公开(公告)号：US09854674B1

公开(公告)日：2017-12-26

申请号：US15460683

申请日：2017-03-16

Applicant: LuxNet Corporation

Inventor： Ho-I Chen ,  Yi-Ching Chiu ,  Bo-Wei Liu ,  Hsing-Yen Lin ,  Hua-Hsin Su

IPC: H05K1/00 ,  H05K1/14 ,  H01R12/61 ,  H01R4/02 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/141 ,  H01R4/02 ,  H01R4/021 ,  H01R12/61 ,  H01R12/62 ,  H01R12/707 ,  H05K1/0245 ,  H05K1/112 ,  H05K2201/041 ,  H05K2201/058

Abstract: A flexible printed circuit and printed circuit board soldered structure is provided. The structure includes signal transmission lines which dispense with any through hole, thereby enhancing integrity of high-frequency signals. The special design of the signal line structure of the flexible printed circuit and the printed circuit board together provides a satisfactory high-frequency signal transmission interface and enables a soldering technique which is highly practicable and compatible with the flexible printed circuit and printed circuit board soldered structure.

公开(公告)号：US20180191131A1

公开(公告)日：2018-07-05

申请号：US15670624

申请日：2017-08-07

Applicant: LuxNet Corporation

Inventor： Hsing-Yen Lin ,  Pi-Cheng Law ,  Po-Chao Huang ,  Bo-Wei Liu ,  Ya-Hsin Deng ,  Hua-Hsin Su

IPC: H01S5/024 ,  H01S5/022

CPC classification number: H01S5/02469 ,  H01S5/02236 ,  H01S5/0224 ,  H01S5/02272 ,  H01S5/02476 ,  H01S5/22 ,  H01S5/4031

Abstract: The invention provides a heat-dissipating semiconductor assembly, comprising: a heat-dissipating substrate, a metal solder layer, and an edge emitting laser diode. The heat-dissipating substrate has one side formed with a flat surface for mounting the edge emitting laser diode. The edge emitting laser diode is mounted on the metal solder layer, and by lowering the active area of the edge emitting laser diode, the active area of the edge emitting laser diode is drawn close to one side of the heat-dissipating substrate. The edge emitting laser diode has an optical output direction parallel to the flat surface of the heat-dissipating substrate, and the heat-dissipating substrate and/or the metal solder layer have a groove. The ridge of the edge emitting laser diode is aligned with an opening formed in the groove of the heat-dissipating substrate, thereby preventing the heat-dissipating substrate and metal solder layer from contacting the ridge of the edge emitting laser diode.