , F21V3/06 , F21V5/048 , F21V7/0066 , F21V9/30 , F21V19/0005 , F21V23/003 , F21V23/04 , F21Y2101/00 , F21Y2107/20 , F21Y2115/10 , H01L24/24 , H01L24/95 , H01L25/048 , H01L25/0753 , H01L27/153 , H01L33/06 , H01L33/20 , H01L33/22 , H01L33/24 , H01L33/32 , H01L33/38 , H01L33/382 , H01L33/42 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/58 , H01L33/62 , H01L51/52 , H01L51/5203 , H01L51/56 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2224/95101 , H01L2924/0002 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/13033 , H01L2924/13034 , H01L2924/1305 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/00 , H01L2924/00014
摘要: An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. An exemplary apparatus comprises: a plurality of diodes; at least a trace amount of a first solvent; and a polymeric or resin film at least partially surrounding each diode of the plurality of diodes. Various exemplary diodes have a lateral dimension between about 10 to 50 microns and about 5 to 25 microns in height. Other embodiments may also include a plurality of substantially chemically inert particles having a range of sizes between about 10 to about 50 microns.
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