公开(公告)号：US20230280913A1

公开(公告)日：2023-09-07

申请号：US18078047

申请日：2022-12-08

Applicant: MEDIATEK INC.

Inventor： Yu-Hua Huang ,  Po-Chao Fang ,  Wei-Yu Ma ,  Chung-Hsin Huang

IPC: G06F3/06 ,  G11C11/406 ,  G11C11/4074 ,  G11C11/4093

CPC classification number: G06F3/0625 ,  G11C11/40615 ,  G11C11/4074 ,  G11C11/4093 ,  G06F3/0611 ,  G06F3/0673 ,  G06F3/0659

Abstract: An electronic device includes a semiconductor chip and a first memory device. The semiconductor chip includes an input/output (I/O) interface circuit. The first memory device is external to the semiconductor chip. The semiconductor chip communicates with the first memory device via the I/O interface circuit. The semiconductor chip stores at least one hardware setting of the semiconductor chip into the first memory device before a power-off event of the semiconductor chip.