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公开(公告)号：US10103166B1
公开(公告)日：2018-10-16
申请号：US15483019
申请日：2017-04-10
发明人： Kuan-Cheng Liu , Yu-Lin Liu , Cheng-Wei Lin , Chin-Cheng Yang , Shou-Wei Huang
IPC分类号： H01L29/792 , H01L27/11582 , H01L23/544 , H01L23/528 , H01L21/28 , H01L21/768 , H01L21/027 , H01L21/311
摘要： A semiconductor device includes a semiconductor substrate, a circuit unit and an align mark. The circuit unit is disposed on the semiconductor substrate. The align mark includes a first part and a second part respectively formed in the semiconductor substrate and adjacent to two opposite sides of the circuit unit, wherein the first part and the second part depart from each other for a predetermined distance along with a first direction.
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公开(公告)号：US20180294276A1
公开(公告)日：2018-10-11
申请号：US15483019
申请日：2017-04-10
发明人： Kuan-Cheng Liu , Yu-Lin Liu , Cheng-Wei Lin , Chin-Cheng Yang , Shou-Wei Huang
IPC分类号： H01L27/11582 , H01L23/544 , H01L23/528 , H01L21/28 , H01L21/768 , H01L21/027 , H01L21/311
摘要： A semiconductor device includes a semiconductor substrate, a circuit unit and an align mark. The circuit unit is disposed on the semiconductor substrate. The align mark includes a first part and a second part respectively formed in the semiconductor substrate and adjacent to two opposite sides of the circuit unit, wherein the first part and the second part depart from each other for a predetermined distance along with a first direction.
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