ANTENNA PACKAGE
    2.
    发明申请

    公开(公告)号:US20250038412A1

    公开(公告)日:2025-01-30

    申请号:US18547211

    申请日:2023-04-23

    Applicant: MEDIATEK INC.

    Abstract: A semiconductor package is provided. The semiconductor package includes a first passive component module, a first antenna module, a first conductive structure and a second conductive structure. The first passive component module has a top surface, a bottom surface and a first side surface between the top surface and the bottom surface. The passive component module has a first size. The first antenna module is separated from the first passive component module and stacked on the top surface of the first passive component module. The antenna module has a second size. The first conductive structure is in contact with the top surface of the first passive component module and electrically connected to the first antenna module. The second conductive structure is in contact with the bottom surface of the first passive component module.

    ANTENNA DEVICE AND ANTENNA MODULE
    3.
    发明公开

    公开(公告)号:US20240097336A1

    公开(公告)日:2024-03-21

    申请号:US18462564

    申请日:2023-09-07

    Applicant: MEDIATEK Inc.

    CPC classification number: H01Q9/0407 H01Q1/38 H01Q1/48

    Abstract: An antenna device is provided, which includes a ground plate, a patterned radiating layer and a wall structure. The patterned radiating layer is arranged above the ground plate. The wall structure is formed above the ground plate. On a first reference plane substantially parallel with the ground plate, a projection of the wall structure overlaps a projection of the patterned radiating layer. With respect to a first reference axis substantially perpendicular to the ground plate, an upper surface of the wall structure is lower than the patterned radiating layer.

    ANTENNA STRUCTURE
    4.
    发明公开
    ANTENNA STRUCTURE 审中-公开

    公开(公告)号:US20240088561A1

    公开(公告)日:2024-03-14

    申请号:US18457543

    申请日:2023-08-29

    Applicant: MEDIATEK INC.

    CPC classification number: H01Q5/307 H01Q1/38 H01Q1/48

    Abstract: An antenna structure is provided. The antenna structure includes a first metal layer and a second metal layer disposed over the first metal layer. The second metal layer forms a first antenna resonating element operating at a first band and has a first opening. The antenna structure also includes a third metal layer disposed over the second metal layer. The third metal layer forms a second antenna resonating element operating at a second band, which is different from the first band. The antenna structure further includes a first transmission line extending from the first metal layer to the second metal layer and a second transmission line extending from the first metal layer through the first opening to the third metal layer.

    MIMO ANTENNA SYSTEM
    5.
    发明申请

    公开(公告)号:US20250087903A1

    公开(公告)日:2025-03-13

    申请号:US18821119

    申请日:2024-08-30

    Applicant: MEDIATEK INC.

    Abstract: A MIMO (multiple input and multiple output) antenna system is provided. The MIMO antenna system includes a dielectric substrate, a first MIMO antenna, and a second MIMO antenna. The first MIMO antennas is mounted on the dielectric substrate. The second MIMO antenna is mounted on the dielectric substrate and located beside the first MIMO antenna. The first MIMO antenna and the second MIMO antenna are configured to wirelessly access a set of first signals.

    ANTENNA AND ANTENNA PACKAGE
    6.
    发明申请

    公开(公告)号:US20240413536A1

    公开(公告)日:2024-12-12

    申请号:US18673436

    申请日:2024-05-24

    Applicant: MEDIATEK INC.

    Abstract: An antenna and an antenna package are provided. The antenna includes an antenna substrate, an antenna layer, a grounding layer and a first conductive feature. The antenna substrate has a top surface and a bottom surface opposite to the top surface. The antenna layer is disposed on the top surface of the antenna substrate. The grounding layer is disposed on the bottom surface of the antenna substrate. The first conductive feature is embedded in the antenna substrate and close to a first edge of the antenna layer. The first conductive feature and the grounding layer are spaced apart by a part of the antenna substrate. The first conductive feature includes a first portion. The angle between the first portion or an extended line of the first portion and the top surface of the antenna substrate is greater than 0 degrees and less than 180 degrees.

    ANTENNA FOR MULTI-BROADBAND AND MULTI-POLARIZATION COMMUNICATION

    公开(公告)号:US20220384966A1

    公开(公告)日:2022-12-01

    申请号:US17838425

    申请日:2022-06-13

    Applicant: MEDIATEK Inc.

    Abstract: An antenna for multi-broadband and multi-polarization communication, may include a plurality of radiators configured to jointly function as one or more dipoles, a first feed terminal for a first signal of a first polarization, and a second feed terminal for a second signal of a second polarization different from the first polarization. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands. In an embodiment, the antenna may further include a third feed terminal for a third signal of the first polarization, and a fourth feed terminal for a fourth signal of the second polarization.

    ANTENNA MODULE OF IMPROVED PERFORMANCES
    8.
    发明申请

    公开(公告)号:US20200076092A1

    公开(公告)日:2020-03-05

    申请号:US16524282

    申请日:2019-07-29

    Applicant: MEDIATEK Inc.

    Abstract: The invention provides an antenna module of improved performances; the antenna module may comprise a plurality of first antennas for signaling at a first band, and a plurality of second antennas for signaling at a second band different from the first band. Each said first antenna may comprise a main radiator which resonates at a mode-one frequency and a mode-two frequency different from the mode-one frequency; and the main radiator may be configured such that the mode-one frequency may be in the first band, and the mode-two frequency may not be in the first band and the second band.

    ANTENNA AND ELECTRONIC DEVICE INCLUDING THE ANTENNA

    公开(公告)号:US20240072426A1

    公开(公告)日:2024-02-29

    申请号:US18453455

    申请日:2023-08-22

    Applicant: MEDIATEK INC.

    CPC classification number: H01Q1/36 H01Q1/125 H01Q1/46 H01Q21/062

    Abstract: An antenna and an electronic device including the antenna are provided. The antenna includes a pair of radiators, a pair of feeding elements, first and second feeding ports. The radiators are located beside a geometric origin and separated from each other. The geometric origin is located between the radiators. The feeding elements are located below the pair of radiators and are configured to feed signals to the radiators. The pair of feeding elements includes a first feeding element and a second feeding element that are separated from each other. The first feeding element has a first geometric configuration. The second feeding element has a second geometric configuration that is asymmetric to the first geometric configuration. The first feeding port is electrically connected to the first feeding element. The second feeding port is separated from the first feeding port and electrically connected to the second feeding element.

    ANTENNA DEVICE
    10.
    发明公开
    ANTENNA DEVICE 审中-公开

    公开(公告)号:US20240047886A1

    公开(公告)日:2024-02-08

    申请号:US18352305

    申请日:2023-07-14

    Applicant: MEDIATEK Inc.

    CPC classification number: H01Q9/0442 H01Q1/50 H01Q1/52 H01Q1/48

    Abstract: An antenna device with a tunable gain, includes a ground plane and a plurality of resonating units. A first resonating unit of the resonating units includes the following elements. A radiating plate, is arranged above the ground plane, and substantially parallel with the ground plane. A ground wall, is arranged between the radiating plate and the ground plane, and substantially perpendicular to the ground plane. A first connecting element, extends along a predefined direction substantially perpendicular to the ground plane. The first connecting element is adapted to couple the radiating plate to the ground plane.

Patent Agency Ranking