公开(公告)号：US12109729B2

公开(公告)日：2024-10-08

申请号：US17779498

申请日：2020-11-24

申请人： EGUN CO., LTD.

发明人： Sung Jun Lee ,  Chae Mun Lee

IPC分类号： B28D7/02 ,  B23D57/00 ,  B23D59/00 ,  B23D61/18 ,  B24B27/06 ,  B28D1/08 ,  B28D5/00 ,  B28D5/04 ,  B24B55/02

CPC分类号： B28D7/02 ,  B23D57/0007 ,  B23D57/0061 ,  B23D59/006 ,  B23D61/185 ,  B28D1/08 ,  B28D5/0076 ,  B28D5/042 ,  B28D5/045 ,  B24B27/0633 ,  B24B55/02

摘要： This wire saw machine having a dust collecting apparatus comprises a main roller for moving a wire by rotation; a first pulley system including a first upper dust collecting roller, a first lower dust collecting roller, and a first support roller; a second pulley system including a second upper dust collecting roller, a second lower dust collecting roller, and a second support roller; and a dust collecting unit which is provided under the first pulley system and the second pulley system to collect foreign substances that escape from the first pulley system and the second pulley system.

公开(公告)号：US11890783B2

公开(公告)日：2024-02-06

申请号：US17232204

申请日：2021-04-16

申请人： DISCO CORPORATION

发明人： Xiaoming Qiu

IPC分类号： B28D5/00 ,  B23K26/53 ,  B23K103/00 ,  B23K101/40 ,  H01L29/16

CPC分类号： B28D5/0011 ,  B23K26/53 ,  B28D5/0076 ,  B23K2101/40 ,  B23K2103/52 ,  B28D5/0094 ,  H01L29/1608

摘要： A production method of a wafer includes a wafer production step in which ultrasonic water is ejected against an end face of an ingot with cleavage layers created therein, thereby severing the wafer from a rest of the ingot to produce the wafer.

公开(公告)号：US20160271835A1

公开(公告)日：2016-09-22

申请号：US15072679

申请日：2016-03-17

申请人： DISCO CORPORATION

发明人： Takuya Kato ,  Takeomi Fukuoka

IPC分类号： B28D5/02 ,  B28D5/00 ,  H01L21/67 ,  B23Q11/08

CPC分类号： B28D5/024 ,  B23Q11/0816 ,  B28D5/0076 ,  H01L21/67092 ,  H01L24/97 ,  H01L2924/181 ,  H01L2924/00012

摘要： A cutting apparatus includes a holding table for holding a workpiece, a feeding unit for moving the holding table in a feeding direction, first and second bellows connected to opposite ends of the holding table in the feeding direction, each of the bellows having an upper wall and opposite side walls adapted to be expanded and contracted for covering the feeding unit, a pair of drain channels provided along the sides of both bellows for receiving cutting water used in cutting the workpiece, and a scrap receptacle provided at the downstream end of the first bellows in the feeding direction for receiving scraps generated from the workpiece in cutting the workpiece. The cutting apparatus further includes a pair of fall prevention plates provided along the pair of drain channels for preventing scraps scattered onto the upper wall of the first bellows from falling into the drain channels.

摘要翻译： 一种切割装置，包括：用于保持工件的保持台，用于沿进给方向移动保持台的进给单元，沿着进给方向连接到保持台的相对端的第一和第二波纹管，每个波纹管具有上壁 以及适于膨胀和收缩以覆盖进给单元的相对侧壁，沿着两个波纹管的侧面设置的一对排水通道，用于接收用于切割工件的切割水;以及废料容器，设置在第一 沿进给方向的波纹管，用于在切割工件时接收从工件产生的废料。 切割装置还包括沿着该对排水通道设置的一对防坠落板，用于防止分散在第一波纹管的上壁上的碎屑落入排水通道。

公开(公告)号：US09381673B2

公开(公告)日：2016-07-05

申请号：US14255157

申请日：2014-04-17

申请人： DISCO CORPORATION

发明人： Michael Gadd

IPC分类号： B28D5/00

CPC分类号： B28D5/0076

摘要： A blade cover covers a cutting blade mounted on a spindle. The blade cover has a bottom portion formed with an opening from which the lower end of the cutting blade projects. A cutting fluid is supplied to the upper surface of a workpiece in the periphery of the opening of the blade cover. A discharge opening is formed in the blade cover. Air is sucked from the discharge opening by a vacuum source. The cutting fluid supplied to the upper surface of the workpiece is taken from the opening into the blade cover in association with the rotation of the cutting blade and thereafter discharged from the discharge opening to the outside of the blade cover. Accordingly, scattering of the cutting fluid can be suppressed.

摘要翻译： 刀片盖覆盖安装在主轴上的切割刀片。 叶片盖具有形成有切割刀片的下端突出的开口的底部。 在叶片盖的开口的周边，将切削液供给到工件的上表面。 排出口形成在叶片盖中。 空气通过真空源从排出口吸入。 供给到工件的上表面的切削液与切割刀片的旋转相关联地从开口取入叶片盖，然后从排出口排出到叶片盖的外部。 因此，能够抑制切削液的散射。

公开(公告)号：US09346188B2

公开(公告)日：2016-05-24

申请号：US13749804

申请日：2013-01-25

申请人： Siltronic AG

发明人： Georg Pietsch

IPC分类号： B28D5/04 ,  B28D5/00

CPC分类号： B28D5/045 ,  B28D5/007 ,  B28D5/0076 ,  Y02P70/179

摘要： A method and apparatus are used to simultaneously slice a multiplicity of slices from a workpiece. The workpiece is held with a feed device so as to position an axis of the workpiece parallel to axes of wire guide rolls of a wire saw and is moved from above through a web of the wire saw. A slurry is supplied as abrasive to wire sections of the web while the wire sections are moved relative to the workpiece. The relative movement guides the wire sections from an entry side to an exit side through the workpiece. A coolant is sprayed from the side and below through nozzles into slicing gaps in the workpiece. The nozzles are arranged below the web parallel to the axes of the wire guide rolls. The coolant is sprayed into the slicing gaps through a nozzle situated opposite the entry side of the respective wire section.

摘要翻译： 使用方法和装置来同时从工件切片多个切片。 工件用进给装置保持，以使工件的轴线平行于线锯的导丝辊的轴线，并从上方通过线锯的腹板移动。 当线材部分相对于工件移动时，浆料作为研磨剂供应到幅材的线材部分。 相对运动将导线部分从进入侧引导到出口侧通过工件。 冷却剂从侧面和下方通过喷嘴喷射到工件中的切割间隙中。 喷嘴布置在平行于导线辊的轴线的腹板的下方。 冷却剂通过位于相应电线部分的入口侧相对的喷嘴喷射到切片间隙中。

公开(公告)号：US09314892B2

公开(公告)日：2016-04-19

申请号：US13554363

申请日：2012-07-20

申请人： Koji Sato ,  Takehisa Minowa ,  Takaharu Yamaguchi ,  Takayuki Hasegawa ,  Kazuhito Akada

发明人： Koji Sato ,  Takehisa Minowa ,  Takaharu Yamaguchi ,  Takayuki Hasegawa ,  Kazuhito Akada

IPC分类号： B24D5/10 ,  B28D7/02 ,  B24B1/00 ,  B24B27/06 ,  B28D5/00 ,  B28D5/02

CPC分类号： B24B1/00 ,  B24B27/0658 ,  B24B27/0675 ,  B28D5/0076 ,  B28D5/029

摘要： In a method for multiple cutoff machining a rare earth magnet block, a cutting fluid feed nozzle having a plurality of slits is combined with a plurality of cutoff abrasive blades coaxially mounted on a rotating shaft, each said blade comprising a base disk and a peripheral cutting part. The slits in the feed nozzle into which the outer peripheral portions of cutoff abrasive blades are inserted serve to restrict any axial run-out of the cutoff abrasive blades during rotation. Cutting fluid is fed from the feed nozzle through slits to the rotating cutoff abrasive blades and eventually to points of cutoff machining on the magnet block.

公开(公告)号：US20160016331A1

公开(公告)日：2016-01-21

申请号：US14800904

申请日：2015-07-16

申请人： Disco Corporation

发明人： Ryosuke Nagao

IPC分类号： B28D7/04 ,  B24B55/02 ,  B24B27/06

CPC分类号： B28D7/046 ,  B24B27/0683 ,  B24B41/068 ,  B24B49/08 ,  B24B55/02 ,  B24B55/03 ,  B25B11/005 ,  B28D5/0076 ,  B28D5/0094 ,  H01L21/67017 ,  H01L21/67253 ,  H01L21/6838

摘要： A processing apparatus includes a chuck table for holding a plate-like workpiece under suction. A suction unit is connected to the chuck table, and a processing unit is configured to process the workpiece while supplying processing water to the workpiece. The suction unit includes a first suction source, a first pipe providing fluid communication between the first suction source and the chuck table, a separator arranged in the first pipe, for separating a gas and a liquid drawn in from the chuck table, and a water discharging unit configured to discharge the liquid separated by the separator. The water discharging unit includes a second suction source, a second pipe providing fluid communication between the second suction source and a water discharge port of the separator, and a check valve arranged in the second pipe, for preventing a fluid from flowing from the second suction source to the separator.

摘要翻译： 一种处理装置，包括用于在抽吸下保持板状工件的卡盘台。 抽吸单元连接到卡盘台，并且处理单元构造成在向工件提供加工水的同时处理工件。 抽吸单元包括第一吸入源，提供第一吸入源和卡盘台之间的流体连通的第一管，布置在第一管中的分离器，用于分离气体和从卡盘吸入的液体;以及水 排出单元，其构造成排出由分离器分离的液体。 排水单元包括第二抽吸源，第二管道，其在第二抽吸源和分离器的排水口之间提供流体连通，以及设置在第二管中的止回阀，用于防止流体从第二抽吸 来源到分隔符。

公开(公告)号：US08875537B1

公开(公告)日：2014-11-04

申请号：US12070191

申请日：2008-02-14

申请人： Sorasak Utathin ,  Sukunya Kitcharaenthamrong ,  Nopnarintr Rabuapin

发明人： Sorasak Utathin ,  Sukunya Kitcharaenthamrong ,  Nopnarintr Rabuapin

IPC分类号： F25D17/02

CPC分类号： F28D15/00 ,  B28D5/0076 ,  F28D2021/0019 ,  H01L21/67092 ,  H01L21/67109

摘要： A system for cooling at least one singlulation saw used to singulate components from a substrate. The system is comprised of a coolant loop having at one or more coolant delivery element, a coolant collection element, one or more recycle tanks for contaminate particles to settle out of the captured coolant, a mixing tank configured after the recycle tanks within the loop to produce and replace lost coolant, and a cooling element to cool the coolant. The system can also include filters within the loop to remove particles not removed by the settling tank. Further, the system is able to be configured with a holding tank configured to prevent any bubbles from getting to the coolant delivery element.

摘要翻译： 用于冷却至少一个用于从基底分离组分的单一锯的系统。 该系统由在一个或多个冷却剂输送元件，冷却剂收集元件，一个或多个用于污染颗粒沉淀出捕获的冷却剂的一个或多个再循环罐组成的冷却剂回路构成，混合罐被配置在回路内的回收罐之后 生产和更换损失的冷却液，以及冷却元件以冷却冷却液。 该系统还可以包括循环内的过滤器以除去沉淀槽未被除去的颗粒。 此外，该系统能够配置有配置成防止任何气泡进入冷却剂输送元件的保持箱。

公开(公告)号：US08567384B2

公开(公告)日：2013-10-29

申请号：US12449484

申请日：2008-01-24

申请人： Hiroshi Oishi ,  Koji Kitagawa ,  Hideo Kudo

发明人： Hiroshi Oishi ,  Koji Kitagawa ,  Hideo Kudo

IPC分类号： B28D1/08

CPC分类号： B28D5/0064 ,  B28D5/0076 ,  B28D5/045

摘要： The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened.

摘要翻译： 本发明涉及一种用于通过将线缠绕在多个带槽辊上并将线压在锭上并将线移动并将切片浆料供应到带槽辊的方法来切割晶片形式的方法，其中 当锭被切片时，测量锭在轴向上变化的位移量，并且控制带槽辊的轴向位移量，以便对应于测量的锭的轴向位移量，从而， 在控制线相对于锭的整个长度在轴向方向上的相对位置的同时对锭进行切片。 结果，提供了一种切片方法和线锯装置，其可以执行切片，使得可以通过例如通过控制内置在锭中的切片路径来减少通过切片获得的晶片中的弓或翘曲 使得特别是切片路径变平。

公开(公告)号：US20130228160A1

公开(公告)日：2013-09-05

申请号：US13824254

申请日：2011-10-05

申请人： Mohan Menon ,  Anne Lohne ,  Erik Sauar ,  Stian Sannes

发明人： Mohan Menon ,  Anne Lohne ,  Erik Sauar ,  Stian Sannes

IPC分类号： C09K3/14 ,  B28D1/02

CPC分类号： C09K3/1472 ,  B28D1/025 ,  B28D5/007 ,  B28D5/0076 ,  H01L31/1804 ,  H01L31/184 ,  Y02E10/544 ,  Y02E10/547 ,  Y02P70/179 ,  Y02P70/521

摘要： The present invention relates to a method for production of photovoltaic wafers and abrasive slurries for multi-wire sawing of wafers for photovoltaic applications, and more specific to abrasive slurries which are easy to remove from the wafers after sawing, where the abrasive slurry comprises one part recycled abrasive slurry, an alkali in sufficient amount to provide a pH in the abrasive slurry mixture in the range from 6.0 to 9.0, and one part novel abrasive slurry in an amount sufficient to provide an ion content in the abrasive slurry mixture to provide an electric conductivity of less than 50 μS/cm.

摘要翻译： 本发明涉及用于生产用于光伏应用的晶片的多线锯切的光伏晶片和研磨浆料的方法，更具体地涉及在锯切之后容易从晶片上移除的磨料浆料，其中磨料浆料包括一部分 回收的磨料浆料，足够量的碱以在磨料浆料混合物中提供6.0至9.0范围内的pH，以及一份新的研磨浆料，其量足以在磨料浆料混合物中提供离子含量以提供电 电导率小于50μS/ cm。