公开(公告)号：US20190355697A1

公开(公告)日：2019-11-21

申请号：US16398228

申请日：2019-04-29

Applicant: MEDIATEK INC.

Inventor： Min-Chen Lin ,  Yi-Hui Lee ,  Che-Ya Chou ,  Nan-Cheng Chen

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L23/528 ,  H01L23/522

Abstract: An electronic package configured to operate at Gigabit-per-second (Gbps) data rates is disclosed. The electronic package includes a package substrate of a rectangular shape. A chip package having a first high-speed interface circuit die is mounted on a top surface of the package substrate. The chip package is rotated relative to the package substrate above a vertical axis that is orthogonal to the top surface through about 45 degrees. The first high-speed interface circuit die includes a first Serializer/Deserializer (SerDes) circuit block.

公开(公告)号：US09704785B2

公开(公告)日：2017-07-11

申请号：US14861423

申请日：2015-09-22

Applicant: MediaTek Inc.

Inventor： Tung-Hsien Hsieh ,  Yi-Hui Lee

IPC: H01L23/02 ,  H01L23/495 ,  H05K1/02 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49503 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49558 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/1421 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0215 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention provides a semiconductor package. The semiconductor package includes a lead frame including a die paddle. A supporting bar connects to the die paddle, extending in an outward direction from the die paddle. At least two power leads are separated from the die paddle and the supporting bar, having first terminals close to the die paddle and second terminals extending outward from the die paddle. A power bar connects to the at least two power leads, having a supporting portion. A molding material encapsulates the lead frame leaving the supporting portion exposed.