LED 3D curved lead frame of illumination device
    8.
    发明授权
    LED 3D curved lead frame of illumination device 有权
    LED 3D弯曲引线框架的照明装置

    公开(公告)号:US09557041B2

    公开(公告)日:2017-01-31

    申请号:US13734603

    申请日:2013-01-04

    摘要: This invention relates to separately produce the complicated 3D curved structure and LED 3D curved lead frame to meet the demand of the complicated curved surface illumination of illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination complicated curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them together with transparent material, for example, curved decorative lighting, spherical display advertising board, etc.; this method offers more flexibility for structure and aesthetic design, and fully utilizes the high heat dissipation capacity of main body of metal part.

    摘要翻译: 本发明涉及分别生产复杂的3D弯曲结构和LED 3D弯曲引线框架,以满足照明装置复杂曲面照明的需求。 首先,在3D照明复杂曲面上绘制具有多层引线框架带状结构的照明电路,然后将这些弯曲电路铺设成平面电路,将电路多层引线框架的带状结构拆除为单层电路图案,使用过程 通过导电金属充电胶带的每层电路图案原型,通过反复堆积多盘充电胶带生产多层导电框架带状结构的原型,并将LED芯片安装在安装座上,获得LED扁平引线框架, 然后将导电金属弯曲成3D 3D弯曲引线框架,并将其贴合在发光曲面上,并用透明材料包装,如弯曲装饰照明,球形展示广告板等; 这种方法为结构和美学设计提供了更多的灵活性,并充分利用了金属部件主体的高散热能力。

    Thermoforming a substrate bearing LEDs into a curved bulb enclosure
    9.
    发明授权
    Thermoforming a substrate bearing LEDs into a curved bulb enclosure 有权
    将带有LED的基板热成型为弯曲的灯泡外壳

    公开(公告)号:US09528667B1

    公开(公告)日:2016-12-27

    申请号:US14844796

    申请日:2015-09-03

    IPC分类号: F21V23/00 F21K99/00 H05K3/00

    摘要: A method of manufacturing a lamp comprising forming a first sheet segment (48) into a first shell portion (110) after forming a first electrically conductive trace (70) on the first sheet segment (48) and after placing a first plurality of LEDs (90) on the first sheet segment (48); forming a second sheet segment (50) into a second shell portion (120) after forming a second electrically conductive trace (80) on the second plastic segment (50) and after placing a second plurality of LEDs (90) on the second sheet segment (50); and joining the first shell portion (110) and the second shell portion (120) into a bulb enclosure (40) defining an interior region (42) therein. The first and second sheet segments (48, 50) are preferably thermoformed and may be connected by a web (60).

    摘要翻译: 一种制造灯的方法,包括在第一片段(48)上形成第一导电迹线(70)之后并且在放置第一多个LED(第一片段)之后,将第一片段(48)形成第一壳部分(110) 90)在第一片段(48)上; 在第二塑料段(50)上形成第二导电迹线(80)之后,在将第二多个LED(90)放置在第二片段上之后,将第二片段(50)形成第二壳部分(120) (50); 以及将所述第一外壳部分(110)和所述第二外壳部分(120)接合到其中限定内部区域(42)的灯泡外壳(40)中。 第一和第二片段(48,50)优选地被热成型,并且可以通过网(60)连接。