HIGH BANDWIDTH RF OR MICROWAVE INTERCONNECTS FOR OPTICAL MODULATORS
    1.
    发明申请
    HIGH BANDWIDTH RF OR MICROWAVE INTERCONNECTS FOR OPTICAL MODULATORS 审中-公开
    光纤调制器的高带宽RF或微波互连

    公开(公告)号:US20160299361A1

    公开(公告)日:2016-10-13

    申请号:US15091307

    申请日:2016-04-05

    Abstract: A radio frequency (RF) interconnect for an optical modulator may comprise a circuit board to route a set of RF signals from a corresponding set of RF feeds to a substrate interface on a surface of a substrate of the optical modulator. The circuit board may be positioned along the surface of the substrate of the optical modulator. The circuit board may include a set of traces. A trace, of the set of traces, may be connected to a corresponding RF feed, of the set of RF feeds, at a height different than a height of the surface of the substrate of the optical modulator. The trace may be connected to the substrate interface.

    Abstract translation: 用于光调制器的射频(RF)互连可以包括电路板,用于将一组RF信号从相应的RF馈送集合路由到光调制器的衬底的表面上的衬底接口。 电路板可以沿着光学调制器的衬底的表面定位。 电路板可以包括一组迹线。 该组迹线中的迹线可以与RF调制器的基板的表面的高度不同的高度连接到RF馈送组中的对应的RF馈送。 迹线可以连接到基板界面。

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