公开(公告)号：US20240096861A1

公开(公告)日：2024-03-21

申请号：US18454220

申请日：2023-08-23

申请人： MEDIATEK INC.

发明人： Che-Hung KUO ,  Hsiao-Yun CHEN ,  Wen-Pin CHU ,  Chun-Hsiang HUANG

IPC分类号： H01L25/10 ,  H01L23/31 ,  H01L23/48 ,  H01L23/538 ,  H10B80/00

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5383 ,  H01L23/5385 ,  H01L28/90 ,  H10B80/00 ,  H01L24/16 ,  H01L2224/16225

摘要： A semiconductor package assembly is provided. The semiconductor package assembly includes first semiconductor die, a second semiconductor die and a memory package. The first semiconductor die and the second semiconductor die are stacked on each other. The first semiconductor die includes a first interface and a third interface. The first interface overlaps and is electrically connected to the second interface arranged on the second semiconductor die. The third interface is arranged on a first edge of the first semiconductor die. The memory package is disposed beside the first semiconductor die, wherein the memory package is electrically connected to the first semiconductor die by the third interface.