公开(公告)号：US20210126047A1

公开(公告)日：2021-04-29

申请号：US17078240

申请日：2020-10-23

Applicant: MACROBLOCK, INC. ,  FORCE MOS TECHNOLOGY CO., LTD.

Inventor： Kao-Way Tu ,  Yuan-Shun Chang ,  Li-Chang Yang ,  Yi-Sheng Lin

IPC: H01L27/15

Abstract: A metal-oxide semiconductor module includes multiple metal-oxide semiconductor components separated from one another by at least one first trench. Each of the metal-oxide semiconductor components includes a heavily doped semiconductor layer which includes a drain region, an epitaxial layer which is formed with an indentation such that the drain region is partially exposed from the epitaxial layer, and a metallic patterned contact unit. The epitaxial layer also includes a source region and a gate region that are spaced-apart formed therein. The metallic patterned contact unit includes source, gate, and drain patterned contacts which are electrically connected to the source, gate, and drain regions, respectively. A light-emitting diode display device including the metal-oxide semiconductor module is also disclosed.

公开(公告)号：US11450708B2

公开(公告)日：2022-09-20

申请号：US17078240

申请日：2020-10-23

Applicant: MACROBLOCK, INC. ,  FORCE MOS TECHNOLOGY CO., LTD.

Inventor： Kao-Way Tu ,  Yuan-Shun Chang ,  Li-Chang Yang ,  Yi-Sheng Lin

IPC: H01L27/15

Abstract: A metal-oxide semiconductor module includes multiple metal-oxide semiconductor components separated from one another by at least one first trench. Each of the metal-oxide semiconductor components includes a heavily doped semiconductor layer which includes a drain region, an epitaxial layer which is formed with an indentation such that the drain region is partially exposed from the epitaxial layer, and a metallic patterned contact unit. The epitaxial layer also includes a source region and a gate region that are spaced-apart formed therein. The metallic patterned contact unit includes source, gate, and drain patterned contacts which are electrically connected to the source, gate, and drain regions, respectively. A light-emitting diode display device including the metal-oxide semiconductor module is also disclosed.

公开(公告)号：US12148364B2

公开(公告)日：2024-11-19

申请号：US18338856

申请日：2023-06-21

Applicant: MACROBLOCK, INC.

Inventor： Li-Chang Yang ,  Yi-Sheng Lin

IPC: G09G3/32 ,  G09G3/20 ,  G09G3/3241 ,  G09G3/3266

Abstract: A light emitting display device includes a substrate, a drive power circuit, a gate circuit unit, multiple LEDs and a power switch unit. The power switch unit includes multiple first transistor switches and at least one second transistor switch that cooperatively control current flows through the LEDs. The first transistor switches are respectively connected to first terminals of the LEDs. The at least one second transistor switch is connected to second terminals of the LEDs. The first transistor switches are further connected to the drive power circuit to receive multiple drive currents, and are further connected to the gate circuit unit to receive a timing input. The at least one second transistor switch is further connected to the gate circuit unit to receive a timing input. The light emitting display device can have reduced parasitic capacitance effect, and thus reduced power consumption and have improved display quality.

公开(公告)号：US20130293955A1

公开(公告)日：2013-11-07

申请号：US13936296

申请日：2013-07-08

Applicant: Macroblock, Inc.

Inventor： Li-Chang Yang ,  Chung-Yu Wu ,  Zong-Huan Cai

IPC: G02B27/22 ,  H01L33/58

CPC classification number: G02B27/2214 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0066 ,  G02B27/22 ,  G02B27/2228 ,  G09F19/18 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A Light Emitting Diode (LED) packaging structure comprises an LED die, a package body, and an optical element. The package body wraps the LED die, and the optical element is disposed on the package body. A light beam emitted by the LED die passes through the optical element and is split into a plurality of sub-light beams, and each of sub-light beams is individually projected onto an image plane corresponding to the optical element. Therefore, the LED packaging structure is applied to an LED stereoscopic display device, so that left eye and right eye of a viewer may respectively receive light beams emitted by different LED dies, so as to view a stereoscopic image, thereby solving a problem of a conventional stereoscopic display device that the stereoscopic image may be viewed in only a single viewable area.

公开(公告)号：US12062321B2

公开(公告)日：2024-08-13

申请号：US18338817

申请日：2023-06-21

Applicant: MACROBLOCK, INC.

Inventor： Li-Chang Yang ,  Yi-Sheng Lin

IPC: G09G3/20 ,  G09G3/32

CPC classification number: G09G3/2096 ,  G09G3/32 ,  G09G2300/0426 ,  G09G2330/021

Abstract: An LED display device includes a system board, and multiple daughterboards that are assembled on the system board. The system board includes a drive power circuit, a first gate circuit and a second gate circuit. Each daughterboard includes a substrate, multiple LEDs that are disposed on the substrate, multiple first transistor switches that are respectively connected to the LEDs, and at least one second transistor switch that is connected to the LEDs. With respect to each daughterboard, the first transistor switches and the at least one second transistor switch cooperatively control current flows through the LEDs; the first transistor switches are further connected to the drive power circuit to respectively receive multiple drive currents, and are further connected to the first gate circuit to receive a timing signal; and the at least one second transistor switch is further connected to the second gate circuit to receive a timing signal.

公开(公告)号：US11715644B2

公开(公告)日：2023-08-01

申请号：US17248374

申请日：2021-01-22

Applicant: MACROBLOCK. INC.

Inventor： Li-Chang Yang ,  Yi-Sheng Lin

IPC: H01L21/48 ,  H01L21/56

CPC classification number: H01L21/4825 ,  H01L21/565

Abstract: A method for packaging an integrated circuit chip includes the steps of: a) providing a plurality of dies and a lead frame which includes a plurality of bonding parts each having a die pad, a plurality of leads each having an end region disposed on and connected to the die pad, and a plurality of bumps each disposed on the end region of a respective one of the leads; b) transferring each of the dies to the die pad of a respective one of the bonding parts to permit each of the dies to be flipped on the respective bonding part; and c) hot pressing each of the dies and the die pad of a respective one of the bonding parts to permit each of the dies to be bonded to the bumps of the respective bonding part.

公开(公告)号：US20130293954A1

公开(公告)日：2013-11-07

申请号：US13936389

申请日：2013-07-08

Applicant: Macroblock, Inc.

Inventor： Li-Chang Yang ,  Chung-Yu Wu ,  Zong-Huan Cai

IPC: G02B27/22 ,  H01L27/15

CPC classification number: G02B27/2214 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0066 ,  G02B27/22 ,  G02B27/2228 ,  G09F19/18 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A Light Emitting Diode (LED) packaging structure comprises an LED die, a package body, and an optical element. The package body wraps the LED die, and the optical element is disposed on the package body. A light beam emitted by the LED die passes through the optical element and is split into a plurality of sub-light beams, and each of sub-light beams is individually projected onto an image plane corresponding to the optical element. Therefore, the LED packaging structure is applied to an LED stereoscopic display device, so that left eye and right eye of a viewer may respectively receive light beams emitted by different LED dies, so as to view a stereoscopic image, thereby solving a problem of a conventional stereoscopic display device that the stereoscopic image may be viewed in only a single viewable area.

Abstract translation: 发光二极管（LED）封装结构包括LED管芯，封装体和光学元件。 封装体包裹LED管芯，光学元件设置在封装主体上。 由LED管芯发射的光束通过光学元件并被分成多个子光束，并且每个子光束被分别投影到对应于光学元件的像平面上。 因此，LED封装结构被应用于LED立体显示装置，使得观察者的左眼和右眼可以分别接收由不同LED管芯发射的光束，以便观看立体图像，从而解决了 常规的立体显示装置，立体图像只能在单个可视区域中观看。

公开(公告)号：US20130293953A1

公开(公告)日：2013-11-07

申请号：US13936328

申请日：2013-07-08

Applicant: MACROBLOCK, INC.

Inventor： Li-Chang Yang ,  Chung-Yu Wu ,  Zong-Huan Cai

IPC: G02B27/22 ,  H01L33/58

CPC classification number: G02B27/2214 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0066 ,  G02B27/22 ,  G02B27/2228 ,  G09F19/18 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A Light Emitting Diode (LED) packaging structure comprises an LED die, a package body, and an optical element. The package body wraps the LED die, and the optical element is disposed on the package body. A light beam emitted by the LED die passes through the optical element and is split into a plurality of sub-light beams, and each of sub-light beams is individually projected onto an image plane corresponding to the optical element. Therefore, the LED packaging structure is applied to an LED stereoscopic display device, so that left eye and right eye of a viewer may respectively receive light beams emitted by different LED dies, so as to view a stereoscopic image, thereby solving a problem of a conventional stereoscopic display device that the stereoscopic image may be viewed in only a single viewable area.