公开(公告)号：US20150034482A1

公开(公告)日：2015-02-05

申请号：US14333812

申请日：2014-07-17

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Satoru Mori ,  Toshio Sakamoto ,  Kiyoyuki Ookubo

IPC: H01J37/34 ,  B22D11/00 ,  B22D11/108 ,  C23C14/34 ,  B22D7/00

CPC classification number: H01J37/3429 ,  B22D7/005 ,  B22D11/004 ,  B22D11/108 ,  C22C1/02 ,  C22C9/00 ,  C22F1/08 ,  C23C14/3414 ,  H01J37/3491

Abstract: A copper alloy sputtering target is formed by a copper alloy including the content of Ca being 0.3 to 1.7% by mass, the total content of Mg and Al being 5 ppm or less by mass, the content of oxygen being 20 ppm or less by mass, and the remainder is Cu and inevitable impurities. A manufacturing method of a copper alloy sputtering target comprises steps of: preparing a copper having purity of 99.99% or more by mass; melting the copper so as to obtain a molten copper; controlling components so as to obtain a molten metal having a predetermined component composition by the addition of Ca having a purity of 98.5% or more by mass into the molten copper and by melting the Ca; casting the molten metal so as to obtain an ingot; and performing stress relieving annealing after performing hot rolling to the ingot.

Abstract translation: 通过铜合金形成铜合金溅射靶，其中Ca含量为0.3〜1.7质量％，Mg和Al的总含量为5ppm以下，氧含量为20ppm以下 ，其余为Cu和不可避免的杂质。 铜合金溅射靶的制造方法包括以下步骤：制备纯度为99.99质量％以上的铜; 熔化铜以获得熔融铜; 通过向熔融铜中添加纯度为98.5质量％以上的Ca，通过熔融Ca，得到具有规定成分组成的熔融金属， 铸造熔融金属以获得锭; 并且在对所述锭进行热轧之后执行减压退火。

公开(公告)号：US10062552B2

公开(公告)日：2018-08-28

申请号：US14333812

申请日：2014-07-17

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Satoru Mori ,  Toshio Sakamoto ,  Kiyoyuki Ookubo

IPC: H01J37/34 ,  C23C14/34 ,  B22D7/00 ,  B22D11/108 ,  B22D11/00 ,  C22C1/02 ,  C22C9/00 ,  C22F1/08

CPC classification number: H01J37/3429 ,  B22D7/005 ,  B22D11/004 ,  B22D11/108 ,  C22C1/02 ,  C22C9/00 ,  C22F1/08 ,  C23C14/3414 ,  H01J37/3491

Abstract: A copper alloy sputtering target is formed by a copper alloy including the content of Ca being 0.3 to 1.7% by mass, the total content of Mg and Al being 5 ppm or less by mass, the content of oxygen being 20 ppm or less by mass, and the remainder is Cu and inevitable impurities. A manufacturing method of a copper alloy sputtering target comprises steps of: preparing a copper having purity of 99.99% or more by mass; melting the copper so as to obtain a molten copper; controlling components so as to obtain a molten metal having a predetermined component composition by the addition of Ca having a purity of 98.5% or more by mass into the molten copper and by melting the Ca; casting the molten metal so as to obtain an ingot; and performing stress relieving annealing after performing hot rolling to the ingot.

公开(公告)号：US10584400B2

公开(公告)日：2020-03-10

申请号：US14890116

申请日：2014-05-22

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Yasuhiro Tsugawa ,  Toshio Sakamoto

IPC: C22C9/06 ,  B22D11/00 ,  C22C9/02 ,  C22F1/08 ,  B22D21/00

Abstract: This copper alloy wire is a copper alloy wire which is made of a precipitation hardening-type copper alloy containing Co, P, and Sn and is manufactured using a continuous cast-rolling method or cold working of a continuous cast wire rod manufactured using a continuous casting method, in which the copper alloy wire has a composition including Co: more than or equal to 0.20 mass % and less than or equal to 0.35 mass %, P: more than 0.095 mass % and less than or equal to 0.15 mass %, and Sn: more than or equal to 0.01 mass % and less than or equal to 0.5 mass % with a balance being Cu and inevitable impurities.

公开(公告)号：US09518320B2

公开(公告)日：2016-12-13

申请号：US14470074

申请日：2014-08-27

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Satoru Mori ,  Toshio Sakamoto ,  Kiyoyuki Ookubo

IPC: C23C14/34 ,  C22C9/00 ,  H01J37/34 ,  C22C1/04

CPC classification number: C23C14/3414 ,  C22C1/0425 ,  C22C9/00 ,  H01J37/3426

Abstract: A copper alloy sputtering target is made of a copper alloy having a composition containing Ca in a range of 0.3 mass % to 1.7 mass % with a remainder of Cu and inevitable impurities, a Ca-segregated phase (10) in which Ca is segregated is dispersed in a matrix phase, and the Ca-segregated phase contains a Cu-dispersed phase (11) made of Cu.

Abstract translation: 铜合金溅射靶由Ca合金组成，其中Ca含量为0.3质量％至1.7质量％的Ca，其余为Cu和不可避免的杂质，Ca分离的Ca分离相（10）为 分散在基质相中，Ca分离相含有由Cu构成的Cu分散相（11）。

公开(公告)号：US10770274B2

公开(公告)日：2020-09-08

申请号：US15480733

申请日：2017-04-06

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Satoru Mori ,  Toshio Sakamoto ,  Kiyoyuki Ookubo

IPC: C23C14/34 ,  B22D7/00 ,  B22D11/108 ,  C22C1/02 ,  C22C9/00 ,  C22F1/08 ,  H01J37/34 ,  B22D11/00

Abstract: A copper alloy sputtering target is formed by a copper alloy including the content of Ca being 0.3 to 1.7% by mass, the total content of Mg and Al being 5 ppm or less by mass, the content of oxygen being 20 ppm or less by mass, and the remainder is Cu and inevitable impurities. A manufacturing method of a copper alloy sputtering target comprises steps of: preparing a copper having purity of 99.99% or more by mass; melting the copper so as to obtain a molten copper; controlling components so as to obtain a molten metal having a predetermined component composition by the addition of Ca having a purity of 98.5% or more by mass into the molten copper and by melting theCa; casting the molten metal so as to obtain an ingot; and performing stress relieving annealing after performing hot rolling to the ingot.

公开(公告)号：US10544495B2

公开(公告)日：2020-01-28

申请号：US15500806

申请日：2015-09-14

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Shoichiro Yano ,  Toshio Sakamoto

IPC: C22F1/08 ,  B22D11/059 ,  C22C9/00

Abstract: A casting mold material of the present invention includes, as a composition: 0.3 mass % to less than 0.5 mass % of Cr, 0.01 mass % to 0.15 mass % of Zr, and a balance consisting of Cu and inevitable impurities, and the casting mold material has acicular precipitates or plate-like precipitates containing Cr.

公开(公告)号：US20190144974A1

公开(公告)日：2019-05-16

申请号：US16099555

申请日：2017-06-23

Applicant: MITSUBISHI MATERIALS CORPORATION ,  Mitsubishi Shindoh Co., Ltd.

Inventor： Yuusuke Enami ,  Toshio Sakamoto ,  Hitoshi Nakamoto ,  Keiichiro Oishi ,  Atsushi Sugahara ,  Chikara Yamashita ,  Takuya Ohara

IPC: C22C9/06 ,  B22D11/00 ,  C22F1/08 ,  H01B1/02 ,  B21C1/02

Abstract: A copper alloy has a composition including 0.05 mass % or more and 0.70 mass % or less of Co; 0.02 mass % or more and 0.20 mass % or less of P; 0.005 mass % or more and 0.70 mass % or less of Sn, one or more of B, Cr, and Zr; and furthermore, a Cu balance containing inevitable impurities, wherein X, Y, and Z satisfy the following Expression (1): 1≤(X/5)+(Y/50)+(Z/100) and Expression (2): X+Y+Z≤1,000, in case where an amount of B is represented by X (massppm), an amount of Cr is represented by Y (massppm), and an amount of Zr is represented by Z (massppm).

公开(公告)号：US20170213711A1

公开(公告)日：2017-07-27

申请号：US15480733

申请日：2017-04-06

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Satoru Mori ,  Toshio Sakamoto ,  Kiyoyuki Ookubo

IPC: H01J37/34 ,  C22C9/00 ,  B22D11/108 ,  C22F1/08 ,  B22D11/00 ,  C23C14/34 ,  B22D7/00

CPC classification number: H01J37/3429 ,  B22D7/005 ,  B22D11/004 ,  B22D11/108 ,  C22C1/02 ,  C22C9/00 ,  C22F1/08 ,  C23C14/3414 ,  H01J37/3491

Abstract: A copper alloy sputtering target is formed by a copper alloy including the content of Ca being 0.3 to 1.7% by mass, the total content of Mg and Al being 5 ppm or less by mass, the content of oxygen being 20 ppm or less by mass, and the remainder is Cu and inevitable impurities. A manufacturing method of a copper alloy sputtering target comprises steps of: preparing a copper having purity of 99.99% or more by mass; melting the copper so as to obtain a molten copper; controlling components so as to obtain a molten metal having a predetermined component composition by the addition of Ca having a purity of 98.5% or more by mass into the molten copper and by melting theCa; casting the molten metal so as to obtain an ingot; and performing stress relieving annealing after performing hot rolling to the ingot.

公开(公告)号：US20150060269A1

公开(公告)日：2015-03-05

申请号：US14470074

申请日：2014-08-27

Applicant: MITSUBISHI MATERIALS CORPORATION

Inventor： Satoru Mori ,  Toshio Sakamoto ,  Kiyoyuki Ookubo

IPC: C23C14/34 ,  C22C9/00

CPC classification number: C23C14/3414 ,  C22C1/0425 ,  C22C9/00 ,  H01J37/3426

Abstract: A copper alloy sputtering target is made of a copper alloy having a composition containing Ca in a range of 0.3 mass % to 1.7 mass % with a remainder of Cu and inevitable impurities, a Ca-segregated phase (10) in which Ca is segregated is dispersed in a matrix phase, and the Ca-segregated phase contains a Cu-dispersed phase (11) made of Cu.

Abstract translation: 铜合金溅射靶由Ca合金组成，其中Ca含量为0.3质量％至1.7质量％的Ca，其余为Cu和不可避免的杂质，Ca分离的Ca分离相（10）为 分散在基质相中，Ca分离相含有由Cu构成的Cu分散相（11）。