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公开(公告)号：US10702886B2
公开(公告)日：2020-07-07
申请号：US16048349
申请日：2018-07-30
发明人： Jochen Wehner , Jens Buening , Martina Voss
IPC分类号： B05D1/02 , B63B59/00 , C09D5/34 , C09D7/40 , C08K7/22 , C09D163/00 , C23C14/34 , C08G59/44 , C08G59/50 , B05B12/14 , B05B7/32
摘要： A composition for producing a putty. The composition includes a binder component with 40 to 95 wt.-% of an epoxy resin based on a total mass of the binder component, a hardener component with 5 to 70 wt.-% of an NH-group-containing compound relative to a total mass of the hardener component, and 0.1 to 15 wt.-% of synthetic hollow bodies based on a total mass of the putty. The synthetic hollow bodies have a density of 0.005 to 0.8 g/cm3.
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公开(公告)号：US10076768B2
公开(公告)日：2018-09-18
申请号：US14889860
申请日：2014-05-12
发明人： Jochen Wehner , Jens Buening , Martina Voss
IPC分类号： B05D1/02 , B63B59/00 , C09D5/34 , C08K7/22 , C09D163/00 , C23C14/34 , C09D7/40 , C08G59/44 , C08G59/50 , B05B12/14 , B05B7/32
CPC分类号： B05D1/02 , B05B7/32 , B05B12/1418 , B63B59/00 , C08G59/44 , C08G59/50 , C08K7/22 , C09D5/34 , C09D7/70 , C09D163/00 , C23C14/34 , C08L63/00
摘要： A method of using a putty in a mechanical processing method includes dosing a binder component comprising at least one epoxy resin, dosing a hardener component comprising at least one NH-group-containing compound, mixing the binder component and the hardener component into a putty mass, and applying the putty mass on an undercoat. At least one of the binder component and the hardener component comprises synthetic hollow bodies so that the putty mass comprises 0.1 to 15 wt.-% of the synthetic hollow bodies relative to a total weight of the putty mass.
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