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公开(公告)号：US11351601B2
公开(公告)日：2022-06-07
申请号：US16975355
申请日：2019-03-01
发明人： Jun Kato , Yuki Ito , Hiroyuki Matsukawa
摘要： This copper alloy powder having an excellent laser absorptivity includes: either one or both of B and S in an amount of 0.003 mass % to 5.0 mass %, with a remainder being Cu and inevitable impurities, wherein an average particle diameter is 20 μm to 80 μm. This copper alloy powder having an excellent laser absorptivity is preferably a powder for metal additive manufacturing.
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公开(公告)号：US10898956B2
公开(公告)日：2021-01-26
申请号：US15768920
申请日：2016-10-12
发明人： Jun Kato , Koichi Kita
摘要： A manufacturing method of a copper bonded part in which a first copper member and a second copper member are bonded together. The first copper member and the second copper member are made of copper or a copper alloy, and at least one of the first copper member and the second copper member includes a copper porous body made of copper or a copper alloy. This manufacturing method has a bonding material disposing step S01 of disposing a bonding material between the first copper member and the second copper member, and a reduction sintering step S02 of heating and holding the first copper member, the second copper member, and the bonding material in a reducing atmosphere in a range of 600° C. or higher and 1,050° C. or lower. The bonding material contains a copper oxide or a mixture of metallic copper and the copper oxide.
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公开(公告)号：US20190054538A1
公开(公告)日：2019-02-21
申请号：US15768920
申请日：2016-10-12
发明人： Jun Kato , Koichi Kita
IPC分类号： B22F7/08
摘要： A manufacturing method of a copper bonded part in which a first copper member and a second copper member are bonded together. The first copper member and the second copper member are made of copper or a copper alloy, and at least one of the first copper member and the second copper member includes a copper porous body made of copper or a copper alloy. This manufacturing method has a bonding material disposing step S01 of disposing a bonding material between the first copper member and the second copper member, and a reduction sintering step S02 of heating and holding the first copper member, the second copper member, and the bonding material in a reducing atmosphere in a range of 600° C. or higher and 1,050° C. or lower. The bonding material contains a copper oxide or a mixture of metallic copper and the copper oxide.
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公开(公告)号：US20180161877A1
公开(公告)日：2018-06-14
申请号：US15579688
申请日：2016-05-23
发明人： Koichi Kita , Jun Kato , Toshihiko Saiwai
CPC分类号： B22F3/1143 , B22F1/004 , B22F3/1103 , B22F7/002 , B22F7/04 , B22F7/06 , B32B15/01 , C22C1/0425 , C22C1/08 , C22C9/00 , Y10T428/12153
摘要： A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the oxygen concentration of the entirety of the skeleton is set to be 0.025 mass % or less.
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公开(公告)号：US20180161876A1
公开(公告)日：2018-06-14
申请号：US15579668
申请日：2016-05-23
发明人： Koichi Kita , Jun Kato , Toshihiko Saiwai
CPC分类号： B22F3/1143 , B22F1/00 , B22F1/004 , B22F3/11 , B22F3/1103 , B22F7/002 , B22F7/004 , B22F7/04 , B22F7/062 , B32B15/01 , C22C9/00 , C22C47/20 , C22F1/00 , C22F1/08 , F28F1/10 , Y10T428/12153
摘要： A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the average crystal grain size of an entirety including the skeleton and the oxidation-reduction layer is 5% or more of the diameter of the skeleton.
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公开(公告)号：US20190381568A1
公开(公告)日：2019-12-19
申请号：US16468020
申请日：2018-01-18
发明人： Jun Kato , Koichi Kita , Toshihiko Saiwai
摘要： This porous copper body includes: a skeleton which is formed of a sintered body of a plurality of copper fibers and has a three-dimensional network structure, wherein the copper fibers forming the skeleton consist of copper or a copper alloy, and the copper fibers have a diameter R in a range of 0.01 mm to 1.0 mm, a ratio L/R of a length L to the diameter R in a range of 4 to 200, and a circularity of a cross section orthogonal to a length direction in a range of 0.2 to 0.9, and the porous copper body has a porosity of 50% to 95%.
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公开(公告)号：US10478896B2
公开(公告)日：2019-11-19
申请号：US15579668
申请日：2016-05-23
发明人： Koichi Kita , Jun Kato , Toshihiko Saiwai
IPC分类号： B22F3/00 , B22F3/11 , B22F1/00 , B22F7/04 , C22C9/00 , C22F1/08 , B22F7/00 , B22F7/06 , C22C47/20 , C22F1/00 , F28F1/10 , B32B15/01
摘要： A porous copper body including a skeleton having a three-dimensional network structure is provided. An oxidation-reduction layer formed by an oxidation-reduction treatment is provided on a surface of the skeleton, and the average crystal grain size of an entirety including the skeleton and the oxidation-reduction layer is 5% or more of the diameter of the skeleton.
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公开(公告)号：US20180297118A1
公开(公告)日：2018-10-18
申请号：US15580055
申请日：2016-05-24
发明人： Koichi Kita , Jun Kato , Toshihiko Saiwai
摘要： A porous copper body including a skeleton having a three-dimensional network structure is provided. A porous layer having unevenness is formed on a surface of the skeleton, the specific surface area is set to be 0.01 m2/g or greater, and the porosity is set to be in a range of 50% to 90%.
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公开(公告)号：US20200224976A1
公开(公告)日：2020-07-16
申请号：US16647720
申请日：2018-10-03
发明人： Toshihiko Saiwai , Jun Kato
摘要： This copper porous body for vaporization members is a copper porous body for vaporization members used as a vaporization member which vaporizes a liquid phase medium that comes into contact with the vaporization member, the copper body is composed of a sintered body of a plurality of copper fibers, and has a stem having a three-dimensional network structure. A porosity is in a range of 65% or more and 95% or less, an opening diameter is in a range of 100 μm or more and 2,000 μm or less, and a standardized specific surface area SD=S×R defined as a product of a specific surface area S (m2/g) and a diameter R (m) of the copper fiber is in a range of 0.001 or more and 0.25 or less.
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公开(公告)号：US20190076927A1
公开(公告)日：2019-03-14
申请号：US16081527
申请日：2017-04-07
发明人： Jun Kato , Koichi Kita , Toshihiko Saiwai
摘要： The porous copper body of the disclosure includes a skeleton having a three-dimensional network structure, in which a porosity is in a range of 50% to 90% and a porosity-normalized electrical conductivity σN which is defined by dividing a electrical conductivity of the porous copper body, measured by a 4-terminal sensing, by an apparent density ratio of the porous copper body is 20% IACS or higher.
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