-
1.
公开(公告)号:US20180062748A1
公开(公告)日:2018-03-01
申请号:US15694130
申请日:2017-09-01
申请人: Luxtera, Inc.
发明人: Michael Mack , Anders Dahl , Subal Sahni , Steffen Gloeckner
IPC分类号: H04B10/40 , G02B6/028 , G02B6/42 , H04B10/2581
CPC分类号: H04B10/40 , G02B6/0288 , G02B6/124 , G02B6/4213 , G02B6/4214 , G02B6/422 , G02B6/4246 , G02B6/426 , G02B6/4295 , G02B2006/12147 , H04B10/2581
摘要: Methods and systems for optical alignment to a silicon photonically-enabled integrated circuit may include aligning an optical assembly to a photonics die comprising a transceiver by, at least, communicating optical signals from the optical assembly into a plurality of grating couplers in the photonics die, communicating the one or more optical signals from the plurality of grating couplers to optical taps, with each tap having a first output coupled to the transceiver and a second output coupled to a corresponding output grating coupler, and monitoring an output optical signal communicated out of said photonic chip via said output grating couplers. The monitored output optical signal may be maximized by adjusting a position of the optical assembly. The optical assembly may include an optical source assembly comprising one or more lasers or the optical assembly may comprise a fiber array. Such a fiber array may include single mode optical fibers.
-
2.
公开(公告)号:US10735100B2
公开(公告)日:2020-08-04
申请号:US16519533
申请日:2019-07-23
申请人: Luxtera, Inc.
发明人: Michael Mack , Anders Dahl , Subal Sahni , Steffen Gloeckner
IPC分类号: H04B10/00 , H04B10/40 , G02B6/42 , G02B6/124 , G02B6/028 , H04B10/2581 , H01L21/68 , H05K13/04 , G02B6/12
摘要: Methods and systems for optical alignment to a silicon photonically-enabled integrated circuit may include aligning an optical assembly to a photonics die comprising a transceiver by, at least, communicating optical signals from the optical assembly into a plurality of grating couplers in the photonics die, communicating the one or more optical signals from the plurality of grating couplers to optical taps, with each tap having a first output coupled to the transceiver and a second output coupled to a corresponding output grating coupler, and monitoring an output optical signal communicated out of said photonic chip via said output grating couplers. The monitored output optical signal may be maximized by adjusting a position of the optical assembly. The optical assembly may include an optical source assembly comprising one or more lasers or the optical assembly may comprise a fiber array. Such a fiber array may include single mode optical fibers.
-
3.
公开(公告)号:US20200083959A1
公开(公告)日:2020-03-12
申请号:US16519533
申请日:2019-07-23
申请人: Luxtera, Inc.
发明人: Michael Mack , Anders Dahl , Subal Sahni , Steffen Gloeckner
摘要: Methods and systems for optical alignment to a silicon photonically-enabled integrated circuit may include aligning an optical assembly to a photonics die comprising a transceiver by, at least, communicating optical signals from the optical assembly into a plurality of grating couplers in the photonics die, communicating the one or more optical signals from the plurality of grating couplers to optical taps, with each tap having a first output coupled to the transceiver and a second output coupled to a corresponding output grating coupler, and monitoring an output optical signal communicated out of said photonic chip via said output grating couplers. The monitored output optical signal may be maximized by adjusting a position of the optical assembly. The optical assembly may include an optical source assembly comprising one or more lasers or the optical assembly may comprise a fiber array. Such a fiber array may include single mode optical fibers.
-
4.
公开(公告)号:US10361787B2
公开(公告)日:2019-07-23
申请号:US15694130
申请日:2017-09-01
申请人: Luxtera, Inc.
发明人: Michael Mack , Anders Dahl , Subal Sahni , Steffen Gloeckner
IPC分类号: H04B10/00 , H04B10/40 , G02B6/028 , G02B6/42 , H04B10/2581 , G02B6/124 , H01L21/68 , H05K13/04 , G02B6/12
摘要: Methods and systems for optical alignment to a silicon photonically-enabled integrated circuit may include aligning an optical assembly to a photonics die comprising a transceiver by, at least, communicating optical signals from the optical assembly into a plurality of grating couplers in the photonics die, communicating the one or more optical signals from the plurality of grating couplers to optical taps, with each tap having a first output coupled to the transceiver and a second output coupled to a corresponding output grating coupler, and monitoring an output optical signal communicated out of said photonic chip via said output grating couplers. The monitored output optical signal may be maximized by adjusting a position of the optical assembly. The optical assembly may include an optical source assembly comprising one or more lasers or the optical assembly may comprise a fiber array. Such a fiber array may include single mode optical fibers.
-
-
-