HEAT EXCHANGER
    2.
    发明申请
    HEAT EXCHANGER 审中-公开
    热交换器

    公开(公告)号:US20150369522A1

    公开(公告)日:2015-12-24

    申请号:US14655408

    申请日:2013-12-20

    IPC分类号: F25B21/02 H01L27/16 H01L35/32

    摘要: The invention relates to a heat exchanger which has at least one first Peltier element. The Peltier element has a first semiconductor arrangement and at least one second semiconductor arrangement. Each semiconductor arrangement has a first semiconductor, a second semiconductor, and an electric contact. At least one semiconductor of each semiconductor arrangement is made of a p-doped semiconductor material, and at least one semiconductor of each semiconductor arrangement is made of an n-doped semiconductor material. One n-doped semiconductor and one p-doped semiconductor are electrically connected in series in an alternating manner within each semiconductor arrangement, and a voltage can be applied to said semiconductors via the electric contact. The invention is characterized in that the two semiconductor arrangements are electrically connected to each other in parallel.

    摘要翻译: 本发明涉及一种具有至少一个第一珀尔帖元件的热交换器。 珀耳帖元件具有第一半导体布置和至少一个第二半导体布置。 每个半导体布置具有第一半导体,第二半导体和电接触。 每个半导体布置的至少一个半导体由p掺杂半导体材料制成,并且每个半导体布置的至少一个半导体由n掺杂半导体材料制成。 一个n掺杂半导体和一个p掺杂半导体在每个半导体布置内以交替的方式串联电连接,并且可以通过电触点将电压施加到所述半导体。 本发明的特征在于两个半导体装置并联电连接。