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公开(公告)号：US06974489B2
公开(公告)日：2005-12-13
申请号：US10687472
申请日：2003-10-16
申请人： Louis Edward Behrens , Matthew Allen Butterbaugh , Don A. Gilliland , Maurice Francis Holahan , Paul Daniel Pederson, Jr.
发明人： Louis Edward Behrens , Matthew Allen Butterbaugh , Don A. Gilliland , Maurice Francis Holahan , Paul Daniel Pederson, Jr.
CPC分类号： H05K9/0043 , G06F1/182 , G06F1/20 , G06F1/203 , H05K9/0018
摘要： There is disclosed an apparatus and method for protecting electronic devices against excessive heat build-up and particulate infiltration while implementing EMC shielding.
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2.发明申请Cooling Plate Assembly with Fixed and Articulated Interfaces, and Method for Producing Same 审中-公开具有固定和铰接式接口的冷却板组件及其制造方法公开(公告)号：US20090213541A1
公开(公告)日：2009-08-27
申请号：US12038227
申请日：2008-02-27
CPC分类号： H01L23/473 , H01L2224/16225 , H01L2924/10253 , H05K1/0206 , Y10T29/49826 , H01L2924/00
摘要： A cooling plate assembly for transferring heat from electronic components mounted on a circuit board includes both fixed and articulated interfaces. A fixed-gap coldplate is positioned over and in thermal contact with (e.g., through an elastomerically compressive pad thermal interface material) electronic components mounted on the circuit board's top surface. An articulated coldplate is positioned over and in thermal contact with at least one electronic component mounted on the circuit board's top surface. In the preferred embodiments, the articulated coldplate is spring-loaded against one or more high power processor components having power dissipation greater than that of the electronic components under the fixed-gap cooling plate. Thermal dissipation channels in the coldplates are interconnected by flexible tubing, such as copper tubing with a free-expansion loop. In the preferred embodiments, the coldplates and the flexible tubing are connected to define a portion of a single flow loop used to circulate cooling fluid through the coldplates.
摘要翻译： 用于从安装在电路板上的电子部件传送热量的冷却板组件包括固定和铰接接口。 固定间隙冷板定位在安装在电路板顶表面上的电子部件的上方（例如，通过弹性体压缩垫热界面材料）热接触。 铰接的冷板被放置在安装在电路板顶表面上的至少一个电子部件上并与之热接触。 在优选实施例中，铰接式冷板对于一个或多个具有大于固定间隙冷却板下面的电子部件功率耗散的大功率处理器部件的弹簧加载。 冷板中的散热通道由柔性管相互连接，例如具有自由膨胀回路的铜管。 在优选实施例中，冷板和柔性管被连接以限定用于使冷却流体循环通过冷板的单个流动循环的一部分。
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公开(公告)号：US06595605B1
公开(公告)日：2003-07-22
申请号：US09712502
申请日：2000-11-14
申请人： Raymond Floyd Babcock , Matthew Allen Butterbaugh , David George Lund , John Harold Mohlke , Christopher Lee Tuma
发明人： Raymond Floyd Babcock , Matthew Allen Butterbaugh , David George Lund , John Harold Mohlke , Christopher Lee Tuma
IPC分类号： H05K718
CPC分类号： G11B33/127 , G06F1/181 , G11B33/027 , H05K5/0217 , Y10T292/0902
摘要： A chassis for a computer, computer related or other electronic device includes a door that closes an access opening in the chassis when in the closed position and permits access to the interior of the chassis when opened for a user or service technician. A latch releasably secures the door in the closed position and is operable by a user or service technician for opening the door from the closed position and closing the door from the open position without the benefit of a screwdriver, wrench or other tool. In selected embodiments, the latch is biased to account for compression reaction forces of a seal or gasket surrounding the access opening while still providing for manual manipulation of the door and access to the interior of the chassis.
摘要翻译： 用于计算机，计算机相关或其他电子设备的底盘包括门，当在处于关闭位置时关闭底盘中的进入开口，并且当为用户或服务技术人员打开时允许进入底盘的内部。 闩锁可释放地将门固定在关闭位置，并且可由用户或维修技术人员操作以将门从关闭位置打开，并且将门从打开位置关闭，而无需螺丝刀，扳手或其他工具。 在选择的实施例中，闩锁被偏置以考虑围绕进入开口的密封件或垫圈的压缩反作用力，同时仍然提供手动操纵门和进入底盘的内部。
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公开(公告)号：US06517369B1
公开(公告)日：2003-02-11
申请号：US10098791
申请日：2002-03-14
IPC分类号： H01R1362
CPC分类号： H01R12/707 , H01R13/639
摘要： A bracket/collar is disclosed to circumscribe an integrated circuit card into an electrical or an optical connector. The bracket/collar has several features, such as grooves, to hold the circuit card into the bracket; the grooves may be on any available edge not mating with or held by the connector, and may hold a corner or other feature of the circuit card. Another feature of the bracket/collar is a mechanism, such as a hook or notch, to connect with the connector. Yet another feature of the bracket/collar is that, by its shape, it provides sufficient loading of the circuit card into the connector so that when dropped or otherwise mechanically shocked, the circuit card is not displaced from its connector. The bracket/collar is especially useful to secure DIMM memory cards within their electrical connectors in handheld computers.
摘要翻译： 公开了用于将集成电路卡包围到电连接器或光连接器中的支架/套环。 支架/轴环具有几个特征，例如凹槽，用于将电路卡固定到支架中; 凹槽可以在不与连接器配合或保持的任何可用边缘上，并且可以保持电路卡的拐角或其他特征。 支架/轴环的另一个特征是与连接器连接的机构，例如钩子或凹口。 支架/轴环的另一个特征是，通过其形状，其将电路卡充分加载到连接器中，使得当掉落或以其他方式机械震动时，电路卡不会从其连接器移位。 支架/套环特别适用于在手持式计算机的电气连接器内保护DIMM存储卡。
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公开(公告)号：US06283512B1
公开(公告)日：2001-09-04
申请号：US09371128
申请日：1999-08-10
IPC分类号： E05C1906
CPC分类号： F16B5/065 , E05B65/006 , E05C19/06 , F16B2/04 , H05K5/0221 , Y10T24/42 , Y10T292/0902
摘要： A panel latch 10 includes at least one flexible latch member 24, 26 having a base portion 36, a first leg 32, and a second leg 34 attached to the first leg via the base portion. The flexible latch member 24, 26 further has a latch portion 46 and a stop member 82 disposed on the first leg 32. The latch portion 46 is separated from the stop member 82 to accommodate therebetween at least two separate parts 12, 14 that are to be latched together. The legs 32, 34 of the flexible latch member can be flexed so as to shift the latch portion 46 and the stop member 82 in a direction toward the second leg 34 to allow the two parts 12, 14 to be unlatched from each other. A generally U-shaped, rigid latch retaining member 28 is provided that has a first leg 54 with free end. A second leg 56 of the latch retaining member 28 is connected to the flexible latch member 24, 26. The first leg 54 of the latch retaining member has a catch portion 68 and a stop member 74 disposed thereon in a region of the free end to accommodate and hold therebetween only one 12 of the at least two separate parts that are to be latched together.
摘要翻译： 面板闩锁10包括至少一个柔性闩锁构件24,26，其具有基部36，第一腿32和经由基部附接到第一腿的第二腿34。 弹性闩锁构件24,26还具有闩锁部分46和设置在第一腿部32上的止动构件82.闩锁部分46与止动构件82分离，以在其间容纳至少两个分开的部分12,14， 被锁在一起 弹性闩锁构件的腿部32,34可以弯曲，以使闩锁部分46和止动构件82朝向第二腿部34的方向移动，以允许两个部件12,14彼此解锁。 提供了一种大致U形刚性的闩锁保持构件28，其具有带自由端的第一腿部54。 闩锁保持构件28的第二腿部56连接到柔性闩锁构件24,26。闩锁保持构件的第一腿部54具有在自由端的区域中设置在其上的卡扣部分68和止动构件74， 容纳和保持在一起的至少两个分离部件中的一个12。
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公开(公告)号：US5923531A
公开(公告)日：1999-07-13
申请号：US950370
申请日：1997-10-14
申请人： Wesley H. Bachman , Douglas A. Baska , Matthew Allen Butterbaugh , Sukhvinder Singh Kang , Kenneth Edward Lubahn , Brian Scott Mullenbach , Kevin Robert Qualters
发明人： Wesley H. Bachman , Douglas A. Baska , Matthew Allen Butterbaugh , Sukhvinder Singh Kang , Kenneth Edward Lubahn , Brian Scott Mullenbach , Kevin Robert Qualters
CPC分类号： H05K7/20718 , H05K1/14
摘要： A computer arrangement includes an electronics enclosure located within a computer housing, which is divided into a plurality of physically separated cooling zones. The enclosure has a plurality of inlet and outlet openings. Each cooling zone is in registration with respective inlet and outlet openings. A backplane is disposed within the electronics enclosure, and has front and rear surfaces. A first electrical component is attached to one of the surfaces and is arranged in one of the cooling zones. At least one circuit board is disposed within the electronics enclosure and is attached to the front surface of the backplane. The circuit board has a second electrical component attached to a surface thereof, which is arranged in another one of the cooling zones. A system operation card is disposed within the electronics enclosure, and is attached to the rear surface of the backplane. A gas moving device is located outside of the electronics enclosure, and is activatable to cause a cooling gas to flow through the cooling zones. The inlet and outlet openings are sized so that the cooling zones receive only an amount of cooling gas necessary to cool the respective electrical components located therein.
摘要翻译： 计算机装置包括位于计算机外壳内的电子外壳，其被分成多个物理分离的冷却区。 外壳具有多个入口和出口。 每个冷却区域与相应的入口和出口开口对齐。 背板设置在电子外壳内，并具有前表面和后表面。 第一电气部件附接到一个表面并且布置在其中一个冷却区域中。 至少一个电路板设置在电子设备外壳内并附接到背板的前表面。 电路板具有附接到其表面的第二电气部件，其布置在另一个冷却区域中。 系统操作卡设置在电子外壳内，并附接到背板的后表面。 气体移动装置位于电子外壳外部，并且可激活以使冷却气体流过冷却区。 入口和出口开口的尺寸设定为使得冷却区域仅接收冷却位于其中的相应电气部件所需的一定量的冷却气体。
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公开(公告)号：US06592195B2
公开(公告)日：2003-07-15
申请号：US09751532
申请日：2000-12-29
IPC分类号： A47B9600
CPC分类号： G06F1/181 , H05K7/1409 , Y10S439/923
摘要： A cover is operable to seat and unseat electronic components. The cover is detached from an enclosure exposing an access opening. An electronic component, such as an expansion card, is inserted by an operator into guide rails housed within the opening. A first catch mechanism of the cover pivotally engages the opening so as to form a lever arm. A second catch mechanism connects with a mating catch of the electronic component. The component traverses the guide rails according to the rotation of the cover. The mechanical advantage realized by the cover overcomes the forces associated with seating and detaching connector pins of the electronic component with sockets of an expansion bus. The cover detaches from both the component and the enclosure prior to being repositioned to overlap the opening.
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公开(公告)号：US6061240A
公开(公告)日：2000-05-09
申请号：US153607
申请日：1998-09-15
CPC分类号： H05K1/0206 , H01L23/4093 , H01L2224/16 , H05K2201/10598 , H05K3/0061
摘要： An array of electronic modules on the top of a circuit board is cooled by a heat sink secured to the bottom of the board. Vias transfer heat through the board to a compliant interface pad which permits heat to flow to the heat sink while maintaining electrical isolation between the vias. The heat sink is held on the board by push pin assemblies including springs that compress the interface pad between the circuit board and the heat sink. The body of each push pin assembly includes flexing legs supporting locking barbs, and flex of the legs is limited by a strut defining a closed end slot in the shank of the body.
摘要翻译： 电路板顶部的电子模块阵列由固定在电路板底部的散热片冷却。 通孔将热量通过板传递到兼容的接口焊盘，其允许热量流过散热器，同时保持通孔之间的电隔离。 散热器通过包括弹簧的推销组件保持在电路板上，弹簧压缩电路板和散热器之间的接口焊盘。 每个推销组件的主体包括支撑锁定倒钩的弯曲腿，并且腿的弯曲受限于在主体的柄部中限定封闭端部狭槽的支柱。
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公开(公告)号：US5870286A
公开(公告)日：1999-02-09
申请号：US915059
申请日：1997-08-20
CPC分类号： H05K1/0206 , H01L23/4093 , H01L2224/16 , H05K2201/10598 , H05K3/0061
摘要： An array of electronic modules on the top of a circuit board is cooled by a heat sink secured to the bottom of the board. Vias transfer heat through the board to a compliant interface pad which permits heat to flow to the heat sink while maintaining electrical isolation between the vias. The heat sink is held on the board by push pin assemblies including springs that compress the interface pad between the circuit board and the heat sink. The body of each push pin assembly includes flexing legs supporting locking barbs, and flex of the legs is limited by a strut defining a closed end slot in the shank of the body.
摘要翻译： 电路板顶部的电子模块阵列由固定在电路板底部的散热片冷却。 通孔将热量通过板传递到兼容的接口焊盘，其允许热量流过散热器，同时保持通孔之间的电隔离。 散热器通过包括弹簧的推销组件保持在电路板上，弹簧压缩电路板和散热器之间的接口焊盘。 每个推销组件的主体包括支撑锁定倒钩的弯曲腿，并且腿的弯曲受限于在主体的柄部中限定封闭端部狭槽的支柱。
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10.发明申请NESTED FIN INTEGRAL HEAT SINK ASSEMBLY FOR MULTIPLE HIGH POWER ELECTONIC CIRCUIT BOARD MODULES 审中-公开用于多个高功率电子电路板模块的嵌入式熔融整体式散热器组件公开(公告)号：US20090284931A1
公开(公告)日：2009-11-19
申请号：US12121582
申请日：2008-05-15
IPC分类号： H05K7/20
CPC分类号： H05K7/20163 , H05K7/20918
摘要： A method and apparatus for heat sinking for multiple high power circuit board modules, is provided. One implementation involves providing a compact nested fin integral heat sink assembly for each high power circuit board module, and positioning fin sections on the heat sink assembly such that a plurality of nested fin sections emanate from each board side heat spreader plate of the assembly, thereby providing efficient airflow gap, pressure drop, and heat sink base spreading performance. The fin section can be placed essentially directly over high power components on each board module to minimize spreading resistance in a heat sink base of the assembly. The fin sections on each board module side provide channel depth without extending from an opposite side heat sink base, thereby increasing fin surface area for each local region of fins from either heat sink base.
摘要翻译： 提供了一种用于多个高功率电路板模块的散热的方法和装置。 一个实施方案包括为每个高功率电路板模块提供紧凑的嵌套散热片整体式散热器组件，以及在散热器组件上定位翅片部分，使得多个嵌套翅片部分从组件的每个板侧散热板发出，由此 提供高效的气流间隙，压降和散热器底座扩展性能。 翅片部分可以基本上直接放置在每个板模块上的大功率组件上，以最小化组件的散热器底座中的散布阻力。 每个板模块侧的翅片部分提供通道深度而不从相对侧的散热器基座延伸，从而从散热片底座增加翅片的每个局部区域的翅片表面积。
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