公开(公告)号：US08056551B2

公开(公告)日：2011-11-15

申请号：US12299019

申请日：2007-10-30

申请人： Lothar Dalitz ,  Rolf Berndt

发明人： Lothar Dalitz ,  Rolf Berndt

IPC分类号： B28D1/06

CPC分类号： B28D5/0076 ,  B28D5/007 ,  B28D5/045 ,  Y02P70/179 ,  Y10T83/2066

摘要： The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices. The method comprises providing a slicing device with a cutting wire equipped on its surface with abrasive particles; providing an aqueous cooling and lubricating fluid, said fluid having an ionic strength corresponding to an electrical conductivity of about 30 IJS/cm or less; cutting said body with said cutting wire into slices while dispensing said cooling and lubricating fluid into a kerf area where said cutting wire contacts and cuts said body, said cooling and lubricating fluid promoting removal of powdered substrate material from said kerf area resulting in spent fluid; and removing said spent fluid from said cutting device and recovering said powdered substrate material from said spent fluid.

摘要翻译： 本发明涉及从衬底材料的主体制造晶片状切片的方法和系统，特别是用于制造半导体器件。 该方法包括提供具有在其表面上装有磨料颗粒的切割线的切片装置; 提供水性冷却和润滑流体，所述流体具有对应于约30IJS / cm或更小的电导率的离子强度; 将所述切割线切割成切片，同时将所述冷却和润滑流体分配到所述切割线接触并切割所述主体的切口区域中，所述冷却和润滑流体促进粉碎的基底材料从所述切口区域移除，导致废流体; 以及从所述切割装置中去除所述废流体并从所述废流体回收所述粉末状基材。

公开(公告)号：US20100170495A1

公开(公告)日：2010-07-08

申请号：US12299019

申请日：2007-10-30

申请人： Lothar Dalitz ,  Rolf Berndt

发明人： Lothar Dalitz ,  Rolf Berndt

IPC分类号： B28D5/00 ,  B28D1/08 ,  B23Q11/10 ,  B28D7/02

CPC分类号： B28D5/0076 ,  B28D5/007 ,  B28D5/045 ,  Y02P70/179 ,  Y10T83/2066

摘要： The present invention relates to a method and a system for manufacturing wafer-like slices from a body of a substrate material, especially for use in the manufacture of semiconductor devices.The method comprises providing a slicing device with a cutting wire equipped on its surface with abrasive particles; providing an aqueous cooling and lubricating fluid, said fluid having an ionic strength corresponding to an electrical conductivity of about 30 μS/cm or less; cutting said body with said cutting wire into slices while dispensing said cooling and lubricating fluid into a kerf area where said cutting wire contacts and cuts said body, said cooling and lubricating fluid promoting removal of powdered substrate material from said kerf area resulting in spent fluid; and removing said spent fluid from said cutting device and recovering said powdered substrate material from said spent fluid.The system comprises a slicing device provided with a cutting wire, said cutting wire being equipped on its surface with abrasive particles, said slicing device comprising a dispensing unit for delivering a cooling and lubricating fluid to a kerf area where said cutting wire contacts and cuts said body; wherein said fluid promotes removal of powdered substrate material from said kerf area resulting in spent cooling and lubricating fluid; a draining unit for removing said spent fluid from said slicing device; and a fluid reclamation device for treating said spent fluid, said reclamation device comprising a first filtering unit for separating and recovering said powdered substrate material from said spent fluid and providing a reusable fluid.

摘要翻译： 本发明涉及从衬底材料的主体制造晶片状切片的方法和系统，特别是用于制造半导体器件。 该方法包括提供具有在其表面上装有磨料颗粒的切割线的切片装置; 提供水性冷却和润滑流体，所述流体具有对应于约30μS/ cm或更小的电导率的离子强度; 将所述切割线切割成切片，同时将所述冷却和润滑流体分配到所述切割线接触并切割所述主体的切口区域中，所述冷却和润滑流体促进粉碎的基底材料从所述切口区域移除，导致废流体; 以及从所述切割装置中去除所述废流体并从所述废流体回收所述粉末状基材。 该系统包括设置有切割线的切片装置，所述切割线在其表面上装有研磨颗粒，所述切片装置包括分配单元，用于将冷却和润滑流体输送到所述切割丝接触并切割所述切割线的切口区域 身体; 其中所述流体促进从所述切口区域去除粉末状基底材料，导致用过的冷却和润滑流体; 用于从所述切片装置去除所述废流体的排出单元; 以及用于处理所述废流体的流体回收装置，所述回收装置包括第一过滤单元，用于从所述废流体分离和回收所述粉末状基材，并提供可重复使用的流体。

公开(公告)号：US06916425B2

公开(公告)日：2005-07-12

申请号：US09837755

申请日：2001-04-19

申请人： Markus Lotz ,  Horst Randhahn ,  Rolf Berndt ,  Gebhardt Muller

发明人： Markus Lotz ,  Horst Randhahn ,  Rolf Berndt ,  Gebhardt Muller

IPC分类号： C12C7/16 ,  B01D61/00

CPC分类号： C12C7/165 ,  C12C7/16 ,  C12C7/163

摘要： Specification discloses the use of a dynamic cross-flow filtration system for the filtration of mash. Also disclosed are a mashing process, wherein mash is filtered and wort is obtained, and a process for the preparation of beer, as well as apparatuses and devices for performing one or more of these process.

摘要翻译： 规范公开了使用动态交叉流过滤系统进行过滤麦芽汁。 还公开了糖化方法，其中过滤麦芽汁并获得麦芽汁，以及用于制备啤酒的方法，以及用于进行这些方法中的一种或多种的装置和装置。

公开(公告)号：US08940174B2

公开(公告)日：2015-01-27

申请号：US12299017

申请日：2007-10-30

申请人： Rolf Berndt ,  Jochen Ruth

发明人： Rolf Berndt ,  Jochen Ruth

IPC分类号： B01D37/00 ,  C09K3/14 ,  B01D36/04 ,  B01D21/00 ,  C10M175/00 ,  B24B57/00

CPC分类号： C10M175/0058 ,  B24B57/00 ,  C10M2201/061 ,  C10M2209/104 ,  C10N2270/00

摘要： A method for treating spent abrasive slurry obtained from cutting a body of a substrate material into wafer-like slices, the slurry comprising a lubricant fluid, unspent abrasive particles and fines, is disclosed, method comprising separating the spent slurry in a first sedimentation step into a solids concentrate comprising unspent abrasive particles and a solids depleted slurry; and subsequently separating the solids depleted slurry by cross-flow filtration into a fines containing fraction and a solids and fines depleted regenerated lubricant fluid.

摘要翻译： 公开了一种用于处理从基材的主体切割成晶片状切片所得到的磨耗浆料的方法，所述浆料包括润滑剂流体，未稀释的磨料颗粒和细粉，方法包括将第一沉降步骤中的废浆分离成 固体浓缩物包含未使用的磨料颗粒和固体贫化的浆料; 并随后通过交叉流过滤将含固体贫化的浆料分离成含细粉的馏分和固体，并且还清除贫化的再生润滑剂流体。

公开(公告)号：US20100170161A1

公开(公告)日：2010-07-08

申请号：US12299017

申请日：2007-10-30

申请人： Rolf Berndt ,  Jochen Ruth

发明人： Rolf Berndt ,  Jochen Ruth

IPC分类号： B01D37/00 ,  C09K3/14 ,  B01D36/04 ,  B01D21/00

CPC分类号： C10M175/0058 ,  B24B57/00 ,  C10M2201/061 ,  C10M2209/104 ,  C10N2270/00

摘要： The present invention relates to a method and a system for treating spent abrasive slurry obtained from a process for cutting a body of a substrate material into wafer-like slices, said slurry comprising a lubricant fluid, unspent abrasive particles and fines.The method comprises separating the spent slurry in a first sedimentation step into a solids concentrate comprising unspent abrasive particles and a solids depleted slurry; and subsequently separating the solids depleted slurry by cross-flow filtration into a fines containing fraction and a solids and fines depleted regenerated lubricant fluid.The corresponding system comprises a first sedimentation device having an inlet for spent abrasive slurry, a sedimentation unit, a first outlet for discharging a solids concentrate and a second outlet for discharging a solids depleted slurry from said sedimentation unit; a cross-flow filtration device having an inlet for said solids depleted slurry in fluid communication with said second outlet of said sedimentation device, a first outlet for discharging a fines containing fraction and a second outlet for discharging a solids and fines depleted regenerated lubricant fluid from said cross-flow filtration device; and a conduit means providing fluid communication between said second outlet of said first sedimentation device and said inlet of said cross-flow filtration device.

摘要翻译： 本发明涉及一种用于处理从用于将基底材料的主体切割成晶片状切片的方法获得的废磨料浆料的方法和系统，所述浆料包含润滑剂流体，未稀释的磨料颗粒和细粒。 该方法包括在第一沉降步骤中将废浆分离成固体浓缩物，其包含未用量的磨料颗粒和固体贫化浆料; 并随后通过交叉流过滤将含固体贫化的浆料分离成含细粉的馏分和固体，并且还清除贫化的再生润滑剂流体。 相应的系统包括具有用于废磨料浆料的入口的第一沉降装置，沉降单元，用于排出固体浓缩物的第一出口和用于从所述沉降单元排出固体贫化浆料的第二出口; 交叉流过滤装置，具有用于所述固体耗尽浆料的入口，所述入口与所述沉降装置的所述第二出口流体连通，用于排出含细粉的馏分的第一出口和用于排出固体的第二出口，并将贫化的再生润滑剂流体从 所述交叉流过滤装置; 以及导管，其提供所述第一沉降装置的所述第二出口和所述交叉流过滤装置的所述入口之间的流体连通。