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1.发明授权公开(公告)号：US10543531B2
公开(公告)日：2020-01-28
申请号：US15522310
申请日：2015-10-28
发明人： Toshihiko Saiwai , Ji-bin Yang , Koichi Kita
摘要： A porous aluminum sintered material is provided. The porous aluminum sintered material includes aluminum substrates sintered each other, wherein pillar-shaped protrusions projecting toward an outside are formed on outer surfaces of the aluminum substrates, the porous aluminum sintered material has junctions in which the aluminum substrates are bonded each other through the pillar-shaped protrusions, the junctions include a Ti—Al compound, and a eutectic alloy phase including Al and Si is provided on surface layers of the junctions.
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公开(公告)号：US10532407B2
公开(公告)日：2020-01-14
申请号：US15518902
申请日：2015-10-21
发明人： Koichi Kita , Koji Hoshino , Toshihiko Saiwai , Jun Katoh
摘要： A porous copper sintered material (10) includes: a plurality of copper fibers (11) sintered each other, wherein the copper fibers (11) are made of copper or copper alloy, a diameter R of the copper fibers (11) is in a range of 0.02 mm or more and 1.0 mm or less, and a ratio L/R of a length L of the copper fibers to the diameter R is in a range of 4 or more and 2500 or less (11), redox layers (12) formed by redox treatment are provided on surfaces of copper fibers (11, 11), and concavities and convexities are formed by the redox layer (12), and each of redox layers (12, 12) formed on each of the copper fibers (11) is integrally bonded in a junction of the copper fibers (11).
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公开(公告)号：US20210352828A1
公开(公告)日：2021-11-11
申请号：US17286230
申请日：2019-10-31
发明人： Koichi Kita , Toshiyuki Nagase , Kiyotaka Nakaya , Kotaro Iwata
IPC分类号： H05K7/20
摘要： A carbonaceous member contains graphene aggregates formed by deposition of a single layer or multiple layers of graphene, and flat graphite particles, and has a structure in which the flat graphite particles are laminated with the graphene aggregate as a binder so that basal surfaces of the graphite particles overlap with one another, and the basal surfaces of the flat graphite particles are oriented in one direction. A metal layer includes a metal plating layer directly formed on a surface (edge lamination surface) to which edge surfaces of the graphite particles laminated in the carbonaceous member are directed, and the metal plating layer is made of a metal having a thermal conductivity of 50 W/(m·k) or greater.
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公开(公告)号：US10898956B2
公开(公告)日：2021-01-26
申请号：US15768920
申请日：2016-10-12
发明人： Jun Kato , Koichi Kita
摘要： A manufacturing method of a copper bonded part in which a first copper member and a second copper member are bonded together. The first copper member and the second copper member are made of copper or a copper alloy, and at least one of the first copper member and the second copper member includes a copper porous body made of copper or a copper alloy. This manufacturing method has a bonding material disposing step S01 of disposing a bonding material between the first copper member and the second copper member, and a reduction sintering step S02 of heating and holding the first copper member, the second copper member, and the bonding material in a reducing atmosphere in a range of 600° C. or higher and 1,050° C. or lower. The bonding material contains a copper oxide or a mixture of metallic copper and the copper oxide.
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公开(公告)号：US20190054538A1
公开(公告)日：2019-02-21
申请号：US15768920
申请日：2016-10-12
发明人： Jun Kato , Koichi Kita
IPC分类号： B22F7/08
摘要： A manufacturing method of a copper bonded part in which a first copper member and a second copper member are bonded together. The first copper member and the second copper member are made of copper or a copper alloy, and at least one of the first copper member and the second copper member includes a copper porous body made of copper or a copper alloy. This manufacturing method has a bonding material disposing step S01 of disposing a bonding material between the first copper member and the second copper member, and a reduction sintering step S02 of heating and holding the first copper member, the second copper member, and the bonding material in a reducing atmosphere in a range of 600° C. or higher and 1,050° C. or lower. The bonding material contains a copper oxide or a mixture of metallic copper and the copper oxide.
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公开(公告)号：US20170239729A1
公开(公告)日：2017-08-24
申请号：US15518902
申请日：2015-10-21
发明人： Koichi Kita , Koji Hoshino , Toshihiko Saiwai , Jun Katoh
摘要： A porous copper sintered material (10) includes: a plurality of copper fibers (11) sintered each other, wherein the copper fibers (11) are made of copper or copper alloy, a diameter R of the copper fibers (11) is in a range of 0.02 mm or more and 1.0 mm or less, and a ratio L/R of a length L of the copper fibers to the diameter R is in a range of 4 or more and 2500 or less (11), redox layers (12) formed by redox treatment are provided on surfaces of copper fibers (11, 11), and concavities and convexities are formed by the redox layer (12), and each of redox layers (12, 12) formed on each of the copper fibers (11) is integrally bonded in a junction of the copper fibers (11).
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7.发明申请POROUS ALUMINUM SINTERED COMPACT AND METHOD OF PRODUCING POROUS ALUMINUM SINTERED COMPACT 审中-公开多孔铝烧结复合材料及多孔铝合金制造方法公开(公告)号：US20170028473A1
公开(公告)日：2017-02-02
申请号：US15302374
申请日：2015-05-18
发明人： Ji-Bin Yang , Koichi Kita , Toshihiko Saiwai , Koji Hoshino , Jun Katoh
CPC分类号： B22F3/1103 , B22F1/004 , B22F1/0059 , B22F1/02 , B22F1/025 , B22F3/11 , B22F3/1118 , B22F9/04 , B22F2301/052 , B22F2301/058 , B22F2301/15 , B22F2301/205 , B22F2302/45 , B22F2998/10 , C22C1/0416 , C22C1/08 , C22C21/00 , C22C21/06 , C22C32/0089 , C22C49/06 , Y10T428/12479
摘要： A high-quality porous aluminum sintered compact, which can be produced efficiently at a low cost; has an excellent dimensional accuracy with a low shrinkage ratio during sintering; and has sufficient strength, and a method of producing the porous aluminum sintered compact are provided. The porous aluminum sintered compact is the porous aluminum sintered compact that includes aluminum substrates sintered each other. The junction, in which the aluminum substrates are bonded each other, includes the Ti—Al compound and the eutectic element compound capable of eutectic reaction with Al. It is preferable that the pillar-shaped protrusions projecting toward the outside are formed on outer surfaces of the aluminum substrates, and the pillar-shaped protrusions include the junction.
摘要翻译： 高品质多孔铝烧结体，可以低成本高效生产; 具有良好的尺寸精度，烧结时收缩率低; 并且具有足够的强度，并且提供了制造多孔铝烧结体的方法。 多孔铝烧结体是包含彼此烧结的铝基板的多孔铝烧结体。 铝基板彼此结合的结，包括能够与Al共晶反应的Ti-Al化合物和共晶元素化合物。 优选地，在铝基板的外表面上形成向外侧突出的柱状突起，并且柱状突起包括接合部。
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公开(公告)号：US20190381568A1
公开(公告)日：2019-12-19
申请号：US16468020
申请日：2018-01-18
发明人： Jun Kato , Koichi Kita , Toshihiko Saiwai
摘要： This porous copper body includes: a skeleton which is formed of a sintered body of a plurality of copper fibers and has a three-dimensional network structure, wherein the copper fibers forming the skeleton consist of copper or a copper alloy, and the copper fibers have a diameter R in a range of 0.01 mm to 1.0 mm, a ratio L/R of a length L to the diameter R in a range of 4 to 200, and a circularity of a cross section orthogonal to a length direction in a range of 0.2 to 0.9, and the porous copper body has a porosity of 50% to 95%.
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公开(公告)号：US10478896B2
公开(公告)日：2019-11-19
申请号：US15579668
申请日：2016-05-23
发明人： Koichi Kita , Jun Kato , Toshihiko Saiwai
IPC分类号： B22F3/00 , B22F3/11 , B22F1/00 , B22F7/04 , C22C9/00 , C22F1/08 , B22F7/00 , B22F7/06 , C22C47/20 , C22F1/00 , F28F1/10 , B32B15/01
摘要： A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the average crystal grain size of an entirety including the skeleton and the oxidation-reduction layer is 5% or more of the diameter of the skeleton.
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公开(公告)号：US20180297118A1
公开(公告)日：2018-10-18
申请号：US15580055
申请日：2016-05-24
发明人： Koichi Kita , Jun Kato , Toshihiko Saiwai
摘要： A porous copper body including a skeleton having a three-dimensional network structure is provided. A porous layer having unevenness is formed on a surface of the skeleton, the specific surface area is set to be 0.01 m2/g or greater, and the porosity is set to be in a range of 50% to 90%.
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