公开(公告)号：US20180258313A1

公开(公告)日：2018-09-13

申请号：US15761140

申请日：2015-10-08

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Naoki YASUDA ,  Shigeyuki YAMAMOTO ,  Toshifumi KANRI ,  Takahiro TSUTSUMI ,  Masashi ONO ,  Kosuke SANO ,  Yukio HIDAKA

IPC分类号： C09D163/00 ,  H02K3/30 ,  H02K15/12

CPC分类号： C09D163/00 ,  C08G59/00 ,  C08G59/1466 ,  C08G59/68 ,  C08J3/24 ,  C08K5/14 ,  C08L33/04 ,  C08L63/00 ,  C09D163/10 ,  H01B3/40 ,  H02K3/30 ,  H02K3/44 ,  H02K7/14 ,  H02K15/12 ,  C08K5/0025

摘要： The present invention provides a solvent-free varnish composition, including: a thermosetting resin (A) having two or more (meth)acryloyl groups in a molecule thereof; a thermosetting resin (B) having one or more epoxy groups in a molecule thereof; a monofunctional vinyl-based monomer having an ether bond or an ester bond; an organic peroxide having a 10-hour half-life temperature of 40° C. or more; and a curing catalyst for an epoxy resin, in which a mixed resin of the thermosetting resin (A) and the thermosetting resin (B) has an epoxy equivalent of from 500 to 5,000. The solvent-free varnish composition can be used as an insulating varnish that shows a small energy loss and requires a short curing time in its curing treatment step, and that provides a cured product that barely causes the precipitation of an oligomer or the like even when exposed to a refrigerant-based environment containing a refrigerant and a refrigerating machine oil under high temperature and high pressure.