公开(公告)号：US10656355B2

公开(公告)日：2020-05-19

申请号：US16413145

申请日：2019-05-15

Applicant: LuxNet Corporation

Inventor： Pi-Cheng Law ,  Po-Chao Huang ,  Hsing-Yen Lin ,  Ya-Hsin Deng ,  Hua-Hsin Su

IPC: G02B6/36 ,  G02B6/42

Abstract: The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.

公开(公告)号：US20180191131A1

公开(公告)日：2018-07-05

申请号：US15670624

申请日：2017-08-07

Applicant: LuxNet Corporation

Inventor： Hsing-Yen Lin ,  Pi-Cheng Law ,  Po-Chao Huang ,  Bo-Wei Liu ,  Ya-Hsin Deng ,  Hua-Hsin Su

IPC: H01S5/024 ,  H01S5/022

CPC classification number: H01S5/02469 ,  H01S5/02236 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02476 ,  H01S5/22 ,  H01S5/4031

Abstract: The invention provides a heat-dissipating semiconductor assembly, comprising: a heat-dissipating substrate, a metal solder layer, and an edge emitting laser diode. The heat-dissipating substrate has one side formed with a flat surface for mounting the edge emitting laser diode. The edge emitting laser diode is mounted on the metal solder layer, and by lowering the active area of the edge emitting laser diode, the active area of the edge emitting laser diode is drawn close to one side of the heat-dissipating substrate. The edge emitting laser diode has an optical output direction parallel to the flat surface of the heat-dissipating substrate, and the heat-dissipating substrate and/or the metal solder layer have a groove. The ridge of the edge emitting laser diode is aligned with an opening formed in the groove of the heat-dissipating substrate, thereby preventing the heat-dissipating substrate and metal solder layer from contacting the ridge of the edge emitting laser diode.