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公开(公告)号:US09806389B2
公开(公告)日:2017-10-31
申请号:US14650971
申请日:2013-12-03
IPC分类号: H01M10/6572 , H01M10/625 , H01L35/30 , B60H1/00 , B60H1/14 , F28F3/08 , F25B21/04 , F28F3/12 , F28D7/00 , B60H1/22 , F28D21/00
CPC分类号: H01M10/6572 , B60H1/00278 , B60H1/00478 , B60H1/143 , B60H2001/2271 , B60H2001/2275 , F25B21/04 , F25B2321/0252 , F28D7/0025 , F28D2021/008 , F28F3/08 , F28F3/12 , H01L35/30 , H01M10/625 , H01M2220/20
摘要: The invention relates to a heat exchanger, particularly for a motor vehicle, comprising a first component with a first duct, a second component with a second duct and a thermoelectric element for generating a heat flow, wherein a first fluid of a first fluid circuit can be caused to flow through the first duct to control the temperature of a first external component, wherein a second fluid of a second fluid circuit can be caused to flow through the second duct, which is fluidically separated from the first duct, to control the temperature of a second external component, and wherein the at least one thermoelectric element is arranged between the first and second components, contacting same thermally.
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公开(公告)号:US20150369522A1
公开(公告)日:2015-12-24
申请号:US14655408
申请日:2013-12-20
发明人: Jürgen Grünwald , Dirk Neumeister
摘要: The invention relates to a heat exchanger which has at least one first Peltier element. The Peltier element has a first semiconductor arrangement and at least one second semiconductor arrangement. Each semiconductor arrangement has a first semiconductor, a second semiconductor, and an electric contact. At least one semiconductor of each semiconductor arrangement is made of a p-doped semiconductor material, and at least one semiconductor of each semiconductor arrangement is made of an n-doped semiconductor material. One n-doped semiconductor and one p-doped semiconductor are electrically connected in series in an alternating manner within each semiconductor arrangement, and a voltage can be applied to said semiconductors via the electric contact. The invention is characterized in that the two semiconductor arrangements are electrically connected to each other in parallel.
摘要翻译: 本发明涉及一种具有至少一个第一珀尔帖元件的热交换器。 珀耳帖元件具有第一半导体布置和至少一个第二半导体布置。 每个半导体布置具有第一半导体,第二半导体和电接触。 每个半导体布置的至少一个半导体由p掺杂半导体材料制成,并且每个半导体布置的至少一个半导体由n掺杂半导体材料制成。 一个n掺杂半导体和一个p掺杂半导体在每个半导体布置内以交替的方式串联电连接,并且可以通过电触点将电压施加到所述半导体。 本发明的特征在于两个半导体装置并联电连接。
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