Loopback circuit for low-power memory devices

    公开(公告)号:US12243617B2

    公开(公告)日:2025-03-04

    申请号:US18051143

    申请日:2022-10-31

    Abstract: Devices and methods for operating a low-power memory device includes a first data input (DQ) circuitry including an input buffer configured to generate a loopback data signal based at least in part on a data signal received at the first DQ circuitry when the low-power memory device operates in a feedback mode. A second DQ circuitry includes an output buffer configured to receive the loopback data signal from the first DQ circuitry and to output the loopback data signal via a data pin.

    APPARATUSES, SYSTEMS, AND METHODS FOR SYSTEM ON CHIP REPLACEMENT MODE

    公开(公告)号:US20220157367A1

    公开(公告)日:2022-05-19

    申请号:US17590710

    申请日:2022-02-01

    Abstract: Apparatuses, systems, and methods for a system on chip (SoC) replacement mode. A memory device may be coupled to a SoC which may act as a controller of the memory. Commands and addresses may be sent along a command/address (CA) bus to a first decoder of the memory. The first decoder may use a first reference voltage to determine a value of signals along the CA bus. One of the pins of the CA bus may be coupled to a second decoder which may use a different second reference voltage. When the voltage on the pin exceeds the second reference voltage, the memory device may enter a SoC replacement mode, in which the memory may take various actions to preserve data integrity, while a new SoC comes online.

    Apparatuses, systems, and methods for system on chip replacement mode

    公开(公告)号:US11651815B2

    公开(公告)日:2023-05-16

    申请号:US17590710

    申请日:2022-02-01

    CPC classification number: G11C11/4087 G11C11/40615

    Abstract: Apparatuses, systems, and methods for a system on chip (SoC) replacement mode. A memory device may be coupled to a SoC which may act as a controller of the memory. Commands and addresses may be sent along a command/address (CA) bus to a first decoder of the memory. The first decoder may use a first reference voltage to determine a value of signals along the CA bus. One of the pins of the CA bus may be coupled to a second decoder which may use a different second reference voltage. When the voltage on the pin exceeds the second reference voltage, the memory device may enter a SoC replacement mode, in which the memory may take various actions to preserve data integrity, while a new SoC comes online.

    APPARATUSES, SYSTEMS, AND METHODS FOR SYSTEM ON CHIP REPLACEMENT MODE

    公开(公告)号:US20220036939A1

    公开(公告)日:2022-02-03

    申请号:US16942503

    申请日:2020-07-29

    Abstract: Apparatuses, systems, and methods for a system on chip (SoC) replacement mode. A memory device may be coupled to a SoC which may act as a controller of the memory. Commands and addresses may be sent along a command/address (CA) bus to a first decoder of the memory. The first decoder may use a first reference voltage to determine a value of signals along the CA bus. One of the pins of the CA bus may be coupled to a second decoder which may use a different second reference voltage. When the voltage on the pin exceeds the second reference voltage, the memory device may enter a SoC replacement mode, in which the memory may take various actions to preserve data integrity, while a new SoC comes online.

    Systems and techniques for timing mismatch reduction

    公开(公告)号:US12021531B2

    公开(公告)日:2024-06-25

    申请号:US17895826

    申请日:2022-08-25

    CPC classification number: H03K3/0232 G01R31/31727 H03K3/014 H03K3/0315

    Abstract: Systems and techniques to offset conditions affecting propagation delay of a clock signal in a memory device. These include a device that includes a clock adjustment circuit, comprising a differential amplifier, an inverter coupled to a first output of the differential amplifier, and a swing oscillator driver coupled to a second output of the inverter and an input of the differential amplifier. The swing oscillator driver includes a series of transistors, a signal path coupled to at least a first transistor of the series of transistors, wherein the signal path when in operation transmits a signal having a first voltage, and a strength control circuit coupled to the signal path, wherein the strength control circuit when in operation adjusts the first voltage of the signal to a second voltage.

    SYSTEMS AND TECHNIQUES FOR TIMING MISMATCH REDUCTION

    公开(公告)号:US20240072774A1

    公开(公告)日:2024-02-29

    申请号:US17895826

    申请日:2022-08-25

    CPC classification number: H03K3/0232 G01R31/31727 H03K3/014 H03K3/017

    Abstract: Systems and techniques to offset conditions affecting propagation delay of a clock signal in a memory device. These include a device that includes a clock adjustment circuit, comprising a differential amplifier, an inverter coupled to a first output of the differential amplifier, and a swing oscillator driver coupled to a second output of the inverter and an input of the differential amplifier. The swing oscillator driver includes a series of transistors, a signal path coupled to at least a first transistor of the series of transistors, wherein the signal path when in operation transmits a signal having a first voltage, and a strength control circuit coupled to the signal path, wherein the strength control circuit when in operation adjusts the first voltage of the signal to a second voltage.

    SEMICONDUCTOR DEVICE PERFORMING LOOP-BACK TEST OPERATION

    公开(公告)号:US20220262451A1

    公开(公告)日:2022-08-18

    申请号:US17736585

    申请日:2022-05-04

    Abstract: Disclosed herein is an apparatus that includes a memory cell array; a data input/output terminal; a read data path and a write data path coupled in parallel between the memory cell array and the data input/output terminal, wherein the read data path includes a pre-driver and an output driver coupled in series, and wherein the write data path includes an input receiver and a latch circuit coupled in series; and a test path configured to provide a shortcut between the pre-driver in the read data path and the latch circuit in the write data path.

    Semiconductor device performing loop-back test operation

    公开(公告)号:US11348660B1

    公开(公告)日:2022-05-31

    申请号:US17105137

    申请日:2020-11-25

    Abstract: Disclosed herein is an apparatus that includes a memory cell array; a data input/output terminal; a read data path and a write data path coupled in parallel between the memory cell array and the data input/output terminal, wherein the read data path includes a pre-driver and an output driver coupled in series, and wherein the write data path includes an input receiver and a latch circuit coupled in series; and a test path configured to provide a shortcut between the pre-driver in the read data path and the latch circuit in the write data path.

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