公开(公告)号：US11764571B2

公开(公告)日：2023-09-19

申请号：US17071562

申请日：2020-10-15

申请人： MICRON TECHNOLOGY, INC.

发明人： Haruka Momota ,  Takashi Ishihara

IPC分类号： H02H9/04 ,  H01L27/02

CPC分类号： H02H9/046 ,  H01L27/0248 ,  H01L27/0296

摘要： Disclosed herein is an apparatus that includes a first power ESD protection circuit arranged in a first circuit area; a plurality of data I/O circuits arranged in a second circuit area adjacent to the first circuit area in a first direction; a plurality of data I/O terminals arranged in the second circuit area, each of the plurality of data I/O terminals being coupled to an associated one of the plurality of data I/O circuits; a plurality of first power terminals arranged in the second circuit area; and a first power line extending in the first direction, the first power line coupling the plurality of first power terminals to the first power ESD protection circuit.

公开(公告)号：US20220123550A1

公开(公告)日：2022-04-21

申请号：US17071562

申请日：2020-10-15

申请人： MICRON TECHNOLOGY, INC.

发明人： Haruka Momota ,  Takashi Ishihara

IPC分类号： H02H9/04 ,  H01L27/02

摘要： Disclosed herein is an apparatus that includes a first power ESD protection circuit arranged in a first circuit area; a plurality of data I/O circuits arranged in a second circuit area adjacent to the first circuit area in a first direction; a plurality of data I/O terminals arranged in the second circuit area, each of the plurality of data I/O terminals being coupled to an associated one of the plurality of data I/O circuits; a plurality of first power terminals arranged in the second circuit area; and a first power line extending in the first direction, the first power line coupling the plurality of first power terminals to the first power ESD protection circuit.

公开(公告)号：US20230360688A1

公开(公告)日：2023-11-09

申请号：US17740200

申请日：2022-05-09

申请人： MICRON TECHNOLOGY, INC.

发明人： Kazuhiro Yoshida ,  Go Takashima ,  Haruka Momota

IPC分类号： G11C11/4074 ,  H01L27/108

CPC分类号： G11C11/4074 ,  H01L27/10897

摘要： Disclosed herein is an apparatus that includes: a semiconductor substrate including first and second source regions coupled to a first power supply line and first and second drain regions coupled to a second power supply line, the first drain region being arranged between the first and second source regions, the second source region being arranged between the first and second drain regions; and gate electrodes including a first gate electrode arranged between the first source region and the first drain region, a second gate electrode arranged between the first drain region and the second source region, and a third gate electrode arranged between the second source region and the second drain region. The first and third gate electrodes are supplied with a first control signal. The second gate electrode is supplied with a second control signal.

公开(公告)号：US11948620B2

公开(公告)日：2024-04-02

申请号：US17740200

申请日：2022-05-09

申请人： MICRON TECHNOLOGY, INC.

发明人： Kazuhiro Yoshida ,  Go Takashima ,  Haruka Momota

IPC分类号： G11C11/10 ,  G11C11/4074 ,  H10B12/00

CPC分类号： G11C11/4074 ,  H10B12/50

摘要： Disclosed herein is an apparatus that includes: a semiconductor substrate including first and second source regions coupled to a first power supply line and first and second drain regions coupled to a second power supply line, the first drain region being arranged between the first and second source regions, the second source region being arranged between the first and second drain regions; and gate electrodes including a first gate electrode arranged between the first source region and the first drain region, a second gate electrode arranged between the first drain region and the second source region, and a third gate electrode arranged between the second source region and the second drain region. The first and third gate electrodes are supplied with a first control signal. The second gate electrode is supplied with a second control signal.

公开(公告)号：US20230187289A1

公开(公告)日：2023-06-15

申请号：US17550741

申请日：2021-12-14

申请人： MICRON TECHNOLOGY, INC.

发明人： Haruka Momota ,  Koji Yasumori ,  Keizo Kawakita

IPC分类号： H01L21/66 ,  H01L21/768 ,  H01L23/528 ,  H01L23/525

CPC分类号： H01L22/32 ,  H01L21/76802 ,  H01L23/528 ,  H01L23/5256 ,  H01L27/10897

摘要： An apparatus includes an active region; a scribe region surrounding the active region; a test component in the scribe region; a pad electrode in the active region; and a power supply wiring of an upper wiring layer in the active region, the power supply wiring extending between the test component and the pad electrode; and an interconnection structure coupling the test component and the pad electrode across a border between the active region and the scribe region, the interconnection structure including a wiring portion of a lower wiring layer crossing the power supply wiring.