公开(公告)号：US11777066B2

公开(公告)日：2023-10-03

申请号：US17132359

申请日：2020-12-23

申请人： Lumileds LLC

发明人： Tze Yang Hin ,  Hung Khin Wong

IPC分类号： H01L33/62 ,  H01L27/15 ,  H01L33/64 ,  H01L25/16 ,  F21S41/141

CPC分类号： H01L33/62 ,  F21S41/141 ,  H01L25/167 ,  H01L27/156 ,  H01L33/647 ,  H01L2933/0066

摘要： A light-emitting diode (LED) package assembly includes a substrate. The substrate includes a top surface, a bottom surface and an opening formed through the substrate. The opening includes a first portion adjacent the top surface and a second portion adjacent the bottom surface that is wider than the first portion such that portions of the substrate overhang the second portion of the opening. Pads are provided on a bottom surface of the portions of the substrate that overhang the second portion of the opening. The assembly also includes a hybridized device in the opening. The hybridized device includes a silicon backplane that has a top surface, a bottom surface and interconnects on the top surface. The interconnects are electrically coupled to the pads. The hybridized device also includes an LED array on the top surface of the silicon backplane.