Printhead having a plurality of print modes
    1.
    发明申请
    Printhead having a plurality of print modes 有权
    打印头具有多种打印模式

    公开(公告)号:US20070091136A1

    公开(公告)日:2007-04-26

    申请号:US11254456

    申请日:2005-10-20

    IPC分类号: B41J29/393

    摘要: Printheads configured to operate in accordance with a plurality of print modes. For example, one of the plurality of print modes can be selected in accordance with a bit of address data received by the printhead. In an exemplary embodiment, the selection of print mode can be accomplished by switching one or more actuator (e.g., heater) circuit addresses on the printhead.

    摘要翻译: 打印头被配置为根据多种打印模式进行操作。 例如,可以根据由打印头接收到的地址数据的位来选择多个打印模式之一。 在示例性实施例中,可以通过切换打印头上的一个或多个致动器(例如,加热器)电路地址来实现打印模式的选择。

    Inkjet actuator substrate having at least one non-uniform ink via
    2.
    发明申请
    Inkjet actuator substrate having at least one non-uniform ink via 审中-公开
    具有至少一个非均匀油墨通孔的喷墨致动器基板

    公开(公告)号:US20070176982A1

    公开(公告)日:2007-08-02

    申请号:US11345092

    申请日:2006-02-01

    IPC分类号: B41J2/175

    摘要: Inkjet printheads and actuator chips, such as an inkjet printhead actuator chip having a substrate, ink vias formed in the substrate, and columnar arrays of actuators in operational communication with the ink vias. At least one of the ink vias has at least one of a different length, width and a via to via pitch than another one of the ink vias. Imaging devices for use with the printheads are also disclosed.

    摘要翻译: 喷墨打印头和致动器芯片,例如具有基板的喷墨打印头致动器芯片,形成在基板中的油墨通孔和与油墨通孔操作连通的致动器柱状阵列。 油墨通孔中的至少一个具有与另一个墨通孔不同的长度,宽度和通孔间距中的至少一个。 还公开了与打印头一起使用的成像装置。

    Methods and apparatuses for sensing temperature of multi-via heater chips
    3.
    发明申请
    Methods and apparatuses for sensing temperature of multi-via heater chips 有权
    用于感测多通道加热器芯片温度的方法和装置

    公开(公告)号:US20070153044A1

    公开(公告)日:2007-07-05

    申请号:US11323809

    申请日:2005-12-30

    IPC分类号: B41J29/38

    摘要: Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.

    摘要翻译: 用于与打印装置一起使用的加热器芯片,例如包括基本上邻近第一通孔定位的第一加热器阵列的加热器芯片和基本上邻近第二通孔定位的第二加热器阵列。 加热器芯片还可以包括位于第一加热器阵列和第二加热器阵列之间的区域,以及温度感测元件,其可操作以感测区域的温度,其中温度感测元件相对于该区域基本上居中设置。 根据本发明的一个实施例,温度感测元件包括温度感测电阻器。

    Methods and apparatuses for regulating the temperature of multi-via heater chips
    4.
    发明申请
    Methods and apparatuses for regulating the temperature of multi-via heater chips 有权
    用于调节多通道加热器芯片温度的方法和装置

    公开(公告)号:US20070153045A1

    公开(公告)日:2007-07-05

    申请号:US11324167

    申请日:2005-12-30

    IPC分类号: B41J29/38

    摘要: Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. Additionally, the first heater array and the second heater array are operable to receive heating responsive to the temperature of the region sensed by the temperature sensing element to regulate the temperature of the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor and the heating may occur via non-nucleating heating.

    摘要翻译: 用于与打印装置一起使用的加热器芯片,例如包括基本上邻近第一通孔定位的第一加热器阵列的加热器芯片和基本上邻近第二通孔定位的第二加热器阵列。 加热器芯片还可以包括位于第一加热器阵列和第二加热器阵列之间的区域,以及温度感测元件,其可操作以感测区域的温度,其中温度感测元件相对于该区域基本上居中设置。 另外,第一加热器阵列和第二加热器阵列可操作以响应于由温度感测元件感测的区域的温度接收加热,以调节该区域的温度。 根据本发明的一个实施例,温度感测元件包括温度感测电阻器,并且加热可以通过非成核加热发生。

    Power distribution routing to reduce chip area
    5.
    发明申请
    Power distribution routing to reduce chip area 审中-公开
    配电布线降低芯片面积

    公开(公告)号:US20060232627A1

    公开(公告)日:2006-10-19

    申请号:US11095965

    申请日:2005-03-31

    IPC分类号: B41J2/14

    CPC分类号: B41J2/14072

    摘要: An ejector chip (e.g., a heater chip) has at least one fluid (e.g., ink) via, and an elongated actuator (e.g., a resistive heating element) between an edge of the chip and the via. The chip also has a conductive trace connected to the actuator. The chip also has a bondpad central to the length of the actuator to reduce a length of the conductive trace.

    摘要翻译: 喷射器芯片(例如,加热器芯片)在芯片的边缘和通孔之间具有至少一个流体(例如墨水)通孔和细长致动器(例如,电阻加热元件)。 该芯片还具有连接到执行器的导电迹线。 该芯片还具有对致动器长度的中心的接合垫,以减少导电迹线的长度。

    Heater chip for inkjet printhead with electrostatic discharge protection
    6.
    发明申请
    Heater chip for inkjet printhead with electrostatic discharge protection 有权
    喷墨打印头加热芯片,具有静电放电保护功能

    公开(公告)号:US20060221141A1

    公开(公告)日:2006-10-05

    申请号:US11093144

    申请日:2005-03-29

    申请人: George Parish

    发明人: George Parish

    IPC分类号: B41J2/05

    摘要: An inkjet printhead heater chip includes a resistor layer, a dielectric layer on the resistor layer and a cavitation layer on the dielectric layer. A grounded-gate MOSFET electrically attaches to the cavitation layer to protect the dielectric layer from breakdown during an electrostatic discharge (ESD) event. Protection typically embodies the safe distribution of ESD current to ground during user printhead installation. Locations of the grounded-gate MOSFET(s) include terminal ends of one or more columns of ink ejecting elements formed by the resistor layer. Also, the MOSFET source electrically connects to the gate while the drain attaches to the cavitation layer. The drain attaches via first and second metallization lines, including attachment generally above the cavitation layer. The dielectric layer is diamond like carbon layer and is about 2000 angstroms thick. Inkjet printheads and printers are also disclosed.

    摘要翻译: 喷墨打印头加热器芯片包括电阻层,电阻层上的电介质层和电介质层上的空化层。 接地栅极MOSFET电气连接到空化层,以保护介电层免受静电放电(ESD)事件的击穿。 保护通常体现在用户打印头安装期间ESD电流对地面的安全分配。 接地栅极MOSFET的位置包括由电阻层形成的一列或多列喷墨元件的端部。 此外,MOSFET源极连接到栅极,而漏极连接到空化层。 漏极通过第一和第二金属化线连接,包括通常在空化层上方的附着。 电介质层是类金刚石碳层,厚约2000埃。 还公开了喷墨打印头和打印机。

    Supplying power to logic systems in printers
    7.
    发明申请
    Supplying power to logic systems in printers 有权
    为打印机的逻辑系统供电

    公开(公告)号:US20050134618A1

    公开(公告)日:2005-06-23

    申请号:US10738794

    申请日:2003-12-17

    IPC分类号: B41J2/045 B41J29/38

    摘要: Power is provided from one portion of a printer, such as a printer electronics module, to another portion of the printer, such as a printhead. Logic signals produced in a first electronic module of the printer are transmitted to a second electronics module of the printer. A power signal is derived from the logic signals without interfering with the magnitude or duration of logic signals, and the logic power signal is applied to power the second electronic module without having a separate dedicated power line.

    摘要翻译: 电源从诸如打印机电子模块的打印机的一部分提供到打印机的另一部分,例如打印头。 在打印机的第一电子模块中产生的逻辑信号被传送到打印机的第二电子模块。 功率信号从逻辑信号导出,而不会干扰逻辑信号的幅度或持续时间,并且施加逻辑功率信号以对第二电子模块供电而不需要单独的专用电力线。

    Printhead having embedded memory device
    8.
    发明申请
    Printhead having embedded memory device 有权
    打印头具有嵌入式存储设备

    公开(公告)号:US20050099458A1

    公开(公告)日:2005-05-12

    申请号:US10706457

    申请日:2003-11-12

    IPC分类号: B41J2/05 B41J2/14 B41J2/04

    摘要: A semiconductor substrate for a micro-fluid ejecting device. The semiconductor substrate includes a plurality of fluid ejection devices disposed on the substrate. A plurality of driver transistors are disposed on the substrate for driving the plurality of fluid ejection devices. A programmable memory matrix containing embedded programmable memory devices is operatively connected to the micro-fluid ejecting device for collecting and storing information on the semiconductor substrate for operation of the micro-fluid ejecting device. The programmable memory matrix provides a high density of memory bits embedded on the substrate for storing information about the micro-fluid ejecting device.

    摘要翻译: 一种用于微流体喷射装置的半导体衬底。 半导体衬底包括设置在衬底上的多个流体喷射装置。 多个驱动晶体管设置在基板上用于驱动多个流体喷射装置。 包含嵌入式可编程存储器件的可编程存储器矩阵可操作地连接到微流体喷射装置,用于在半导体衬底上收集和存储信息以便操作微流体喷射装置。 可编程存储器矩阵提供嵌入在衬底上的高密度存储器位,用于存储关于微流体喷射装置的信息。

    MICRO-FLUID EJECTING DEVICE HAVING EMBEDDED MEMORY DEVICES
    9.
    发明申请
    MICRO-FLUID EJECTING DEVICE HAVING EMBEDDED MEMORY DEVICES 有权
    具有嵌入式存储器件的微流体喷射装置

    公开(公告)号:US20070216732A1

    公开(公告)日:2007-09-20

    申请号:US11752551

    申请日:2007-05-23

    IPC分类号: B41J2/05

    摘要: A micro-fluid ejecting device includes a semiconductor substrate, a plurality of fluid ejection elements formed on the semiconductor substrate, and a plurality of nonvolatile programmable memory devices for storing information related to the operation of the micro-fluid ejecting device. The programmable memory devices, which are at least partially embedded in the semiconductor substrate, each include a source region and a drain region formed in the semiconductor substrate. The source and drain regions have a conductivity type which is opposite the conductivity type of the semiconductor substrate. An insulative layer is formed on the semiconductor substrate over the source region and drain region. A floating gate region is formed on the insulative layer and is spatially disposed between the source region and drain region. The floating gate region is electrically insulated from the source and drain regions by the insulative layer. Electrical contacts are connected to the source region and the drain region. The programmable memory devices collectively provide a high density of memory bits embedded on the substrate for storing information about the micro-fluid ejecting device.

    摘要翻译: 微流体喷射装置包括半导体衬底,形成在半导体衬底上的多个流体喷射元件和用于存储与微流体喷射装置的操作有关的信息的多个非易失性可编程存储器件。 至少部分地嵌入在半导体衬底中的可编程存储器件各自包括形成在半导体衬底中的源极区域和漏极区域。 源区和漏区具有与半导体衬底的导电类型相反的导电类型。 在源极区域和漏极区域上的半导体衬底上形成绝缘层。 在绝缘层上形成浮栅区域,并且空间地设置在源极区域和漏极区域之间。 浮置栅极区域通过绝缘层与源极和漏极区域电绝缘。 电触点连接到源区和漏区。 可编程存储器装置共同提供嵌入在衬底上的高密度存储器位,用于存储关于微流体喷射装置的信息。

    Power sensing circuit
    10.
    发明申请
    Power sensing circuit 有权
    功率检测电路

    公开(公告)号:US20060268041A1

    公开(公告)日:2006-11-30

    申请号:US11136832

    申请日:2005-05-25

    IPC分类号: B41J29/393

    CPC分类号: B41J29/393 B41J2/17546

    摘要: A heater chip that includes a circuit element, and a bus that can be used to power the circuit element. The heater chip also includes a feedback circuit that is coupled to the power bus. Particularly, the feedback circuit can be configured to indicate if the bus is powered the circuit element.

    摘要翻译: 一种加热器芯片,其包括电路元件和可用于为电路元件供电的总线。 加热器芯片还包括耦合到电源总线的反馈电路。 特别地,反馈电路可以被配置为指示总线是否为电路元件供电。