公开(公告)号：US09579739B2

公开(公告)日：2017-02-28

申请号：US14768041

申请日：2014-02-28

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Tomoya Oohiraki ,  Sotaro Oi ,  Kimihito Nishikawa ,  Hiromasa Hayashi

IPC分类号： B23K31/02 ,  H01L23/48 ,  B23K1/00 ,  C04B35/645 ,  C04B37/02 ,  H01L21/48 ,  H01L23/373 ,  H05K1/02 ,  H05K3/20

CPC分类号： B23K1/0016 ,  B23K31/02 ,  C04B35/645 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/62 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/86 ,  H01L21/4846 ,  H01L21/4882 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K3/202 ,  H05K3/207 ,  H05K2203/04 ,  H05K2203/06 ,  H01L2924/00

摘要： A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.

摘要翻译： 一种制造功率模块基板的方法，在通过将铜电路板30之间的陶瓷板21分隔在铜电路板30之间的陶瓷板21上，间隔地连接在具有陶瓷基板的区域的陶瓷板21上， 在陶瓷板21上形成有与铜电路板30的外形相同形状的活性金属钎焊材料的接合材料层71; 包含聚乙二醇作为主要成分的temporal棒材料72扩散在铜电路板30上，接合材料层71和铜电路板30以层压定位的状态临时固定在陶瓷板21上 通过temporal棒材料72; 并且其层压组件在层叠方向上加压并加热，使得陶瓷板和铜电路板接合。

公开(公告)号：US20160001388A1

公开(公告)日：2016-01-07

申请号：US14768041

申请日：2014-02-28

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Tomoya Oohiraki ,  Sotaro Oi ,  Kimihito Nishikawa ,  Hiromasa Hayashi

IPC分类号： B23K1/00 ,  H05K3/20 ,  H01L21/48 ,  B23K31/02

CPC分类号： B23K1/0016 ,  B23K31/02 ,  C04B35/645 ,  C04B37/026 ,  C04B2237/121 ,  C04B2237/125 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/128 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/62 ,  C04B2237/704 ,  C04B2237/706 ,  C04B2237/708 ,  C04B2237/86 ,  H01L21/4846 ,  H01L21/4882 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K3/202 ,  H05K3/207 ,  H05K2203/04 ,  H05K2203/06 ,  H01L2924/00

摘要： A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.

摘要翻译： 一种制造功率模块基板的方法，在通过将铜电路板30之间的陶瓷板21分隔在铜电路板30之间的陶瓷板21上，间隔地连接在具有可以形成陶瓷基板的区域的陶瓷板21上， 在陶瓷板21上形成有与铜电路板30的外形相同形状的活性金属钎焊材料的接合材料层71; 包含聚乙二醇作为主要成分的temporal棒材料72扩散在铜电路板30上，接合材料层71和铜电路板30以层压定位的状态临时固定在陶瓷板21上 通过temporal棒材料72; 并且其层压组件在层叠方向上加压并加热，使得陶瓷板和铜电路板接合。