公开(公告)号：US3819497A

公开(公告)日：1974-06-25

申请号：US27314572

申请日：1972-07-19

Applicant: MACDERMID INC

Inventor： GRUNWALD J ,  RHODENIZER H ,  SLOMINSKI L

IPC: C23C18/18 ,  H05K3/06 ,  H05K3/10 ,  H05K3/42 ,  C23B5/48 ,  C23B5/52

CPC classification number: H05K3/108 ,  C23C18/1653 ,  C23C18/1844 ,  H05K3/062 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2203/0392 ,  H05K2203/072 ,  H05K2203/1105

Abstract: Copper surfaces are plated in a process comprising etching, activating, electroless and electrolytic copper deposition, and heating or baking at a temperature of about 150* to about 450*F. for about 10 min. to about 2 hours or more. Substantial improvement in the adhesion between the copper surface and the metal deposited by electroless and electrolytic plating is achieved. Processes for plating on copper-clad plastic substrates and for the manufacture of printed circuit boards are also set forth.

Abstract translation: 铜表面以包括蚀刻，活化，无电解和电解铜沉积以及在约150°至约450°F的温度下加热或烘烤约10分钟的方法进行电镀。 至约2小时以上。 实现铜表面和通过化学镀和电解电镀沉积的金属之间的粘合力的显着改善。 还阐述了在包铜塑料基板上的电镀工艺和用于制造印刷电路板的工艺。

公开(公告)号：US3779842A

公开(公告)日：1973-12-18

申请号：US3779842D

申请日：1972-04-21

Applicant: MACDERMID INC

Inventor： GRUNWALD J ,  SLOMINSKI L ,  LANDAU A ,  SHAH D

IPC: C23F1/18 ,  C23F1/34 ,  C23F1/00

CPC classification number: C23F1/18 ,  C23F1/34

Abstract: A method of and composition for dissolving metallic copper and copper rich alloys are disclosed, wherein there is employed a peroxydiphosphate compound, preferably with an adjuvant copper acceptor or solubilizing agent, to provide a stable etchant system which operates well in either acid or alkaline medium.

Abstract translation: 公开了一种用于溶解金属铜和富铜合金的方法和组合物，其中使用过氧化二磷酸盐化合物，优选使用辅助铜受体或增溶剂，以提供在酸性或碱性介质中良好运行的稳定的蚀刻剂体系。

公开(公告)号：US3717521A

公开(公告)日：1973-02-20

申请号：US3717521D

申请日：1972-02-22

Applicant: MACDERMID INC

Inventor： SLOMINSKI L ,  LANDAU A ,  SIEGMUND A

IPC: C23F1/34 ,  C23G1/18 ,  C23G1/22 ,  C23G1/36

CPC classification number: C23F1/34

Abstract: AN ETCHANT SOLUTION IS DISCLOSED FOR USE IN DISSOLVING COPPER FROM COPPER-SURFACED ARTICLES, THE SOLUTION BEING OF THE AQUEOUS ALKALINE AMMONIACAL CHLORITE TYPE BUT MODIFIED BY THE INCLUSION OF A HALOGEN-SUBSTITUTED ACETIC ACID TO PROVIDE IMPROVEMENT IN THE CAPACITY FOR DISSOLVING COPPER AND UNUSUALLY UNIFORM RATE OF ETCHING THROUGHOUT THE USEFUL LIFE OF THE ETCHANT BATH. THE METHOD OF USING THE ETCHANT SOLUTION, AND A PROCESS FOR REJUVENATING AND RECYCLING IT, ARE ALSO DISCLOSED.